Mauricio Greene of Bolom demonstrates real-time Sound Classification running on the Cadence Tensilica HiFi 5 DSP at the Embedded Vision Summit. Bolom Acoustic Intelligence edge models identify hundreds of distinct sound events and soundscape scenes – such as sirens, alarms, horns, traffic and more, fully on-device and without relying on the cloud. The Tensilica HiFi […]
Bolom Sound Classification on Cadence Tensilica HiFi 5 Read More +
At the 2026 Embedded Vision Summit, Boston AI CEO Peter Winston explores the latest advances shaping the future of AI. From intelligent agents to next-generation edge applications, he highlights how AI is evolving beyond task automation to become a more capable and collaborative partner within organizations. The video concludes with a look at emerging trends
Pulling Back the Curtain on a Smarter, More Connected AI Future Read More +
This content was originally published at HTEC’s website. It is reprinted here with the permission of HTEC. Physical AI at the Edge: Building the Full Stack for Real-World Deployment For years, AI progress was measured by model benchmark scores. The real test is different: does it work when deployed in a vehicle, a factory, a
On July 9-10, 2026 at 11:00 am PDT (2:00 pm EDT), NXP partner ITTIA will present the online workshop “Building Data-Centric SDV Systems on NXP S32 Automotive Processing Platform.” Workshop sessions will also be hosted for Europe attendees June 29-30, 2026 at 3:00 pm CET, and for Asia attendees July 7-9, 2026 at 9:00 am
Upcoming Workshop on Data-centric Software-defined Vehicle Systems Read More +
As AI moves into vehicles, appliances and industrial systems, the next challenge is scaling physical intelligence safely, reliably and in real-world conditions This article was originally published at HCLTech’s website. It is reprinted here with the permission of HCL Tech. Key takeaways Physical AI is reaching an inflection point as intelligence moves into real-world systems
Engineering Intelligence at the Physical Edge Read More +
NEWBURGH, Ind. — In recognition of National Forklift Safety Day, Matrix Design Group LLC, a wholly owned subsidiary of Alliance Resource Partners, L.P. (NASDAQ: ALRP), and Hyundai Material Handling are highlighting a partnership focused on reducing warehouse collisions caused by blind spots, congested aisles and limited operator reaction time. Through HiVision® powered by OmniPro®, Hyundai
Matrix Design Group and Hyundai Material Handling Announce Technology Partnership Read More +
What’s New: NXP Semiconductors today announced the SAF8444, a new automotive radar system-on-chip (SoC) featuring an innovative RF design that enables high-performance, power-efficient applications. The solution helps reduce overall system costs by simplifying thermal management for customers and enabling easier vehicle integration. These advantages make it particularly attractive for adoption in electric vehicle (EV) platforms.
Saideep Tiku, Principal System Architect at Micron presents “Roads to Robots: How Generative AI Is Redefining Memory and Storage for Embodied AI” at the May 2026 Embedded Vision Summit. Generative AI has accelerated the automation of complex digital tasks, and now multimodal perception and reasoning make embodied AI the next… “Roads to Robots: How Generative
This blog post was originally published at HTEC’s website. It is reprinted here with the permission of HTEC. The story of EV adoption contains a warning that semiconductor companies would be wise to take seriously. When the automotive industry made the leap from combustion engines to electric drivetrains, it discovered that a transformative technology is not enough on its own. The
This blog post was originally published at Helbling’s website. It is reprinted here with the permission of Helbling. Artificial Intelligence is one of the defining technological trends of this decade. In particular, vision-based AI applications, where camera data is processed directly on the edge, are gaining rapid momentum. Embedded Vision systems are the backbone of these
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