Ethan Franz, Senior Software Engineer at Teledyne FLIR, demonstrates the company’s latest edge AI and vision technologies and products in Lattice Semiconductor’s booth at the 2025 Embedded Vision Summit. Specifically, Franz demonstrates a state-of-the-art thermal imaging camera for automotive safety applications, designed using Lattice FPGAs.
This next-generation camera, also incorporating Teledyne FLIR’s advanced sensing technology, supports high resolution thermal imaging, enabling longer detection ranges and more time to deploy automatic emergency braking to avoid collisions, saving lives and reducing repair costs. Thanks to Lattice FPGAs’ inherent low power consumption and industry-leading small packages, this generation of camera fits into a much smaller space, with higher ambient temperature limits and reduced cost vs previous generations. These attributes enable this critical safety technology to be incorporated into vehicles designed to meet emerging PAEB performance needs, which are dictated by regulations demanding increased AEB capabilities at higher speeds, and in more difficult environmental conditions.
