Thomas Zerbs, Technical Marketing Engineer, Adaptive and Embedded Computing Group at AMD presents “Accelerating Deep Learning Models on AMD Adaptive SoCs with the AMD Vitis AI Workflow” at the May 2026 Embedded Vision Summit. In this presentation, we provide a practical end-to-end overview of the AMD Vitis™ AI workflow for… “Accelerating Deep Learning Models on […]
Alok Gupta, Senior Technical Marketing Manager at AMD presents “Accelerating Physical AI with ROCm: High-Performance ML on AMD Embedded iGPUs” at the May 2026 Embedded Vision Summit. Discover how AMD’s ROCm software stack unlocks data center-class ML performance on embedded integrated GPUs, enabling diverse AI workloads from CNNs and transformers… “Accelerating Physical AI with ROCm:
On June 16, 2026 in London, and on June 18, 2026 in Eindhoven, the AMD “Embedded Computing Summit Global Technical Tour” comes to Europe. From the event page: Where Embedded Innocation Meets Technical Depth The Embedded Computing Summit (ECS) Global Technical Tour is the premier in-person technical event series from AMD, bringing together engineers, architects,
AMD’s Embedded Computing Summit Comes to London and Eindhoven Read More +
The research collaboration will focus on building geometry-aware perception modules on the AMD ROCm™ open software stack AMD Silo AI and University of Bologna through its Department of Computer Science and Engineering (DISI) are starting a research collaboration to bring explicit 3D geometry into the Vision Language Action (VLA) and world-model pipeline for robotics and
This blog post was originally published at AMD’s website. It is reprinted here with the permission of AMD. This blog showcases how to deploy power-efficient Ryzen AI perception models with ROS 2 – the Robot Operating System. We utilize the Ryzen AI Max+ 395 (Strix-Halo) platform, which is equipped with an efficient Ryzen AI NPU and
Building Robotics Applications with Ryzen AI and ROS 2 Read More +
Key Takeaways: New AMD Ryzen™ AI Embedded P100 and X100 Series processors combine high-performance “Zen 5” CPU cores, an AMD RDNA™ 3.5 GPU and an AMD XDNA™ 2 NPU for low-power AI acceleration Delivers energy-efficient, low-latency AI on a single chip for immersive in-vehicle experiences, industrial automation and physical AI for autonomous systems Launching today,
This blog post was originally published at AMD’s website. It is reprinted here with the permission of AMD. News Snapshot: Expanding space-grade adaptive system-on-chip (SoC) portfolio and qualifying advanced new space-grade, organic lidless packaging technology designed to endure the most demanding conditions of space. AMD is qualifying this enhanced space grade packaging for the Versal™ AI Core
Somewhat eclipsed by last week’s announcement that the AMD Spartan™ UltraScale+™ FPGA SCU35 Evaluation Kit is now available, AMD and Infineon have disclosed successful validation of Infineon’s 64-Mb HYPERRAM™ memory and HYPERRAM controller IP on the platform. This collaboration expands the kit’s value for engineers building edge AI and computer vision systems. The SCU35 kit,
November 25, 2025 The AMD Spartan™ UltraScale+™ FPGA SCU35 Evaluation Kit is now available for order. Built by AMD, this platform offers customers an accelerated path to production with Spartan UltraScale+ FPGAs. The kit features the Spartan UltraScale+ SU35P device that offers I/O expansion and board management capabilities. It also brings several new advances to
The Disaggregation of the Monolith: A New Paradigm Forged by AI’s Demands The semiconductor industry is navigating its most significant architectural shift in decades, a transition compelled by the relentless demands of Generative AI. The monolithic System-on-Chip (SoC), the reigning paradigm for half a century, is fracturing under the weight of exponentially growing AI models
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