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Introducing the Electronics Industry’s First AI Agent with Visual Reasoning
This blog post was originally published at Rapidflare’s website. It is reprinted here with the permission of Rapidflare. AI has made
Renesas Announces General Availability of Renesas 365
NUREMBERG, Germany and TOKYO, Japan — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the
How to Ensure that High-tech Products Such as Smart Glasses are Brought to Market Quickly and Cost-effectively
This blog post was originally published at Helbling Technik’s website. It is reprinted here with the permission of Helbling Technik.
BrainChip Enables the Next Generation of Always-On Wearables with the AkidaTag Reference Platform
LAGUNA HILLS, Calif. — March 10, 2026 — BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of
ERGO: Efficient High-Resolution Visual Understanding for Vision-Language Models
This blog post was originally published at Nota AI’s website. It is reprinted here with the permission of Nota AI. Key
Edge Container Registries Explained: How to Distribute Images Reliably at Scale
This blog post was originally published at Avassa’s website. It is reprinted here with the permission of Avassa. A mostly
TI expands Microcontroller Portfolio and Software Ecosystem to Enable Edge AI in Every Device
New MCUs with the TinyEngine NPU join TI’s comprehensive portfolio of AI-enabled hardware, software and tools, allowing engineers to deploy
Arduino Announces Arduino VENTUNO Q, Powered by Qualcomm Dragonwing IQ8 Series
The new platform by the leading open-source hardware provider is purpose-built for generative AI, robotics, and actuation — making advanced
Intel Launches Core Series 2 Processor with Real-Time Performance and Expands Edge AI Portfolio
New industrial-ready platform delivers breakthrough deterministic performance; sixth Edge AI suite targets healthcare applications NUREMBERG, Germany — March 9,
News
Cadence and NVIDIA Unveil Accelerated Engineering Solutions Purpose-Built for Agentic AI Chip and System Design
New agentic integrated circuit (IC) and physical AI accelerated solutions enable engineers to solve previously impossible chip, system and AI factory challenges SAN JOSE, Calif.— Today, Cadence announced an expansion of its broad collaboration with NVIDIA to accelerate Cadence’s Design for AI and AI for Design strategy. The next generation of agentic AI design solutions includes autonomous,
STMicroelectronics and Leopard Imaging Accelerate Robotics Vision with NVIDIA Jetson-ready Multi-sensor Module
Key Takeaways Multimodal module combining 2D imaging, 3D depth sensing, and human-like motion perception NVIDIA Holoscan Sensor Bridge ensuring multi-gigabit plug and play connectivity with Jetson platforms Fully supported by NVIDIA Isaac open robot development platform STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining
NVIDIA, T-Mobile and Partners Integrate Physical AI Applications on AI-RAN-Ready Infrastructure
News Summary: T-Mobile pilots NVIDIA RTX PRO 6000 Blackwell Server Edition AI infrastructure to demonstrate physical AI applications at the edge, complementing the AI-RAN Innovation Center’s distributed network Physical AI developers including Fogsphere, LinkerVision, Levatas, Vaidio and Siemens Energy are building reasoning and vision AI agents to the edge using the NVIDIA Metropolis Blueprint for
Market Analysis
Semiconductor Industry 2025: Worldwide Dynamics and China’s Strategic Rise Unveiled
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The market research & strategy consulting company, Yole Group, delivers a dual perspective on global semiconductor dynamics and China’s fast-evolving industry landscape. Key Takeaways Global semiconductor device revenues are set to reach
Automotive Radar Industry: China’s Acceleration and the Next Wave of Sensing
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. With volumes rising and semiconductor innovation accelerating, Yole Group delivers a dual analysis on automotive radar technology, market dynamics, and chipset design. Key Takeaways 166 million radar modules shipped globally in 2024;
Humanoid Robots 2025: The Race to Useful Intelligence
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. AI, dexterity, and cost reduction are converging to bring humanoids from prototypes to real-world deployment. Key Takeaways The global humanoid robot market will grow to US$51 billion by 2035. Three adoption waves have
Blog
UCIe & Chiplets: A Practical Guide to Modular SoC Design
This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. The semiconductor industry is undergoing a paradigm shift. Traditional monolithic System-on-Chip (SoC) designs are giving way to modular architectures that leverage interoperable chiplets. At the heart of this evolution is Universal Chiplet Interconnect Express (UCIe). This open standard
HSP: The new hardware accelerator that transforms an ultra-low-power STM32U3 into an AI machine
This blog post was originally published at STMicroelectronics’s website. It is reprinted here with the permission of STMicroelectronics. ST is launching today its hardware signal processor (HSP), a new hardware unit that the industry will experience in more and more of our upcoming STM32 microcontrollers, starting today with our new STM32U3B5/C5 devices featuring 2 MB of flash. In a
AI at the Edge: Designing for Constraints from Day One
This blog post was originally published at ModelCat’s website. It is reprinted here with the permission of ModelCat. Artificial intelligence has never been more visible yet more misunderstood. Every week seems to bring new headlines about larger models, more parameters, and benchmark-breaking performance. For developers and product teams responsible for shipping real-world AI systems, that
