Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica Vision P6 DSP for the latest generative AI (GenAI) applications. The Vision P6 DSP is a […]
Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica Vision Q7 DSP for Time-of-Flight (ToF) decoding. In this demonstration, the Tensilica Vision Q7 DSP integrated
Cadence Demonstration of Time-of-Flight Decoding on the Tensilica Vision Q7 DSP Read More +
Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica ConnX B10 DSP for automotive imaging radar applications. The ConnX B10 DSP is a highly efficient,
Cadence Demonstration of an Imaging Radar Applications on the Tensilica ConnX B10 DSP Read More +
Cadence verification and RTL-to-GDS digital full-flow tuned for automotive safety, quality and reliability requirements 18 Jun 2024 – At embedded world 2024, Cadence and Dream Chip demonstrated Dream Chip’s latest automotive SoC, which features the Cadence® Tensilica® Vision P6 DSP IP and Cadence design IP controllers and was taped out using the complete Cadence® Verification
Amol Borkar, Product Marketing Director at Cadence, presents the “Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors” tutorial at the May 2024 Embedded Vision Summit. From ADAS to autonomous vehicles to smartphones, the number and variety of sensors used in edge devices is increasing: radar, LiDAR, time-of-flight… “Addressing Tomorrow’s Sensor Fusion and
Highlights: Single DSPs for embedded vision, radar, lidar and AI processing boost performance while providing significant area, power and cost savings New radar accelerator provides a highly programmable hardware solution for offloading 4D imaging radar workloads, increasing performance Designed for sensor fusion processing in multi-sensor automotive, drone, robotics and autonomous vehicle system designs SAN JOSE,
This blog post was originally published at Arm’s website. It is reprinted here with the permission of Arm. AMBA is being extended to the chiplets market with the new CHI C2C specification. As Arm’s EVP and Chief Architect Richard Grisenthwaite said in this blog, Arm is collaborating across the ecosystem on standards to enable a
Ecosystem Collaboration Drives New AMBA Specification for Chiplets Read More +
This blog post was originally published at Arm’s website. It is reprinted here with the permission of Arm. Strategic collaboration accelerates Custom Silicon for evolving AI workloads As AI continues its rapid evolution, optimized silicon is crucial to unlock next-generation applications. Arm serves as a foundation for this innovation with its CPU, GPU and related
The Age of AI Demands Faster Chip Development: Only Arm and Cadence Deliver Read More +
This blog post was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. The Goal: Long Shelf Life Chips being designed today for the automotive, mobile handset, AI-IoT (artificial intelligence – Internet of things), and other AI applications will be fabricated in a year or two, designed into end products
Why a DSP is Indispensable in the New World of AI Read More +
AI enhancements and Tensilica Xtensa LX8 platform capabilities deliver significant performance improvements with industry-best energy efficiency 24 Oct 2023 — SAN JOSE, Calif.— Cadence Design Systems, Inc.(Nasdaq: CDNS) today expanded its industry-leading Tensilica® HiFi and Vision DSP families with the introduction of four new DSPs based on the recently announced Tensilica Xtensa® LX8 processor platform.
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
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