This article was originally published at HCLTech’s website. It is reprinted here with the permission of HCL Tech. Autonomous manufacturing can be achieved through a structured journey built on foundational engineering, converged data and human-led AI Key takeaways Autonomous manufacturing is the natural evolution of automation, engineering and AI. It is already here in parts, […]
News Summary: T-Mobile pilots NVIDIA RTX PRO 6000 Blackwell Server Edition AI infrastructure to demonstrate physical AI applications at the edge, complementing the AI-RAN Innovation Center’s distributed network Physical AI developers including Fogsphere, LinkerVision, Levatas, Vaidio and Siemens Energy are building reasoning and vision AI agents to the edge using the NVIDIA Metropolis Blueprint for
Noida, India, February 20, 2026 — HCLTech, a leading global technology company, today unveiled VisionX 2.0, an upgraded version of its multi-modal AI edge platform. This platform delivers real-time intelligence, enhanced safety and operational efficiency at scale for mission-critical industrial environments. VisionX 2.0 builds on HCLTech’s award-winning Intelligent Secure Edge capabilities, integrating advanced computer vision, vision language
HCLTech unveils VisionX 2.0, a next-gen multi-modal AI Edge Platform with NVIDIA Read More +
LONDON and NOIDA, India, Jan 19 2026 — HCLTech, a leading global technology company, today announced that it has been recognized by Ericsson as the ‘Innovation Award’ winner in the 2025 Ericsson Supplier Awards. The award has been given in recognition of HCLTech’s contribution to enhancing Ericsson’s operational efficiency through AI-driven capabilities and automation. HCLTech was selected
HCLTech Recognized as the ‘Innovation Award’ Winner of the 2025 Ericsson Supplier Awards Read More +
This blog post was originally published at HCLTech’s website. It is reprinted here with the permission of HCLTech. Key takeaways AI, mobility and cloud are the growth engines: They’re pushing chips toward a $1 trillion market by 2030 and forcing fabs to invest in sub-3nm nodes and advanced packaging Chips are bigger and more complex: Larger dies and
How Semiconductor Equipment Makers Will Drive the Next $1 Trillion Wave Read More +
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596
