Cadence executives and partners to present and demonstrate the latest processors, IP and more.
SAN JOSE, Calif., Feb. 17, 2015 /PRNewswire/ —
WHO:
Cadence Design Systems, Inc. (NASDAQ:CDNS) is scheduled to demonstrate its latest advancements and solutions for mobile technology challenges, in collaboration with customers and partners, at Mobile World Congress (MWC) 2015. To sign up for a private demo or discussion at the show, email: [email protected].
WHEN:
March 2 – March 6, 2015
WHERE:
Visit Cadence at Mobile World Congress 2015, in Barcelona, Spain:
- Cadence® booth, Hall 6, Stand 6L36
WHAT:
- Visit Cadence's booth to see demonstrations of the industry's highest performance and most energy-efficient audio/voice digital signal processing (DSP) intellectual property (IP) cores for system-on-chip (SoC) designs. Visitors can see the Tensilica® HiFi Audio/Voice DSP IP cores as well as fully integrated IP sub-systems featuring Tensilica image/video processor DSP, automotive Ethernet IP, and IP for MIPI protocols.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
For more information, please contact:
Cadence Newsroom
(408) 944-7039
[email protected]
Cadence Design Systems, Inc.
Web Site: http://www.cadence.com
