Memory

The Advanced Packaging Industry: Geopolitics is Moving the Pieces On the Chessboard

Market Analysis, Memory, Processors, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. New plants, emerging outsourced semiconductor assembly and test (OSAT), and new consortia are changing the dynamics of the supply chain. OUTLINE The advanced packaging (AP) market is expected to have a CAGR23-29 […]

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Generative AI 2024 – Impact on Processors, Memory, Advanced Packaging and Substrates

Market Analysis, Memory, Processors, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Deep dive in supply chain and its bottleneck and resilience. Which company takes benefits of generative AI and who is missing? Datacenter GPU and AI ASIC revenue could reach $156B by 2025,

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Semiconductor Technologies are Evolving to Meet Generative AI Demand

Market Analysis, Memory, Processors, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Power and processor-hungry AI set to drive next stage of chip development – Generative artificial intelligence (AI) is redefining the value of work, and its exponential need for performance is driving demand

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The Semiconductor Foundry Industry: Negotiating Troubled Waters

Market Analysis, Memory, Processors, Sensors and Cameras, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. While the semiconductor foundry industry is facing many challenges, it is on track to have a 5.4% CAGR until 2029. OUTLINE Semiconductor device industry is growing at a 5.4% CAGR , mainly

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High-end Packaging: Breaking Performance Barriers?

Market Analysis, Memory, Processors, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The current AI/HPC demand has brought high-end performance packaging to the spotlight. OUTLINE The high-end packaging market is projected to exceed US$28 billion by 2029, with a CAGR 23-29 of 37%. TSMC

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AI Startups Continue Breaking Records with $33 Billion Raised in H1, the Highest Figure in the Market’s History

Market Analysis, Memory, Processors, Software, Tools /

Contrary to some predictions of a slowdown in AI funding for 2024, the reality is quite the opposite. AI startups are not just breaking records; they are doing so at an accelerated pace, with more money raised than ever before. According to data presented by Stocklytics.com, AI startups have achieved an unprecedented feat, raising a

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“Deploying Large Language Models on a Raspberry Pi,” a Presentation from Useful Sensors

Algorithms, Memory, Processors, Software, Summit 2024, Tools, Useful Sensors, Videos /

Pete Warden, CEO of Useful Sensors, presents the “Deploying Large Language Models on a Raspberry Pi,” tutorial at the May 2024 Embedded Vision Summit. In this presentation, Warden outlines the key steps required to implement a large language model (LLM) on a Raspberry Pi. He begins by outlining the motivations… “Deploying Large Language Models on

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“The Importance of Memory for Breaking the Edge AI Performance Bottleneck,” a Presentation from Micron Technology

Memory, Micron Technology, Summit 2024, Videos /

Wil Florentino, Senior Marketing Manager for Industrial/IIoT at Micron Technology, presents the “Importance of Memory for Breaking the Edge AI Performance Bottleneck” tutorial at the May 2024 Embedded Vision Summit. In recent years there’s been tremendous focus on designing next-generation AI chipsets to improve neural network inference performance. As higher… “The Importance of Memory for

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Can Ceva Ignite the Yet-to-explode TinyML Market?

Algorithms, Market Analysis, Memory, Processors, Sensors and Cameras, Software, Tools /

The IoT market is yet to see an “explosive growth” in TinyML. Is that due to inadequate hardware, ever-shifting software or not enough ML skills in the embedded community? What’s at stake: TinyML in embedded systems can be implemented many ways, often by leveraging beefed-up MCUs, DSPs, AI accelerators and Neural Processing Units (NPUs). The

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“Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs,” a Presentation from Lattice Semiconductor and Etron Technology America

Lattice Semiconductor, Memory, Processors, Summit 2024, Videos /

Hussein Osman, Segment Marketing Director at Lattice Semiconductor, and Richard Crisp, Vice President and Chief Scientist at Etron Technology America, co-presents the “Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs” tutorial at the May 2024 Embedded Vision Summit. Attaining the lowest power,… “Squeezing the Last Milliwatt and

“Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs,” a Presentation from Lattice Semiconductor and Etron Technology America Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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