News

SAN JOSE, November 8, 2017 – Xilinx, Inc. (NASDAQ: XLNX) today announced it will showcase reconfigurable application acceleration at cloud scale at SC17. Through a series of demonstrations and presentations, Xilinx and its ecosystem will highlight how Xilinx® technologies are ideally suited to handle computationally intensive data center workloads including data analytics, video transcoding, machine […]

AR0144 Global shutter device from ON Semiconductor achieves fast, clean and accurate imaging in static applications such as high-speed barcode scanners, and dynamic uses including drones and AR/VR PHOENIX, Ariz. – 7 November, 2017 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced a new 1/4-inch, 1.0 Megapixel (Mp) (1280H x 800V) CMOS digital image sensor which

Tensilica Vision P6 DSP increases imaging/vision performance by up to 4X compared to the highly successful Vision P5 DSP SAN JOSE, Calif., November 6, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that HiSilicon, a global fabless semiconductor and IC design company, has selected the Cadence® Tensilica® Vision P6 DSP for its 10nm Kirin 970

The French magazine "mesures" awards Allied Vision the "Palmarès technologique" for industrial vision 2017 Stadtroda, November 1, 2017 – Allied Vision’s new camera platform and its ALVIUM® Technology were awarded by the French metrology magazine "mesures". The 1 Product Line won the award in the category industrial vision (Vision industrielle). Representing Allied Vision, Philippe Berger

WALNUT CREEK, Calif., Oct. 24, 2017 /PRNewswire/ — The Embedded Vision Alliance today announced its call for papers has opened for the 2018 Embedded Vision Summit™, which will take place May 22-24, 2018, in Santa Clara, CA. The Embedded Vision Summit is the only event focused exclusively on deployable computer vision, attracting a global audience

HONG KONG, Oct. 16, 2017 /PRNewswire/ — Qualcomm Incorporated (NASDAQ:QCOM) announced that its subsidiary, Qualcomm Technologies, Inc., has introduced a new mobile platform, the Qualcomm® Snapdragon™ 636, designed to provide improvements to device performance, enhanced gaming and display technology support in comparison to the Snapdragon 630 Mobile Platform. The Snapdragon 636 continues to build out the

SAN DIEGO, Oct. 19, 2017 /PRNewswire/ — Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), and SenseTime Group Limited today announced plans to collaborate on artificial intelligence (AI) and machine learning (ML) for future mobile and IoT products. This collaboration will draw from the expertise of both companies in AI by leveraging SenseTime's ML

Introducing the era of the intelligent machine with ultimate speed, power, and performance MUNICH, Oct. 17, 2017 /PRNewswire/ — Today Huawei reveals the highly anticipated HUAWEI Mate 10 and HUAWEI Mate 10 Pro featuring the world's first artificially intelligent chipset with dedicated Neural Network Processing Unit (NPU). With AI-based enhancements and machine learning integrated throughout,