On October 8, 2026 at 9 am PT (noon ET), Peter Labaziewicz, Business & Strategy Executive, and Tom Mayo, Product Manager for Radar, at D3 Embedded, will present the free hour webinar “How Multimodal Sensing Enables Physical AI: Combining Intelligent Imaging and mmWave Radar,” organized by the Edge AI and Vision Alliance. Here’s the description, […]
Free Webinar on How Multimodal Sensing Enables Physical AI Read More +
On August 19, 2026 at 9:00 am PT (12:00 pm ET), e-con Systems will present the webinar “The Robotic Vision Decisions that are Hardest to Undo & What to Get Right in 2026.” A session will also be hosted for Europe attendees August 20, 2026 at 11:00 am CET. Here’s the description, from the event
Upcoming Workshop on Building Robotic Vision Systems Read More +
Perforated AI has released an enhanced version of ResNet-18 designed to approach the accuracy of larger vision models without imposing a comparable increase in model size or computational cost. The pretrained model is now available for evaluation and transfer learning on Hugging Face. The company’s technology adds artificial dendrites—additional computational structures inspired by biological neurons—to
Perforated AI Releases Enhanced ResNet-18 Model on Hugging Face Read More +
Assessing tire defects is another use case in the market for neuromorphic AI chip solutions LAGUNA HILLS, CA, UNITED STATES, August 13, 2026 /EINPresswire.com/ — A global leader in ultra-low power, fully digital, event-based neuromorphic AI, today announced a partnership with Atlanta-based Orama.AOI, which has retrained and optimized BrainChip’s Akida models using its industrial inspection
BrainChip Partners With Orama.AOI For AI-Fueled Defect Detection Read More +
On September 10, 2026 at 9:00 am PT (12:00 ET), SPIE will present the webinar “SPIE AR, VR, MR monthly Fireside Chat with FlexEnable.” Here’s the description, from the event registration page: Each month, hosts Bernard Kress from Google, Christophe Peroz from Google Zurich, and Grace Lee from Mojo Vision interview key leaders to explore
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h3>Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems while lowering power, cost and integration complexity CHANDLER, Ariz., August 11, 2026 — The shift toward compact, high‑performance edge AI systems is redefining sensor connectivity, pushing developers to deliver power‑ and space‑efficient architectures that remain secure, scalable and future‑ready. To address these challenges, Microchip
Open commercial licensing, benchmark‑leading reasoning and inspectable decisions bring autonomous vehicles, including robotaxis, closer to production and widescale deployment. This news blog was originally published at NVIDIA’ website. It is reprinted here with the permission of NVIDIA. For robotaxis and other autonomous vehicles (AVs), the hardest problems aren’t the everyday scenarios. They’re the rare, complex situations that
Intel has released OpenVINO 2026.3, updating its open-source AI inference toolkit with broader model support, new generative AI pipelines, memory-efficiency improvements and expanded hardware compatibility. The release adds support for SmolLM3-3B, LFM2-1.2B and LFM2.5-1.2B across Intel CPUs, GPUs and NPUs. Additional models supported on CPUs and GPUs include Harrier OSS-v1-0.6B, Qwen3-8B with EAGLE-3, MiniCPM5-1B and
Intel Releases OpenVINO 2026.3 with Expanded Generative AI and Model Support Read More +
Yole Group has released Automotive Semiconductor Trends 2026, a new market report examining how electrification, advanced driver-assistance systems, centralized computing and software-defined vehicle architectures are reshaping the automotive semiconductor industry. Yole forecasts that the market will more than double from $77 billion in 2025 to $160 billion in 2031, representing a compound annual growth rate
Yole Group Forecasts Automotive Semiconductor Market Will Double to $160 Billion by 2031 Read More +
Hsinchu, Taiwan – August 3, 2026 – Andes Technology, a leading supplier of high-performance, low-power 32/64-bit RISC-V processor cores and AI acceleration solutions, and a Founding Premier member of RISC-V International, proudly announces a major, synchronized evolutionary leap in its AI portfolio: the launch of the AndesAIRE™ AnDLA™ I370 v2.0 Deep Learning Accelerator IP and the
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