MediaTek

New 5G chipset packs impressive imaging features with 200MP camera support HSINCHU, Taiwan – October 11, 2022 – MediaTek today unveiled the Dimensity 1080, the newest chipset in the company’s popular Dimensity portfolio for 5G smartphones. The new 5G chipset offers a nice performance bump and significantly upgraded camera features compared to its predecessor, the […]

The company’s latest chipset offers device makers another high-performance option for flagship smartphones HSINCHU, Taiwan – June 22, 2022 – MediaTek today announced the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship

Dimensity 1050 mmWave SoC highlights trio of new chipsets expanding MediaTek’s 5G and gaming portfolio HSINCHU, Taiwan – May 23, 2022 – MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity

With the MediaTek Genio platform stack, designers and OEMs can bring differentiated and secure intelligent devices to market faster Scottsdale, Arizona – May 10, 2022 – MediaTek today unveiled its new Genio platform for AIoT devices and introduced the first chip in the Genio family, the Genio 1200 designed for premium AIoT products. MediaTek Genio

Built on the leading TSMC N4 process, Dimensity 9000 brings full flagship performance and power-efficiency to smartphones. First MediaTek powered devices will be available in Q1 of 2022 HSINCHU, Taiwan – December 16, 2021 – MediaTek today launched its Dimensity 9000 5G smartphone chip for next-generation flagship smartphones, and announced device maker adoption and endorsements

Kompanio family allows OEMs to build powerful, thin and lightweight mobile computing devices with long battery life HSINCHU, Taiwan – September 9, 2021 – MediaTek today announced its new Kompanio™ 900T chipset, expanding MediaTek’s portfolio of mobile computing solutions for tablets, portable notebooks and other devices. The introduction of Kompanio 900T follows MediaTek’s recent launch

Bringing brilliant imaging, smarter displays and boosted performance together for incredible mobile experiences HSINCHU, Taiwan – August 11, 2021 – MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets, the latest additions to its Dimensity 5G family. This debut gives smartphone makers the ability to provide boosted performance, brilliant imaging and smarter displays to

SoC provides personal computing devices with powerful performance and advanced 5G connectivity, multimedia and gaming technologies HSINCHU, Taiwan – July 27, 2021 – MediaTek today announced the launch of its Kompanio 1300T, a SoC designed to power incredible experiences across computing devices. Built on the leading 6nm process technology, the chip is bringing premium performance to