News

Three-exposure high dynamic range (HDR) ensures detail captured in both bright and poor light areas in the same scene PHOENIX, Ariz. – 27 October, 2017 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced a new 1/2.7-inch 2.3 Megapixel (Mp) CMOS digital image sensor with an active-pixel array of 1936H x 1188V. The AR0239 produces extraordinarily clear […]

The Basler PowerPack for Microscopy now pays tribute to challenging fluorescence applications. New monochrome Basler Microscopy ace cameras offer best imaging performance due to Sony´s latest CMOS technology. The Basler Microscopy Software 2.0 comes along with dark skin mode and fluorescence color preset. Ahrensburg, October 25, 2017 – Camera manufacturer Basler enhances its PowerPack for

Hayabusa™ platform delivers simultaneous120 dB ultra-high dynamic range (UHDR) with LED flicker mitigation (LFM) imaging in a range of sizes from 1 MP to 5 MP PHOENIX, Ariz. – Oct. 25, 2017 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations and the market leader in automotive imaging, today announced a CMOS image sensor platform that brings

New HALCON and MERLIC versions to take center stage Extensive deep learning functions optimize machine vision Live demos show practical application of machine vision solutions Munich, October 25, 2017 – MVTec Software GmbH (www.mvtec.com), the leading provider of machine vision software, will be presenting its portfolio at SPS IPC Drives in Nuremberg from November 28

Newest model available with an exceptionally high resolution of almost 50 Mpix. Check entire xiB line Muenster, Germany – October 18, 2017 – Newest models in the high-speed line of PCI Express camera line announced earlier are now available to order. The well-known line called xiB already offers 4K and 5K models with 12 and 20 Mpix resolution

Combination of CEVA-XM imaging and vision platform and Brodmann17’s deep learning technology brings ultra-low power deep learning vision to smartphones, drones, cars, surveillance cameras and more MOUNTAIN VIEW, Calif., – October 18, 2017 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, and Broadmann17, a developer of patent-pending

Enhancing the development of next-generation Driver Status Monitor leveraging facial image recognition, and neural network technologies Oct. 17, 2017 ― KARIYA (Japan) ― DENSO Corporation, one of the world’s largest automotive technology, systems and components suppliers, and Xperi Corporation (NASDAQ: XPERI), a Silicon Valley-based technology company, today announced DENSO will start joint technology development of

LG’s high-performance 3D camera module utilizes Rockchip RK1608 with multi-core CEVA-XM4 vision DSPs to process a range of advanced workloads – including Simultaneous Localization and Mapping (SLAM), Stereo Disparity and 3D point cloud – for a wide range of markets and applications MOUNTAIN VIEW, Calif., – October 17, 2017 – CEVA, Inc. (NASDAQ: CEVA), the