This blog post was originally published at HTEC’s website. It is reprinted here with the permission of HTEC. The hardware boom is slowing down. What comes next is a software, power, and inference problem—and most of the industry isn’t ready for any of it. AI chips are now 0.2% of all chips manufactured, but […]
Key Trends Shaping the Semiconductor Industry in 2026 Read More +
This blog post was originally published at Infineon’s website. It is reprinted here with the permission of Infineon. Across home, retail, and industry, devices that once followed simple rules are now expected to understand people and context. A thermostat shouldn’t just follow a schedule; it should know if anyone is in the room and choose the preferred
From Connected to Aware: How PSOC™ Edge enables the next wave of smart devices Read More +
This blog post was originally published at AMD’s website. It is reprinted here with the permission of AMD. This blog showcases how to deploy power-efficient Ryzen AI perception models with ROS 2 – the Robot Operating System. We utilize the Ryzen AI Max+ 395 (Strix-Halo) platform, which is equipped with an efficient Ryzen AI NPU and
Building Robotics Applications with Ryzen AI and ROS 2 Read More +
This blog post was originally published at Axelera AI’s website. It is reprinted here with the permission of Axelera AI. A camera sees everything and understands nothing. For decades, that has been the fundamental limitation of physical security at scale: vast amounts of footage, limited ability to act on it in real time. The gap between
The Future of Security Is Already Running. Here Is What It Looks Like. Read More +
This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. The Gemmaverse expands with the launch of the latest Gemma 4 multimodal and multilingual models, designed to scale across the full spectrum of deployments, from NVIDIA Blackwell in the data center to Jetson at the edge. These models are suited
Bringing AI Closer to the Edge and On-Device with Gemma 4 Read More +
This blog post was originally published at Quadric’s website. It is reprinted here with the permission of Quadric. After years of cloud-centric inference, AI is moving to the edge. The “Goldilocks zone” of 3B to 30B parameter models is delivering GPT-4-class performance on smartphones, automotive systems, and industrial equipment — and creating an acute challenge for
The On-Device LLM Revolution: Why 3B-30B Models Are Moving to the Edge Read More +
This blog post was originally published at Samsung Semiconductor’s website. It is reprinted here with the permission of Samsung Semiconductor. Until recently, the evolution of mobile cameras has been centered on the image sensor and the image signal processor (ISP). In this conventional architecture, the image sensor converts light into electrical signals, while the ISP corrects
Inside the Intelligent Mobile Camera Powered by Exynos 2600 VPS Read More +
This blog post was originally published at Synaptics’ website. It is reprinted here with the permission of Synaptics. As the smart home market matures, consumers demand devices that are not just connected, but intelligent and interoperable. It can be a challenge to address their demands because original equipment manufacturers (OEMs) face regulatory changes affecting new security,
Smart Home Connectivity: Trends, Challenges and the Role of Next-Gen IoT Technology Read More +
This blog post was originally published at Synopsys’s website. It is reprinted here with the permission of Synopsys. With the semiconductor industry shifting from monolithic chip designs to multi-die architectures — which leverage chiplets for improved flexibility, scalability, and time to market — engineering teams are facing new hurdles and complexities. Beyond power, performance, and area (PPA), they
Accelerating Multi-Die Innovation: How Synopsys and Samsung are Shaping Chip Design Read More +
This article was originally published at Analog Devices’ website. It is reprinted here with the permission of Analog Devices. Artificial intelligence is entering a new phase where models interpret contextual data whilst interacting with the physical world in real time. At Analog Devices, Inc. (ADI), we call this Physical Intelligence: intelligent systems that can perceive, reason
2026: The Year Intelligence Gets Physical Read More +
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596
