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NIST Advanced Packaging Summit

Semiconductor packaging can be incredibly boring. That said, advanced packaging is a key to every high-complexity semiconductor – both on and off the planet. Nvidia, AMD, and Intel have all utilized chiplets and advanced packages for their latest AI/ML accelerators and processors. Without 2.5D and 3D design and assembly techniques, these and many other essential […]

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Edge AI and Vision Alliance Conversation with GenAI Nerds on Generative AI At the Edge

Kerry Shih of GenAI Nerds interviews Jeff Bier, Founder of the Edge AI and Vision Alliance, and Phil Lapsley, the Alliance’s Vice President of Business Development, about the opportunities and trends for generative AI at the edge. Shih, Bier and Lapsley discuss topics such as: Where we are in the generative AI hype cycle What

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Micron’s Full Suite of Automotive-grade Solutions Qualified for Qualcomm Automotive Platforms to Power AI in Vehicles

Micron’s automotive memory and storage enable central compute, digital cockpit and advanced driver-assistance systems for Qualcomm customers NUREMBERG, Germany, April 10, 2024 (GLOBE NEWSWIRE) — Embedded World — Micron Technology, Inc. (Nasdaq: MU), today announced that it has qualified a full suite of its automotive-grade memory and storage solutions for Qualcomm Technologies Inc.’s Snapdragon® Digital Chassis™,

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What Changed From VCRs to Software-defined Vision?

The Edge AI and Vision Alliance’s Jeff Bier discusses how advances in embedded systems’ basic building blocks are fundamentally changing their nature. The Ojo-Yoshida Report is launching the second in our Dig Deeper video podcast series, this issue focusing on “Embedded Basics.” Our guest for the inaugural episode is Jeff Bier, founder, Edge AI and Embedded Vision

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Advantech to Showcase Industry-leading AIoT Solutions at Embedded World

Embedded World, April 9-11 2024, Hall 3, Booth 339 Taipei, Taiwan and Nuremberg, Germany, 2nd April 2024 — Advantech, a leading provider of AIoT platforms and services, today announced its participation at Embedded World 2024, a trade show taking place in Nuremberg April 9-11, 2024. Visitors will find Advantech’s 160 m2 booth in Hall 3,

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Where Nvidia’s Huang Went Wrong on Thomas Edison vs. AI

The tech industry’s self-congratulatory analogy of AI with electricity “is not absurd, but it’s too flawed to be useful,” says historian Peter Norton. What’s at stake: In Silicon Valley, power prevails. In the short run, if your business and technology have the power to make money, move the market, and change the rules, you won’t

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The Semiconductor Industry: Mobile and Consumer are Its Beating Heart

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. These market segments generated $296 billion in semiconductor revenue in 2023, with an expected CAGR2023-2030 of 2.1% OUTLINE Semiconductor content will remain stable at ~35% for the mobile and computing subsegments while

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AI Accelerators and HPC: Latest Innovations in the Advanced IC Substrates Market

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The demands and complex requirements of the semiconductor industry were a key driver, transformation enabler, and innovation-inducer of the advanced packaging industry, including the market of advanced IC substrates. While the advanced

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Micron Commences Volume Production of Industry-leading HBM3E Solution to Accelerate the Growth of AI

Micron HBM3E helps reduce data center operating costs by consuming about 30% less power than competing HBM3E offerings BOISE, Idaho, Feb. 26, 2024 (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq: MU), a global leader in memory and storage solutions, today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution. Micron’s 24GB 8H

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