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Artificial Intelligence Engine in Qualcomm Snapdragon 855 Mobile Platform Powers On-Device AI User Experiences in Flagship Premium-Tier Smartphones

News, Qualcomm /

Qualcomm AI Software and Cloud Ecosystem Expands to Satisfy Increasing Demand for Intelligent and Immersive Real-time Mobile AI Features Feb 25, 2019 – Barcelona – At Mobile World Congress, Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), announced that the 4th Generation Qualcomm® Artificial Intelligence (AI) Engine is supporting the surge of on-device […]

Artificial Intelligence Engine in Qualcomm Snapdragon 855 Mobile Platform Powers On-Device AI User Experiences in Flagship Premium-Tier Smartphones Read More +

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Qualcomm Enables The Next Generation of Immersive Compute with Ecosystem Collaboration for XR Viewers for 5G Smartphones

News, Qualcomm /

Company and Top Mobile Ecosystem Players Come Together to Deliver XR Viewers Tethered to Compatible Qualcomm Snapdragon 855 Smartphones Feb 25, 2019 – Barcelona – Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM) announced today at Mobile World Congress, broad ecosystem support from world-leading OEMs, operators, and platform providers to deliver the next

Qualcomm Enables The Next Generation of Immersive Compute with Ecosystem Collaboration for XR Viewers for 5G Smartphones Read More +

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Featuring Infineon’s Time-of-Flight Technology, LG’s Smartphone G8ThinQ Securely Recognizes Your Face

Infineon, News /

Munich, Germany – 24 February 2019 – In a market where it is difficult for manufacturers to differentiate their products, the new 2019 LG G8 ThinQ is about to turn the tide. For the first time, a smartphone with a dedicated user-facing time-of-flight (ToF) camera is entering the mass market. Highly secure authentication for both

Featuring Infineon’s Time-of-Flight Technology, LG’s Smartphone G8ThinQ Securely Recognizes Your Face Read More +

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LG and Infineon to Introduce LG G8ThinQ with Front-facing Time-of-Flight Camera

Infineon, News /

With Infineon’s REAL3™ Image Sensor Chip, LG Offers Enhanced Security and Depth Measuring Selfie Camera Munich, Germany, and Seoul, Korea, 7 February 2019 – LG Electronics and Infineon Technologies AG have teamed up to introduce leading edge Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over. Infineon’s REAL3™ image sensor chip will play a

LG and Infineon to Introduce LG G8ThinQ with Front-facing Time-of-Flight Camera Read More +

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Xnor Appoints Mobile Computing Expert to Principal Engineer

News, Xnor.ai /

Matt Welsh will help guide development of Xnor’s AI-on-the-edge platform SEATTLE, Feb. 21, 2019 (GLOBE NEWSWIRE) — Xnor, the company that is making AI available on every device, has appointed Matt Welsh to the position of principal engineer. Welsh joins Xnor from Google, where he was an engineering lead on the Chrome Mobile team for

Xnor Appoints Mobile Computing Expert to Principal Engineer Read More +

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Embedded Vision Alliance Announces Two Hands-On Training Classes for Computer Vision and Visual AI

Edge AI and Vision Alliance, News /

SANTA CLARA, Calif., Feb. 21, 2019 /PRNewswire/ — The Embedded Vision Alliance today announced an updated Deep Learning for Computer Vision with TensorFlow 2.0 training class and an all-new class on Computer Vision Applications in OpenCV. These full-day, hands-on training courses will be held May 20, 2019 in conjunction with the eighth annual Embedded Vision

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FRAMOS and Daiwon Partner for Distributing Embedded Vision Lenses in Europe and the Americas

FRAMOS, News /

February 21, 2019 – Munich, Germany – FRAMOS has been selected by Daiwon, leading manufacturer of wide-range lenses, as their European and American distributor. DAIWON OPTICAL CO., LTD. is a leading manufacturer specializing in a wide-range of lenses that are optimally designed for applications in Surveillance, Home Automation, IoT and Automotive. Complementing the FRAMOS portfolio

FRAMOS and Daiwon Partner for Distributing Embedded Vision Lenses in Europe and the Americas Read More +

OmniVision Announces Next-Generation 1/4” 8 MP Image Sensor for Smartphone Cameras

News, OmniVision /

OV08B Sensor Targets Front- and Rear-Facing Cameras; Enables Full-Resolution Imaging, Ultrawide Field of View and Telephoto Optical Zoom SANTA CLARA, Calif. – Feb. 21, 2019 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OV08B—the latest generation of its 1.12 micron, 8 megapixel (MP) image sensor family, designed for

OmniVision Announces Next-Generation 1/4” 8 MP Image Sensor for Smartphone Cameras Read More +

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ON Semiconductor Demonstrates New Cloud-connected Strata Developer Studio at Embedded World 2019

News, onsemi /

Evaluation and design support tool exhibited for first time in Europe alongside multiple technology demonstrations covering demanding application sectors including Internet of Things, factory automation and automotive vision sensing NUREMBERG, Germany – 20 February, 2019 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, will be exhibiting its newly-launched Strata Developer Studio design support tool

ON Semiconductor Demonstrates New Cloud-connected Strata Developer Studio at Embedded World 2019 Read More +

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OmniVision Announces Its First 0.8 Micron, 32 Megapixel Image Sensor

News, OmniVision /

SANTA CLARA, Calif. – Feb. 20, 2019 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OV32A, its first 0.8 micron pixel image sensor with 32 megapixel (MP) resolution, built on OmniVision’s PureCel® Plus stacked die technology. This new sensor offers leading-edge performance for high-end smartphones. “The demand for

OmniVision Announces Its First 0.8 Micron, 32 Megapixel Image Sensor Read More +

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