STMicroelectronics

NovaEyeD: Real-Time Face Recognition on ST’s STM32N6

See NovaEyeD in action — ModelNova™’s production-ready Edge AI face recognition model — demonstrated live at the STMicroelectronics booth during the 2026 Embedded Vision Summit. In this demo, we walk through how NovaEyeD delivers efficient, real-time face recognition directly on ST’s STM32N6 MCU, helping ST customers maximize the potential of their silicon. See what makes […]

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STMicroelectronics’ 3D direct ToF lidar module demo + Human detection application

Experience a live demonstration of the VL53L9CX, STMicroelectronics’ advanced 3D direct ToF lidar module, showcased at Embedded Vision. Delivering up to 2.3k zones and real-time streaming at up to 100 Hz, the system captures highly detailed depth data with strong accuracy from short range up to nearly 9 meters. This all-in-one module integrates SPAD sensing,

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STMicroelectronics Unveils New Compact Direct Time-of-Flight 3D LiDAR Module

Key Takeaways VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2.3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters. Designed to meet the evolving needs of customers and partners across diverse industries, including robotics,

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Upcoming Webinar to Introduce Industrial Robotics Reference Platform

On June 23, 2026, at 8:00 am PDT (11:00 am EDT / 17:00 CEST) STMicroelectronics, eInfochips and Arrow will deliver a webinar “A Prevalidated AMR Reference Platform for Faster Industrial Robotics Development” From the event page: STMicroelectronics and Arrow Electronics are introducing a new industrial autonomous mobile robot (AMR) reference platform built to help teams

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STMicroelectronics High-performance Vibration Sensor with In-sensor AI Offers a Compelling Alternative to Piezosensor to Fast-growing Industrial Condition-monitoring Market

Key Takeaways: Industrial-grade vibration sensor delivers unprecedented wide-bandwidth and dynamic range sensing Intelligent sensor processing unit (ISPU 2.0) inside the sensor boosts signal processing and edge AI performance while reducing energy consumption Provides the first compelling alternative to piezosensor for condition monitoring, combining performances, lightweight design, ease of integration, ultra-accuracy, and energy efficiency Jun 3,

STMicroelectronics High-performance Vibration Sensor with In-sensor AI Offers a Compelling Alternative to Piezosensor to Fast-growing Industrial Condition-monitoring Market Read More +

Physical AI: From ST Sensors to a Robotics Platform, How Innovation Can Only Happen Through Collaboration

This blog post was originally published at STMicroelectronics’s website. It is reprinted here with the permission of STMicroelectronics. As technology aims to enable Physical AI, ST is sharing today how collaboration brought our sensors into a Holoscan Sensor Bridge module from Leopard Imaging, enabling developers to feed multi-modal sensing data to the NVIDIA Jetson Thor or

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STMicroelectronics and Leopard Imaging Accelerate Robotics Vision with NVIDIA Jetson-ready Multi-sensor Module

Key Takeaways Multimodal module combining 2D imaging, 3D depth sensing, and human-like motion perception NVIDIA Holoscan Sensor Bridge ensuring multi-gigabit plug and play connectivity with Jetson platforms Fully supported by NVIDIA Isaac open robot development platform STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining

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HSP: The new hardware accelerator that transforms an ultra-low-power STM32U3 into an AI machine

This blog post was originally published at STMicroelectronics’s website. It is reprinted here with the permission of STMicroelectronics. ST is launching today its hardware signal processor (HSP), a new hardware unit that the industry will experience in more and more of our upcoming STM32 microcontrollers, starting today with our new STM32U3B5/C5 devices featuring 2 MB of flash. In a

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STM32U3B5/U3C5: Bringing High-Performance DSP & Edge AI to Ultralow Power Designs

Built on the Arm® Cortex®‑M33 core, the STM32U3B5/U3C5 MCUs combine up to 2 Mbytes of dual‑bank flash memory with 640 Kbytes of RAM and are available in packages from 48 to 144 pins (UFQFPN, WLCSP, LQFP, and UFBGA). The lines introduce a hardware signal processor (HSP) to the STM32U3 portfolio, offloading complex DSP and edge‑AI workloads and

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The Forest Listener: Where edge AI meets the wild

This blog post was originally published at Micron’s website. It is reprinted here with the permission of Micron. Let’s first discuss the power of enabling. Enabling a wide electronic ecosystem is essential for fostering innovation, scalability and resilience across industries. By supporting diverse hardware, software and connectivity standards, organizations can accelerate product development, reduce costs and

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

Contact

Address

Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

Phone
Phone: +1 (925) 954-1411
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