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Airy3D and Lattice to Showcase Compact, Integrated Humanoid and Robotic 3D Vision Demo at Embedded World 2026

Montreal, Canada — March 4, 2026 — Airy3D today announced a joint demonstration with Lattice Semiconductor highlighting a compact and compute-efficient 3D vision solution for humanoids and advanced robotics, which will be on display at Embedded World 2026. The demo combines Airy3D’s DepthIQ™ technology with a compact, low-power Lattice CrossLink™-NX FPGA to enable high-quality depth […]

Airy3D and Lattice to Showcase Compact, Integrated Humanoid and Robotic 3D Vision Demo at Embedded World 2026 Read More +

Upcoming Webinar on LLM-driven Driver Development

On March 19, 2026, at 1:00 pm EDT (10:00 am PDT) Boston.AI will deliver a webinar “Intelligent Driver Development with LLM Context Engineering ” From the event page: Developing even simple sensor drivers can consume valuable engineering time, requiring manual transcription of registers from datasheets into code—an error-prone and repetitive process. In this webinar, you’ll

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10xEngineers and Andes Enable High-Performance AI Compilation for RISC-V AX46MPV Cores

Hsinchu, Taiwan – February 26, 2026 – The collaboration between 10xEngineers, a services company specializing in AI compilers, and Andes Technology Corporation, a leading provider of high-performance, low-power 32- and 64-bit RISC-V processor IP and a Founding Premier Member of RISC-V International, delivers first-class AI workload compilation for Andes AX46MPV cores using 10xEngineers’ AI graph compiler, Baltoro. This collaboration enables

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Chips&Media Accelerates WAVE-N Ecosystem: Redefining the Future of Next-Generation Customized NPUs

February 24, 2026, Seoul, — As a premier multimedia IP provider, Chips&Media is proud to announce the strategic expansion of the WAVE-N ecosystem – our next-generation customized NPU architecture. Key Objectives: Strategic Partnerships: Cultivating alliances with leading AI-based imaging network providers IP Integration: Merging our silicon-proven WAVE-N IP with pre-evaluated, high-performance AI networks Customer-Centric Innovation: Providing clients with access to

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Ambarella to Showcase “The Ambarella Edge: From Agentic to Physical AI” at Embedded World 2026

Enabling developers to build, integrate, and deploy edge AI solutions at scale SANTA CLARA, Calif., — Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced that it will exhibit at Embedded World 2026, taking place March 10-12 in Nuremberg, Germany. At the show, Ambarella’s theme, “The Ambarella Edge: From Agentic to Physical AI,”

Ambarella to Showcase “The Ambarella Edge: From Agentic to Physical AI” at Embedded World 2026 Read More +

Vision Components unveils all-in-one VC EvoCam with MediaTek processor

Ettlingen, February 18, 2026 — Vision Components is presenting the VCSBC EvoCam for the first time at embedded world, a new generation of all-in-one intelligent board-level cameras featuring the MediaTek Genio 510 processor. Measuring tiny 65 x 40 mm, the camera is equipped with all necessary components for image acquisition and image processing, making the

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e-con Systems Launches DepthVista Helix 3D CW iToF Camera for Robotics and Industrial Automation

California & Chennai (February 17, 2026): e-con Systems, a global leader in embedded vision solutions, launches DepthVista Helix 3D CW iToF Camera, a high-performance depth camera engineered to deliver reliable and accurate 3D perception for wide range of industrial robotics applications, including Autonomous Mobile Robots (AMRs), pick-and-place, bin-picking, palletization and depalletization robots, industrial safety and automation, and

e-con Systems Launches DepthVista Helix 3D CW iToF Camera for Robotics and Industrial Automation Read More +

Upcoming Webinar on CSI-2 over D-PHY & C-PHY

On February 24, 2026, at 9:00 am PST (12:00 pm EST) MIPI Alliance will deliver a webinar “MIPI CSI-2 over D-PHY & C-PHY: Advancing Imaging Conduit Solutions” From the event page: MIPI CSI-2®, together with MIPI D-PHY™ and C-PHY™ physical layers, form the foundation of image sensor solutions across a wide range of markets, including

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Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making

Chandler, Ariz., February 10, 2026 — A major next step for artificial intelligence (AI) and machine learning (ML) innovation is moving ML models from the cloud to the edge for real-time inferencing and decision-making applications in today’s industrial, automotive, data center and consumer Internet of Things (IoT) networks. Microchip Technology (Nasdaq: MCHP) has extended its edge AI offering

Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making Read More +

Upcoming Webinar on Industrial 3D Vision with iToF Technology

On February 18, 2026, at 9:00 am PST (12:00 pm EST), and on February 19, 2026 at 11:00 am CET, Alliance Member company e-con Systems in partnership with onsemi will deliver a webinar “Enabling Reliable Industrial 3D Vision with iToF Technology” From the event page: Join e-con Systems and onsemi for an exclusive joint webinar

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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