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Join e-con Systems at NVIDIA GTC 2024

Experience our Cutting-Edge Camera Solutions at Booth 341! e-con Systems is attending NVIDIA GTC 2024, a premier global AI event, from March 18-21, 2024, at the San Jose Convention Center! Drop by Booth 341 to

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News

e-con Systems

Join e-con Systems at NVIDIA GTC 2024

Experience our Cutting-Edge Camera Solutions at Booth 341! e-con Systems is attending NVIDIA GTC 2024, a premier global AI event, from March 18-21, 2024, at the San Jose Convention Center! Drop by Booth 341 to see firsthand how e-con Systems™, a reputed NVIDIA’s Elite partner, leads the way in providing top-tier cameras for the NVIDIA

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e-con Systems

e-con Systems launches New Rugged PoE HDR Camera with Cloud-based Device Management for Superior Outdoor Imaging

California & Chennai (Feb 28, 2024): e-con Systems™, a global leader in embedded vision solutions, introduces a new IP67-rated HDR PoE camera—RouteCAM_CU22, the powerful addition to its high performance Ethernet camera series for tough outdoor conditions. Equipped with the Sony® STARVIS™ 2 IMX662 sensor and superior HDR capability, this Full HD Power over Ethernet (PoE)

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Intel

Intel Launches Altera, Its New Standalone FPGA Company

Altera prioritizes customers with end-to-end FPGAs, accessible AI, software and supply resilience. What’s New: Today, Intel announced the official launch of Altera, its new standalone FPGA company. During the FPGA Vision Webcast, Chief Executive Officer Sandra Rivera and Chief Operating Officer Shannon Poulin unveiled their strategy to secure leadership across a $55 billion-plus market opportunity;

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Market Analysis

Market Analysis

How did Apple Emerge as a Leader? Primarily Through Its iPhone Series

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Gain an in-depth understanding of the technical decisions made by Apple over the past nine years. OUTLINE What’s new? Retained most of the cameras from the 14 Pro Max but with a

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Market Analysis

Advanced Semiconductor Packaging Trends in AI and HPC

Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of artificial intelligence (AI) and high-performance computing (HPC) chip innovation. The “Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications” report recently published by IDTechEx explores the evolving landscape

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Automotive

Tesla Adopts Radar for Interior Monitoring

With the shift towards electric vehicles, end-users are becoming less concerned about traditional differentiators like engine horsepower and are placing greater emphasis on smart interior functions. This trend is compelling automotive OEMs to invest more efforts in enhancing interior features, thereby adding greater value to their products and distinguishing them from other vehicles. Driven by

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Blog

Blog Posts

Discover the Future of Vision AI at NVIDIA GTC24

Join Us for an Extraordinary Week of Inspiration The highly anticipated return of the in-person NVIDIA GTC experience is here! From March 18-21, 2024, join us in San Jose, CA for a week filled with groundbreaking discoveries and transformative insights. Get ready for an extraordinary event that will redefine your understanding of what’s possible. Keynote

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Algorithms

5 Generative AI Use Cases Impacting Our Lives

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Generative AI has unlocked the power of AI, and the potential is unlimited Since the introduction of ChatGPT in November 2022, the world has become enamored with the potential for artificial intelligence (AI). ChatGPT ushered in the

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Algorithms

Detecting Real-time Waste Contamination Using Edge Computing and Video Analytics

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. The past few decades have witnessed a surge in rates of waste generation, closely linked to economic development and urbanization. This escalation in waste production poses substantial challenges for governments worldwide in terms of efficient processing and

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