Tessolve

From Concept to Production: Engineering Reliable Hardware

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This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. Every electronic device we use today, from smartphones and medical monitoring systems to industrial machines and automotive control units, depends on a well-designed Printed Circuit Board (PCB). The PCB acts as the backbone of modern electronics, enabling components […]

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Thermal-Aware Testing Strategies for Next-Gen Semiconductor Devices

Blog Posts, Processors, Tessolve /

This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. As semiconductor devices continue to scale down in size and ramp up in performance, one challenge stands out above many others: thermal behavior. Heat isn’t just a byproduct of activity in modern chips; it’s one of the pivotal

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Scalable FPGA Prototyping for AI SoCs: Handling Massive Parallelism and Bandwidth

Blog Posts, Memory, Processors, Tessolve /

This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. Creating an AI System-on-Chip (SoC) today resembles conducting a thousand musicians playing different melodies at once; each note, or data stream, must align perfectly. As AI workloads become increasingly complex, prototyping these SoCs on FPGA (Field Programmable

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UCIe & Chiplets: A Practical Guide to Modular SoC Design

Blog Posts, Processors, Tessolve /

This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. The semiconductor industry is undergoing a paradigm shift. Traditional monolithic System-on-Chip (SoC) designs are giving way to modular architectures that leverage interoperable chiplets. At the heart of this evolution is Universal Chiplet Interconnect Express (UCIe). This open standard

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Trends in Embedded AI: Designing Hardware for Machine Learning on the Edge

Blog Posts, Memory, Processors, Tessolve /

This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. The world is increasingly becoming connected, intelligent, and autonomous. At the core of this transformation is Artificial Intelligence (AI), which is swiftly transitioning from the cloud to the edge, nearer to where data is generated and actions are

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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