Tensilica CTO Chris Rowen to Discuss New Imaging and Vision Architecture at the Linley Tech Mobile Conference


SANTA CLARA, CA–(Marketwired – April 09, 2013)

Chris Rowen, CTO and Founder, Tensilica

Dr. Rowen will present "A New Imaging and Vision Architecture: Solving Grand Challenge Problems in Milliwatts" at the Linley Tech Mobile Conference. He will discuss the technical demands of key imaging, video and vision applications at the heart of next generation platforms, and introduce the Tensilica IVP architecture, built specifically for low-energy computation of advanced multi-frame image enhancement and object recognition at HD and UHD video rates.

The Linley Tech Mobile Conference is a two-day event delivering in-depth information from analysts and industry leaders on the newest trends driving the development of mobile silicon and systems.

Dr. Rowen will speak during Session 4: Mobile DSP on Thursday, April 18, from 9:30 a.m. – 12:00 p.m.

Hyatt Regency Hotel, Santa Clara, Calif.

Attendance is free to qualified attendees who register by April 11 at www.linleygroup.com/mobile-conference.

About Chris Rowen
Chris Rowen was a pioneer in the development of the RISC architecture at Stanford in the early 1980s and helped start MIPS in 1984, where he served as Vice President for Microprocessor Development. In 1996 he became Vice President and General Manager of Synopsys' Design Re-Use Group. He left Synopsys to start Tensilica because he had an idea for a unique processor architecture that was designed, from the beginning, to be easily and automatically configurable and extensible. He is currently the CTO of Tensilica, working on the most challenging uses of the technology. He received a B.A. in physics from Harvard University and an M.S. and Ph.D. in electrical engineering from Stanford University.

About Tensilica
Tensilica, Inc. is the leader in dataplane processor IP core licensing with over 200 licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

Paula Jones
(408) 327-7343
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Erika Powelson
(408) 781-4981
[email protected]

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