Memory

Scalable FPGA Prototyping for AI SoCs: Handling Massive Parallelism and Bandwidth

Blog Posts, Memory, Processors, Tessolve /

This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. Creating an AI System-on-Chip (SoC) today resembles conducting a thousand musicians playing different melodies at once; each note, or data stream, must align perfectly. As AI workloads become increasingly complex, prototyping these SoCs on FPGA (Field Programmable […]

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The rise of smarter robots and why memory is becoming their superpower

Blog Posts, Memory, Micron Technology, Robotics /

This blog post was originally published at Micron Technology’s website. It is reprinted here with the permission of Micron Technology. If it feels like robots are evolving faster than ever, that’s because they are. We’re watching an industry shift in real time, from factory floors to warehouses to emerging humanoid systems, all powered by advances in

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Upcoming Webinar on Agentic Memory Systems

Algorithms & Models, Boston.AI, Memory, News /

On April 16, 2026, at 1:00 pm EDT (10:00 am PDT) Boston.AI will deliver a webinar “Remembering to Forget: Agentic Memory Systems and Context Constraints” From the event page: As AI agents evolve from stateless responders into persistent, goal-directed systems, memory has become a central design challenge. The question is no longer just what agents

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The Forest Listener: Where edge AI meets the wild

Blog Posts, Industrial Vision (Computer Vision), Memory, Micron Technology, STMicroelectronics /

This blog post was originally published at Micron’s website. It is reprinted here with the permission of Micron. Let’s first discuss the power of enabling. Enabling a wide electronic ecosystem is essential for fostering innovation, scalability and resilience across industries. By supporting diverse hardware, software and connectivity standards, organizations can accelerate product development, reduce costs and

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Why DRAM Prices Keep Rising in the Age of AI

Market Analysis, Memory, Yole Group /

This market analysis was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group.   As hyperscale data centers rewrite the rules of the memory market, shortages could persist until 2027. Strong server DRAM demand for AI data centers is driving memory prices higher throughout the market,

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When DRAM Becomes the Bottleneck (Again): What the 2026 Memory Squeeze Means for Edge AI

Articles, Memory, Micron Technology /

A funny thing is happening in the edge AI world: some of the most important product decisions you’ll make this year won’t be about TOPS, sensor resolution, or which transformer variant to deploy. They’ll be about memory—how much you can get, how much it costs, and whether you can ship the exact part you designed

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MemryX Unveils MX4 Roadmap: Enabling Distributed, Asynchronous Dataflow for Highly Efficient Data Center AI

Memory, MemryX, News /

ANN ARBOR, Mich., Dec. 26, 2025 (PRNewswire) — MemryX Inc., a company delivering production AI inference acceleration, today announced its strategic roadmap for the MX4. The next-generation accelerator is engineered to scale the company’s “at-memory” dataflow architecture from edge deployments into the data center, leveraging 3D hybrid-bonded memory to eliminate the industry’s most pressing bottleneck: the “memory wall.” MemryX is

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AMD Spartan UltraScale+ FPGA Kit Adds Proven Infineon HyperRAM Support for Edge AI Designs

AMD, Infineon, Memory, News, Processors /

Somewhat eclipsed by last week’s announcement that the AMD Spartan™ UltraScale+™ FPGA SCU35 Evaluation Kit is now available, AMD and Infineon have disclosed successful validation of Infineon’s 64-Mb HYPERRAM™ memory and HYPERRAM controller IP on the platform. This collaboration expands the kit’s value for engineers building edge AI and computer vision systems. The SCU35 kit,

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Micron Ships Automotive UFS 4.1, Designed to Unlock Intelligent Mobility With Speed, Safety and Reliability

Automotive, Memory, Micron Technology, News /

Architected to power AI workloads, Micron’s latest automotive solution, built with G9 NAND, equips the industry to create safer, smarter more connected driver experiences MUNICH, Nov. 13, 2025 (GLOBE NEWSWIRE) — Automotive Computing Conference — Micron Technology, Inc. (Nasdaq: MU), today announced shipping of qualification samples of its automotive universal flash storage (UFS) 4.1 solution to

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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