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OpenFive and EdgeCortix Collaborate on an AI Accelerator Custom SoC

Collaborating to bring to market a new high performance and low power edge AI processor March 7, 2022 – EdgeCortix® Inc., the AI-focused fabless semiconductor company that enables best-in-class power-efficiency with near cloud-level performance across infrastructure and embedded edge devices, and OpenFive, a leading provider of custom silicon solutions with differentiated IP, today announced they […]

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OpenFive Demonstration of How to Customize an Edge AI Vision SoC

David Lee, Director of Product Management at OpenFive, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Lee demonstrates how to customize an edge AI vision SoC. Deploying a custom accelerator in a new embedded application is difficult without the rest of the IP also required

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OpenFive Tapes Out SoC for Advanced AI/HPC Solutions on TSMC 5nm Technology

OpenFive HBM3 and Die-2-Die (D2D) interfaces combined with SiFive E76 RISC-V CPU core enable high performance chiplets and 2.5D based system-on-a-chip (SoC) designs. SAN MATEO, Calif. – April 13, 2021 – OpenFive, a leading provider of customizable, silicon-focused solutions with differentiated IP, today announced the successful tape out of a high-performance SoC on TSMC’s N5

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Protocol- and Interface-Agnostic Universal D2D Controller for Chiplets and HPC

This blog post was originally published at OpenFive’s website. It is reprinted here with the permission of OpenFive. Demand for die-to-die and chip-to-chip interfaces has been growing steadily in the past few years due to new applications in cloud/data centers, AI (training and edge applications), and High-Performance Computing (HPC). The demand is driven by the requirements

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