AMD

Real-Time Vision-Language Inference on AMD Radeon™ iGPU Using ROCm™

This demonstration showcases a real-time vision-language inference pipeline running on an AMD Radeon™ integrated GPU, highlighting multimodal AI capabilities on power-efficient embedded platforms. The system processes live or recorded video streams and enables interactive question answering based on visual scene understanding. A lightweight Vision-Language Model (VLM) is deployed to jointly interpret visual inputs and natural […]

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AMD Versal™ AI Edge Series Gen 2​Hard ISP Featuring 12x Sensor Inputs

This demo showcases the AMD Versal™ AI Edge Series Gen 2 VEK385 evaluation board’s ability to support streaming raw video data from 12 different CMOS image sensors concurrently and process 14 live streams out through the hardened ISP blocks in a single 2VE3858 adaptive SoC. It features a mix of sensors with different resolutions and

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AI Agents on AMD – Secure Agent Computing at the Edge

See how agentic AI workflows can use both local AMD hardware and cloud resources to improve privacy, performance, and cost efficiency. This demo showcases AI agents running with the AMD ROCm™ software platform. Private and data-sensitive tasks can remain on the local system, while more demanding workloads can be sent to cloud-based models when needed.

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“Accelerating Deep Learning Models on AMD Adaptive SoCs with the AMD Vitis AI Workflow,” a Presentation from AMD

Thomas Zerbs, Technical Marketing Engineer, Adaptive and Embedded Computing Group at AMD presents “Accelerating Deep Learning Models on AMD Adaptive SoCs with the AMD Vitis AI Workflow” at the May 2026 Embedded Vision Summit. In this presentation, we provide a practical end-to-end overview of the AMD Vitis™ AI workflow for… “Accelerating Deep Learning Models on

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“Accelerating Physical AI with ROCm: High-Performance ML on AMD Embedded iGPUs,” a Presentation from AMD

Alok Gupta, Senior Technical Marketing Manager at AMD presents “Accelerating Physical AI with ROCm: High-Performance ML on AMD Embedded iGPUs” at the May 2026 Embedded Vision Summit. Discover how AMD’s ROCm software stack unlocks data center-class ML performance on embedded integrated GPUs, enabling diverse AI workloads from CNNs and transformers… “Accelerating Physical AI with ROCm:

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AMD’s Embedded Computing Summit Comes to London and Eindhoven

On June 16, 2026 in London, and on June 18, 2026 in Eindhoven, the AMD “Embedded Computing Summit Global Technical Tour” comes to Europe. From the event page: Where Embedded Innocation Meets Technical Depth The Embedded Computing Summit (ECS) Global Technical Tour is the premier in-person technical event series from AMD, bringing together engineers, architects,

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AMD Silo AI and University of Bologna Start Spatial AI Collaboration for Robotics and Autonomous Driving

The research collaboration will focus on building geometry-aware perception modules on the AMD ROCm™ open software stack AMD Silo AI and University of Bologna through its Department of Computer Science and Engineering (DISI) are starting a research collaboration to bring explicit 3D geometry into the Vision Language Action (VLA) and world-model pipeline for robotics and

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Building Robotics Applications with Ryzen AI and ROS 2

This blog post was originally published at AMD’s website. It is reprinted here with the permission of AMD. This blog showcases how to deploy power-efficient Ryzen AI perception models with ROS 2 – the Robot Operating System. We utilize the Ryzen AI Max+ 395 (Strix-Halo) platform, which is equipped with an efficient Ryzen AI NPU and

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AMD Introduces Ryzen AI Embedded Processor Portfolio, Powering AI-Driven Immersive Experiences in Automotive, Industrial and Physical AI

Key Takeaways: New AMD Ryzen™ AI Embedded P100 and X100 Series processors combine high-performance “Zen 5” CPU cores, an AMD RDNA™ 3.5 GPU and an AMD XDNA™ 2 NPU for low-power AI acceleration Delivers energy-efficient, low-latency AI on a single chip for immersive in-vehicle experiences, industrial automation and physical AI for autonomous systems Launching today,

AMD Introduces Ryzen AI Embedded Processor Portfolio, Powering AI-Driven Immersive Experiences in Automotive, Industrial and Physical AI Read More +

AMD Expands Space-Grade Portfolio, Enhances In-Orbit Processing Capability and Extends Mission Timelines

This blog post was originally published at AMD’s website. It is reprinted here with the permission of AMD. News Snapshot: Expanding space-grade adaptive system-on-chip (SoC) portfolio and qualifying advanced new space-grade, organic lidless packaging technology designed to endure the most demanding conditions of space. AMD is qualifying this enhanced space grade packaging for the Versal™ AI Core

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PO Box #4446
Walnut Creek, CA 94596

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