Software

“Accelerating Deep Learning Models on AMD Adaptive SoCs with the AMD Vitis AI Workflow,” a Presentation from AMD

Thomas Zerbs, Technical Marketing Engineer, Adaptive and Embedded Computing Group at AMD presents “Accelerating Deep Learning Models on AMD Adaptive SoCs with the AMD Vitis AI Workflow” at the May 2026 Embedded Vision Summit. In this presentation, we provide a practical end-to-end overview of the AMD Vitis™ AI workflow for… “Accelerating Deep Learning Models on

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“Accelerating Physical AI with ROCm: High-Performance ML on AMD Embedded iGPUs,” a Presentation from AMD

Alok Gupta, Senior Technical Marketing Manager at AMD presents “Accelerating Physical AI with ROCm: High-Performance ML on AMD Embedded iGPUs” at the May 2026 Embedded Vision Summit. Discover how AMD’s ROCm software stack unlocks data center-class ML performance on embedded integrated GPUs, enabling diverse AI workloads from CNNs and transformers… “Accelerating Physical AI with ROCm:

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“Edge-First Coding Agents: Trustworthy Agentic Development for Real Devices,” a Presentation from Ambarella

Pietro Antonio Cicalese, Senior Technical Marketing Engineer at Ambarella, presents “Edge-First Coding Agents: Trustworthy Agentic Development for Real Devices” at the May 2026 Embedded Vision Summit. Coding agents are usually built as cloud-first abstractions. But for developing trustworthy, production-ready edge systems, we’ve found that coding agents should be designed from… “Edge-First Coding Agents: Trustworthy Agentic

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Scaling Edge AI for the Enterprise: Building the Ultimate Multi-Model, Multi-Stream Security System

This blog post was originally published at Axelera AI’s website. It is reprinted here with the permission of Axelera AI. At a Glance The Achievement: Real-time AI person-of-interest (POI) identification and threat detection across multiple 8K streams at 2.5 PetaOPS The Stack: Voyager SDK + Axelera Metis + Intel Xeon The Future: 3x performance leap with

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AMD’s Embedded Computing Summit Comes to London and Eindhoven

On June 16, 2026 in London, and on June 18, 2026 in Eindhoven, the AMD “Embedded Computing Summit Global Technical Tour” comes to Europe. From the event page: Where Embedded Innocation Meets Technical Depth The Embedded Computing Summit (ECS) Global Technical Tour is the premier in-person technical event series from AMD, bringing together engineers, architects,

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Upcoming Webinar on Building Your First Real-World AI Tool

On May 21, 2026, at 1:00 pm EDT (10:00 am PDT) Boston.AI will deliver a webinar “What It Takes to Build Your First Real-World AI Tool” From the event page: Most AI talks focus on what’s possible. This one shows how to actually use AI in product development, even if you’re just getting started. In

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AMD Silo AI and University of Bologna Start Spatial AI Collaboration for Robotics and Autonomous Driving

The research collaboration will focus on building geometry-aware perception modules on the AMD ROCm™ open software stack AMD Silo AI and University of Bologna through its Department of Computer Science and Engineering (DISI) are starting a research collaboration to bring explicit 3D geometry into the Vision Language Action (VLA) and world-model pipeline for robotics and

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The Next Frontier in AI Is Not Just Reasoning. It Is Knowing When to Look Again

Why AI Metacognition Requires Hierarchical Random-access Data   This blog post was originally published at V-Nova’s website. It is reprinted here with the permission of V-Nova. Executive Summary (TL;DR) Today’s AI systems can reason impressively, but they still struggle to know when to look again. Humans use metacognition as a feedback loop between thought and perception:

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Upcoming Event on AI Transformation

KOTRA Silicon Valley will host “Physical AI Superconnect 2026,” on June 24, 2026, from 10:00 am to 8:00 pm PDT at the Computer History Museum in Mountain View, California. The event will feature insightful presentations, technology exhibits, matchmaking and networking. From the event page: ​M.AX: A New Era of Manufacturing AI Transformation ​​Physical AI Superconnect

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
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