Market Analysis

Greater China MEMS Industry On the Rise: Consumer Leads the Way

Market Analysis, Sensors and Cameras, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. In its latest analysis, Yole Group examines how the Greater Chinese MEMS ecosystem is expanding across the consumer, automotive, industrial, medical, defense, and telecom markets, with continued growth driven by strong local […]

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AI Drives the Wheel: How Computing Power is Reshaping the Automotive Industry

Automotive, Market Analysis, Memory, Processors, Sensors and Cameras, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. In its new report, Automotive Computing and AI 2025, Yole Group analyzes the technological and market forces redefining vehicle intelligence, safety, and connectivity. The automotive industry is accelerating into a new era

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Two-Phase Liquid Cooling: The Future of High-end GPUs

Market Analysis, Processors /

As of 2025, single-phase direct-to-chip (D2C) liquid cooling remains the dominant solution for high-end GPU thermal management. However, with thermal design power (TDP) continuing to rise, the industry is approaching the limits of what single-phase cooling can handle. Two-phase D2C cooling is expected to enter large-scale deployment around 2027. IDTechEx has conducted extensive interviews across

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AI-enhanced In-cabin Sensing Systems

Automotive, Emotion Discernment, Face Detection, Face Recognition, Gesture Control, Market Analysis, Object Identification, Object Tracking, Sensors and Cameras /

As the trend of vehicle intelligence enhancement rises, in-cabin sensing systems will be largely responsible for increased communication, sensitivity, and smart features within cars. IDTechEx‘s report, “In-Cabin Sensing 2025-2035: Technologies, Opportunities, and Markets“, provides the latest technology developments within the sector, along with forecasts for their uptake over the next ten years. Where AI meets

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The Chiplet Calculus: Navigating the Integration Crisis at the Hardware.AD Frontier

Market Analysis, Memory, Processors /

A Tale of Two Cultures It is the best of times and the worst of times. The quest for fully autonomous vehicles (AVs) is increasingly a problem of hardware—but at a systems level, it’s a multi-faceted engineering challenge. The AD (Automated Driving) Europe 2025 conference in Berlin tackled this issue head-on this week. Far from

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Artificial Intelligence (AI) As the Semiconductor Growth Engine: AI White Paper Volume 1 – Memory & Computing

Market Analysis, Memory, Processors, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group Launches its First AI White Paper. KEY TAKEAWAYS Compute at the limit: Training and inference workloads now demand gigawatts of electricity, raising urgent questions on sustainability, cost, and infrastructure capacity.

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Generative AI Reshapes the Global Processor Market, Driving Unprecedented Growth

Market Analysis, Processors, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Semiconductor Tour on 10/8 at 11:00 AM, in parallel to Semicon West- Invited speakers: NVIDIA, Intel, Lam Research. Register today! KEY TAKEAWAYS The processor market is projected to reach $554 billion by

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Edge AI Hangs on Power: Can Chipmakers Meet Up?

Market Analysis, Memory, Processors, Sensors and Cameras, STMicroelectronics /

Power semiconductors will define how well and how quickly the global economy adopts Edge AI and benefit from its promises. That’s why the race is stiffening among chipmakers to offer the most innovative power management components and systems. Who is winning? What’s at stake: The stakes for power semiconductor makers in the Edge AI market

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Thermal Interface Materials: The Critical Heat-Transfer Frontier in Advanced Semiconductor Packaging

Market Analysis, Memory, Processors /

The next generation of Thermal Interface Materials (TIMs) offer the opportunity to gain a quantum leap in thermal efficiency, reliability, and market growth. IDTechEx research finds the market size of next-generation TIM1 and TIM1.5 for advanced semiconductor packaging will exceed at a CAGR of 31% from 2026 to 2036. In this new article, IDTechEx Senior Technology

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IDTechEx Technology Innovations Outlook 2026-2036

Market Analysis, Memory, Processors /

This collection of in-depth articles from IDTechEx industry experts examines some of the most important technology innovation trends set to transform global industries over the next decade. It provides both a clear assessment of today’s landscape and a forward-looking outlook through to 2036, helping businesses, investors, and policymakers prepare for opportunities and challenges ahead. This

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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