“The Future of Image Sensors,” An Embedded Vision Summit Expert Panel Discussion

Shung Chieh, Co-founder and Vice President of Engineering at Solidspac3, moderates the “Future of Image Sensors” Expert Panel at the September 2020 Embedded Vision Summit. Other panelists include Sandor Barna, Vice President of Hardware at Aurora; Boyd Fowler, Chief Technology Officer at OmniVision; Sundar Ramamurthy, Group Vice President and General Manager at Applied Materials; and Ryad Benosman, Professor at the University of Pittsburgh Medical Center, Carnegie Mellon University and Sorbonne Universitas.

Image sensors, coupled with artificial intelligence, are increasingly being used as the “eyes” of machines. This is creating tremendous new opportunities for image sensors — while also radically transforming what system and application developers need from image sensors. In this panel discussion, a diverse set of experts shares their perspectives on the future of image sensors. The panel explores trends such as integrating processors on the same die with sensors; ultra-low-power sensors; and new image sensing approaches, including event-based and neuromorphic sensing, new techniques for optical depth sensing, and hyperspectral imaging.

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.



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