News

Broad range of new CEVA-powered products, platforms and solutions unveiled by CEVA customers, partners and OEMs BARCELONA, Spain, Feb. 26, 2013 /PRNewswire/ — Mobile World Congress – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that its customers, partners and CEVA-powered OEMs have come […]

Visit Tensilica in Hall 6, Stand 6D101 SANTA CLARA, CA–(Marketwire – February 21, 2013) – Tensilica®, Inc. today announced that it will showcase its complete hardware/software intellectual property (IP) solutions that are leading the market in audio, voice, video, imaging and baseband communications at stand 6D101 at the Mobile World Congress, February 25-28, 2013, in

Unrivalled suite of mobile IP on display includes software-based Wi-Fi 802.11ac; software-based image enhancement & computer vision; advanced audio post-processing, voice pre-processing and voice activation. Visit CEVA at Stand 7i70, Hall 7 MOUNTAIN VIEW, Calif., Feb. 13, 2013 /PRNewswire/ — CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and

SANTA CLARA, CA and AUSTIN, TX–(Marketwire – February 12, 2013) – Tensilica®, Inc. and Almalence today announced that they are partnering to port and optimize Almalence's software for digital image processing to Tensilica's new IVP imaging/video DSP (digital signal processor). Almalence has joined Tensilica's Xtensions™ partner program and will help support new joint customers with

SANTA CLARA, CA and PATRAS, GREECE–(Marketwire – February 12, 2013) – Tensilica®, Inc. and Irida Labs today announced that they are partnering to enable availability of Irida Labs' computer vision software portfolio on Tensilica's new IVP imaging/video DSP (digital signal processor). Irida Labs has joined Tensilica's Xtensions™ partner program and will enhance the support of

SANTA CLARA, CA and GARBSEN, GERMANY–(Marketwire – February 12, 2013) – Tensilica®, Inc. and Dream Chip Technologies (DCT) today announced that they are partnering to port and optimize DCT's video and image signal processing software to Tensilica's new IVP imaging DSP (digital signal processor). DCT has been a Tensilica Xtensions™ partner for a couple of

SANTA CLARA, CA and TOKYO–(Marketwire – February 12, 2013) – Tensilica®, Inc. and Morpho®, Inc. today announced that they are partnering to port Morpho's innovative mobile imaging software to Tensilica's new IVP imaging DSP (digital signal processor). Morpho has been a Tensilica Xtensions™ partner for several years and will help support new joint customers with

IVP Offloads Host CPU While Providing a 10 to 20x Peak Performance Boost SANTA CLARA, CA–(Marketwire – February 12, 2013) – Tensilica®, Inc. today introduced IVP, an imaging and video dataplane processor (DPU) that is ideal for the complex image/video signal processing functions in mobile handsets, tablets, digital televisions (DTV), automotive, video games and computer

Upcoming AMD APUs codenamed “Richland” and “Temash” offer gesture control with accelerated performance in comparison to traditional CPUs “Gesture recognition is becoming an important feature to be included in digital devices, the integration of our solution into AMD’s APUs brings this game-changing technology to the masses,” comments Gideon Shmuel, CEO, eyeSight TEL AVIV, Israel–(BUSINESS WIRE)–Following