Yole Group

The Advanced Packaging Industry: Geopolitics is Moving the Pieces On the Chessboard

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. New plants, emerging outsourced semiconductor assembly and test (OSAT), and new consortia are changing the dynamics of the supply chain. OUTLINE The advanced packaging (AP) market is expected to have a CAGR23-29 […]

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Generative AI 2024 – Impact on Processors, Memory, Advanced Packaging and Substrates

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Deep dive in supply chain and its bottleneck and resilience. Which company takes benefits of generative AI and who is missing? Datacenter GPU and AI ASIC revenue could reach $156B by 2025,

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Semiconductor Technologies are Evolving to Meet Generative AI Demand

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Power and processor-hungry AI set to drive next stage of chip development – Generative artificial intelligence (AI) is redefining the value of work, and its exponential need for performance is driving demand

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The Semiconductor Foundry Industry: Negotiating Troubled Waters

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. While the semiconductor foundry industry is facing many challenges, it is on track to have a 5.4% CAGR until 2029. OUTLINE Semiconductor device industry is growing at a 5.4% CAGR , mainly

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Navigating the LiDAR Revolution: Trends and Innovations Ahead

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. There are today two distinct LiDAR markets: China and the rest of the world. In China, approximately 128 car models equipped with LiDAR are expected to be released by Chinese OEMs in

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High-end Packaging: Breaking Performance Barriers?

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The current AI/HPC demand has brought high-end performance packaging to the spotlight. OUTLINE The high-end packaging market is projected to exceed US$28 billion by 2029, with a CAGR 23-29 of 37%. TSMC

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Sony is Set to Capture 50% of the CMOS Image Sensor Market

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Sony is advancing in the CMOS Image Sensor (CIS) industry, driven by innovations in performance, integrability, and new sensing capabilities. OUTLINE The CIS market is projected to grow from US$21.8 billion in

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Automotive AI and Computing: Advanced Vehicle Features Fuel Innovation

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. New players are entering the automotive market through different routes as vehicle features are evolving. The evolution of new automotive features away from the core expertise areas of traditional OEMs is creating

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Is the MEMS Industry Back On Track?

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. New applications, Chinese players bridging gaps, piezoMEMS projects, 300mm manufacturing confirmed… The MEMS industry is blossoming again! OUTLINE The MEMS market is expected to reach US$20 billion in 2029, with an estimated

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