Market Analysis

MEMS Market: From Commodity Sensors to Hot Investment Sector

Source: Yole Group (EE Times Europe, 2025). In a bold move, STMicroelectronics is betting nearly $1 billion on tiny sensors. The European chipmaker’s recent deal to acquire NXP Semiconductors’ MEMS sensor business for $950 million is turning heads. After all, the Micro Electromechanical Systems (MEMS) market has long been seen as mature – even a […]

MEMS Market: From Commodity Sensors to Hot Investment Sector Read More +

“Technology and Market Trends in CMOS Image Sensors,” an Interview with the Yole Group

Florian Domengie, Principal Technology and Market Analyst for Imaging at the Yole Group, talks with Shung Chieh, Senior Vice President at Eikon Systems (an Eikon Therapeutics business unit) for the “Technology and Market Trends in CMOS Image Sensors” interview at the May 2025 Embedded Vision Summit. Shung Chieh, who has… “Technology and Market Trends in

“Technology and Market Trends in CMOS Image Sensors,” an Interview with the Yole Group Read More +

Infineon Technologies, NXP, and STMicroelectronics Face Rising Competition in $132 Billion Automotive Semiconductor Race

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group’s Automotive Semiconductor Trends 2025 report maps the competitive shifts in semiconductors reshaping the future of automotive electronics. KEY TAKEAWAYS Top five players hold roughly 50% of the automotive semiconductor market,

Infineon Technologies, NXP, and STMicroelectronics Face Rising Competition in $132 Billion Automotive Semiconductor Race Read More +

“A New Era of 3D Sensing: Transforming Industries and Creating Opportunities,” a Presentation from the Yole Group

Florian Domengie, Principal Technology and Market Analyst for Imaging at the Yole Group, presents the “A New Era of 3D Sensing: Transforming Industries and Creating Opportunities” tutorial at the May 2025 Embedded Vision Summit. The 3D sensing market is projected to more than double by 2030, surpassing $18B. Key drivers… “A New Era of 3D

“A New Era of 3D Sensing: Transforming Industries and Creating Opportunities,” a Presentation from the Yole Group Read More +

Advanced Packaging Fuels Transformation in Back-end Equipment: TCB and Hybrid Bonding to Lead $1.3 Billion Market Expansion by 2030

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group releases the first edition of its Status of the Back-End Equipment Industry Report, offering a strategic outlook on the semiconductor market. KEY TAKEAWAYS 2025-2030 period: The global back-end equipment market

Advanced Packaging Fuels Transformation in Back-end Equipment: TCB and Hybrid Bonding to Lead $1.3 Billion Market Expansion by 2030 Read More +

XR Tech Market Report

Woodside Capital Partners (WCP) is pleased to share its XR Tech Market Report, authored by senior bankers Alain Bismuth and Rudy Burger, and by analyst Alex Bonilla. Why we are interested in the XR Ecosystem Investors have been pouring billions of dollars into developing enabling technologies for augmented reality (AR) glasses aimed at the consumer market,

XR Tech Market Report Read More +

The Chiplet Consolidation Wave: How Strategic Acquisitions are Shaping the Future of Silicon

The Disaggregation of the Monolith: A New Paradigm Forged by AI’s Demands The semiconductor industry is navigating its most significant architectural shift in decades, a transition compelled by the relentless demands of Generative AI. The monolithic System-on-Chip (SoC), the reigning paradigm for half a century, is fracturing under the weight of exponentially growing AI models

The Chiplet Consolidation Wave: How Strategic Acquisitions are Shaping the Future of Silicon Read More +

Data Center Semiconductor Trends 2025: Artificial Intelligence Reshapes Compute and Memory Markets

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group publishes its new report, Data Center Semiconductor Trends 2025, offering an in-depth analysis of how AI, HPC, and hyperscaler demand are driving a new semiconductor paradigm. KEY TAKEAWAYS A $500

Data Center Semiconductor Trends 2025: Artificial Intelligence Reshapes Compute and Memory Markets Read More +

Humanoids, AI Chips, and Autonomy in the Future of Robotics

Humanoids, AI Chips, and Autonomy. Co-habiting or working alongside robots with humanlike capabilities may no longer be a thing of science-fiction. Assembling car parts or doing the weekly shop may be smart tasks for collaborative robots, while robotaxis boast the independence possible with the latest developments in vehicle autonomy. IDTechEx‘s research into Robotics & Autonomy

Humanoids, AI Chips, and Autonomy in the Future of Robotics Read More +

Is End-to-end the Endgame for Level 4 Autonomy?

Examples of modular, end-to-end, and hybrid software architectures deployed in autonomous vehicles. Autonomous vehicle technology has evolved significantly over the past year. The two market leaders, Waymo and Apollo Go, both have fleets of over 1,000 vehicles and operate in multiple cities, and a mix of large companies such as Nvidia and Aptiv, OEMs such

Is End-to-end the Endgame for Level 4 Autonomy? Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
Scroll to Top