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Upcoming Webinar Explores Real-time AI Sensor Fusion
On December 17, 2025, at 9:00 am PST (6:00 am EST), Alliance Member companies e-con Systems, Lattice Semiconductor, and NVIDIA
The Benefits of System-in-Package
This blog post was originally published at Efinix’s website. It is reprinted here with the permission of Efinix. In the
Automotive radar industry: China’s acceleration and the next wave of sensing
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the
The End of Point-to-Point Security: Why AI Agents Exceed the Single Pane of Glass
This blog post was originally published at Camio’s website. It is reprinted here with the permission of Camio. AI is
Enabling Autonomous Machines: Advancing 3D Sensor Fusion With Au-Zone
This blog post was originally published at NXP Semiconductors’ website. It is reprinted here with the permission of NXP Semiconductors. Smarter
Cadence Welcomes ChipStack
This article was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. ChipStack, a leading
Humanoid robots 2025: The race to useful intelligence
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the
The Role of Edge Computing in Video Intelligence
This blog post was originally published at Network Optix’ website. It is reprinted here with the permission of Network Optix. In
AI at the Edge: Low Power, High Stakes
Palo Alto – November 3, 2025 – Woodside Capital Partners (WCP) is pleased to release our Digital Advertising Quarterly Sector Update
News
Upcoming Webinar Explores Real-time AI Sensor Fusion
On December 17, 2025, at 9:00 am PST (6:00 am EST), Alliance Member companies e-con Systems, Lattice Semiconductor, and NVIDIA will deliver a joint webinar “Real-Time AI Sensor Fusion with e-con Systems’ Holoscan Camera Solutions using Lattice FPGA for NVIDIA Jetson Thor Platform.” From the event page: Join an exclusive webinar hosted by e-con Systems®,
Cadence Welcomes ChipStack
This article was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. ChipStack, a leading startup providing agentic AI solutions for chip verification, and Cadence have announced an agreement for ChipStack to join the agentic AI team at Cadence. Founded by technologists with deep expertise in both AI and semiconductor
Microchip Technology Unveils Model Context Protocol (MCP) Server to Power AI-Driven Product Data Access
Server enables access to trusted product information across AI platforms to simplify workflows, accelerate design and boost productivity CHANDLER, Ariz., November 6, 2025 — Further demonstrating its commitment to developing AI-enabled solutions for embedded engineers, Microchip Technology (Nasdaq: MCHP) has announced the launch of its Model Context Protocol (MCP) Server. An AI interface, the MCP Server connects directly with
Market Analysis
Automotive radar industry: China’s acceleration and the next wave of sensing
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. With volumes rising and semiconductor innovation accelerating, Yole Group delivers a dual analysis on automotive radar technology, market dynamics, and chipset design. Key Takeaways 166 million radar modules shipped globally in 2024;
Humanoid robots 2025: The race to useful intelligence
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. AI, dexterity, and cost reduction are converging to bring humanoids from prototypes to real-world deployment. Key Takeaways The global humanoid robot market will grow to US$51 billion by 2035. Three adoption waves have
AI at the Edge: Low Power, High Stakes
Palo Alto – November 3, 2025 – Woodside Capital Partners (WCP) is pleased to release our Digital Advertising Quarterly Sector Update for Q3 2025, authored by senior bankers Alain Bismuth and George Jones. Introduction: Intelligence on the Edge Edge AI isn’t just a buzzword – it’s fast becoming the next battleground in silicon. As billions of sensors and devices
Blog
The Benefits of System-in-Package
This blog post was originally published at Efinix’s website. It is reprinted here with the permission of Efinix. In the rapidly evolving world of microelectronics, there is a relentless push to reduce size and power consumption while increasing compute capability and throughput. Smart edge devices, the internet of things and now Edge AI have only
The End of Point-to-Point Security: Why AI Agents Exceed the Single Pane of Glass
This blog post was originally published at Camio’s website. It is reprinted here with the permission of Camio. AI is transforming security from a cost center into decision infrastructure. 1. Why the Old Security Model Reached Its Limits How the Single Pane of Glass Hit a Ceiling For decades, the security industry chased an elusive “single
Enabling Autonomous Machines: Advancing 3D Sensor Fusion With Au-Zone
This blog post was originally published at NXP Semiconductors’ website. It is reprinted here with the permission of NXP Semiconductors. Smarter Perception at the Edge Dusty construction sites. Fog-covered fields. Crowded warehouses. Heavy rain. Uneven terrain. What does it take for an autonomous machine to perceive and navigate challenging real-world environments like these – reliably, in
