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OpenFive Tapes Out SoC for Advanced AI/HPC Solutions on TSMC 5nm Technology

OpenFive HBM3 and Die-2-Die (D2D) interfaces combined with SiFive E76 RISC-V CPU core enable high performance chiplets and 2.5D based system-on-a-chip (SoC) designs. SAN MATEO, Calif. – April 13, 2021 – OpenFive, a leading provider of customizable, silicon-focused solutions with differentiated IP, today announced the successful tape out of a high-performance SoC on TSMC’s N5 …

OpenFive Tapes Out SoC for Advanced AI/HPC Solutions on TSMC 5nm Technology Read More +

Protocol- and Interface-Agnostic Universal D2D Controller for Chiplets and HPC

This blog post was originally published at OpenFive’s website. It is reprinted here with the permission of OpenFive. Demand for die-to-die and chip-to-chip interfaces has been growing steadily in the past few years due to new applications in cloud/data centers, AI (training and edge applications), and High-Performance Computing (HPC). The demand is driven by the requirements …

Protocol- and Interface-Agnostic Universal D2D Controller for Chiplets and HPC Read More +

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