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The Advanced Packaging Industry: Geopolitics is Moving the Pieces On the Chessboard
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. New plants, emerging outsourced semiconductor assembly and test (OSAT), and new consortia
Allegro DVT Launches The Industry’s First Real-time VVC/H.266 Encoder IP
Grenoble – July 16 – Allegro DVT, the leading provider of video encoding and decoding semiconductor IP solutions, today announced the availability of its E320 video encoder IP which supports the latest VVC/H.266 codec. Versatile Video
Upcoming Webinar Shows How Cameras Can Meet Specific Customer Requirements
On Tuesday, July 30, 2024 at 6:30 am PT (9:30 am ET), Alliance Member company IDS Imaging Development Systems will deliver the free webinar “Unique Requirements, Unique Solutions.” From the event page: When standard cameras
Steering a Revolution: Optimized Automated Driving with Heterogeneous Compute
This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm Qualcomm Technologies’ latest whitepaper navigates the advantages of Snapdragon Ride Solutions based on heterogeneous compute SoCs. As
Roboshuttles: A Promising Yet Challenging Mobility Solution
Roboshuttles are small, fully electric, and operate at Level 4 autonomy, making them an ideal last-mile solution. They were once highly anticipated in the autonomous driving industry as a promising mobility solution, and at one
Develop Generative AI-powered Visual AI Agents for the Edge
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. An exciting breakthrough in AI technology—Vision Language Models (VLMs)—offers a more dynamic and flexible method for video
Generative AI 2024 – Impact on Processors, Memory, Advanced Packaging and Substrates
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Deep dive in supply chain and its bottleneck and resilience. Which company
Semiconductor Technologies are Evolving to Meet Generative AI Demand
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Power and processor-hungry AI set to drive next stage of chip development
Free Webinar Explores Processor Evaluation and Selection
On August 22, 2024 at 9 am PT (noon ET), Phil Lapsley, Co-Founder and Vice President of BDTI, will present the free hour webinar “Silicon Slip-Ups: The Ten Most Common Errors Processor Suppliers Make (Number
News
Allegro DVT Launches The Industry’s First Real-time VVC/H.266 Encoder IP
Grenoble – July 16 – Allegro DVT, the leading provider of video encoding and decoding semiconductor IP solutions, today announced the availability of its E320 video encoder IP which supports the latest VVC/H.266 codec. Versatile Video Coding (VVC) is the latest video compression standard being developed by the Joint Video Experts Team (JVET), a partnership between
Upcoming Webinar Shows How Cameras Can Meet Specific Customer Requirements
On Tuesday, July 30, 2024 at 6:30 am PT (9:30 am ET), Alliance Member company IDS Imaging Development Systems will deliver the free webinar “Unique Requirements, Unique Solutions.” From the event page: When standard cameras are not suitable for an application, tailor-made models with individual designs, board electronics or connector configurations are often developed to
Free Webinar Explores Processor Evaluation and Selection
On August 22, 2024 at 9 am PT (noon ET), Phil Lapsley, Co-Founder and Vice President of BDTI, will present the free hour webinar “Silicon Slip-Ups: The Ten Most Common Errors Processor Suppliers Make (Number Four Will Amaze You!),” organized by the Edge AI and Vision Alliance. Here’s the description, from the event registration page:
Market Analysis
The Advanced Packaging Industry: Geopolitics is Moving the Pieces On the Chessboard
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. New plants, emerging outsourced semiconductor assembly and test (OSAT), and new consortia are changing the dynamics of the supply chain. OUTLINE The advanced packaging (AP) market is expected to have a CAGR23-29
Roboshuttles: A Promising Yet Challenging Mobility Solution
Roboshuttles are small, fully electric, and operate at Level 4 autonomy, making them an ideal last-mile solution. They were once highly anticipated in the autonomous driving industry as a promising mobility solution, and at one point, over 25 companies were competing in this space. However, IDTechEx has observed a yearly decline in the number of
Generative AI 2024 – Impact on Processors, Memory, Advanced Packaging and Substrates
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Deep dive in supply chain and its bottleneck and resilience. Which company takes benefits of generative AI and who is missing? Datacenter GPU and AI ASIC revenue could reach $156B by 2025,
Blog
Steering a Revolution: Optimized Automated Driving with Heterogeneous Compute
This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm Qualcomm Technologies’ latest whitepaper navigates the advantages of Snapdragon Ride Solutions based on heterogeneous compute SoCs. As the automotive industry continues to progress toward automated driving, advanced driver assistance systems (ADAS) are in high demand. These systems
Develop Generative AI-powered Visual AI Agents for the Edge
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. An exciting breakthrough in AI technology—Vision Language Models (VLMs)—offers a more dynamic and flexible method for video analysis. VLMs enable users to interact with image and video input using natural language, making the technology more accessible and
What’s Next in On-device Generative AI?
This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Upcoming generative AI trends and Qualcomm Technologies’ role in enabling the next wave of innovation on-device The generative artificial intelligence (AI) era has begun. Generative AI innovations continue at a rapid pace and are being woven into
