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Cadence

Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications

Highlights: Single DSPs for embedded vision, radar, lidar and AI processing boost performance while providing significant area, power and cost savings New radar accelerator provides a highly programmable hardware solution for offloading 4D imaging radar workloads, increasing performance Designed for sensor fusion processing in multi-sensor automotive, drone, robotics and autonomous vehicle system designs SAN JOSE, […]

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Ecosystem Collaboration Drives New AMBA Specification for Chiplets

This blog post was originally published at Arm’s website. It is reprinted here with the permission of Arm. AMBA is being extended to the chiplets market with the new CHI C2C specification. As Arm’s EVP and Chief Architect Richard Grisenthwaite said in this blog, Arm is collaborating across the ecosystem on standards to enable a

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The Age of AI Demands Faster Chip Development: Only Arm and Cadence Deliver

This blog post was originally published at Arm’s website. It is reprinted here with the permission of Arm. Strategic collaboration accelerates Custom Silicon for evolving AI workloads As AI continues its rapid evolution, optimized silicon is crucial to unlock next-generation applications. Arm serves as a foundation for this innovation with its CPU, GPU and related

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Why a DSP is Indispensable in the New World of AI

This blog post was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. The Goal: Long Shelf Life Chips being designed today for the automotive, mobile handset, AI-IoT (artificial intelligence – Internet of things), and other AI applications will be fabricated in a year or two, designed into end products

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Cadence Expands Tensilica IP Portfolio with New HiFi and Vision DSPs for Pervasive Intelligence and Edge AI Inference

AI enhancements and Tensilica Xtensa LX8 platform capabilities deliver significant performance improvements with industry-best energy efficiency 24 Oct 2023 — SAN JOSE, Calif.— Cadence Design Systems, Inc.(Nasdaq: CDNS) today expanded its industry-leading Tensilica® HiFi and Vision DSP families with the introduction of four new DSPs based on the recently announced Tensilica Xtensa® LX8 processor platform.

Cadence Expands Tensilica IP Portfolio with New HiFi and Vision DSPs for Pervasive Intelligence and Edge AI Inference Read More +

Cadence Demonstrations of Generative AI and People Tracking at the Edge

Amol Borkar, Director of Product and Marketing for Vision and AI DSPs at Cadence Tensilica, demonstrates the company’s latest edge AI and vision technologies and products at the September 2023 Edge AI and Vision Alliance Forum. Specifically, Borkar demonstrates two applications running on customers’ SoCs, showcasing Cadence’s pervasiveness in AI. The first demonstration is of

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Cadence Accelerates On-device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design

Highlights: Neo NPUs efficiently offload from any host processor and scale from 8 GOPS to 80 TOPS in a single core, extending to hundreds of TOPS for multicore AI IP delivers industry-leading AI performance and energy efficiency for optimal PPA and cost points Targets a broad range of on-device and edge applications, including intelligent sensors,

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Cadence Demonstration of Next-gen On-device and Edge AI Using a Tensilica Turnkey AI Accelerator Solution

Suhas Mitra, Director Product Management and Marketing at Cadence, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Mitra demonstrates Cadence’s Tensilica AI accelerator portfolio, specifically showcasing the company’s Tensilica NNA (Neural Network Accelerator) 110 IP. These IPs can significantly improve the performance of edge and

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Cadence Demonstration of In-vehicle Infotainment

Amol Borkar, Director of Product and Marketing for Vision and AI DSPs at Cadence Tensilica, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Borkar demonstrates an automotive in-vehicle infotainment system, implemented on a customer’s platform and featuring the Tensilica Vision DSP. Infotainment is an important

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Cadence Demonstration of Tensilica DSPs’ Vision and AI Capabilities for Industrial Products

David Bell, Product Marketing Director for Tensilica AI IP products at Cadence, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Bell demonstrates the vision and AI capabilities of Tensilica DSPs for industrial products, in the process also answering the question of whether a tomato is

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