Ceva

CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances

LG8111 Edge AI SoC Adopts CEVA-XM4 vision DSP to advance the performance and functionality of smart home appliances LAS VEGAS, NV, – Consumer Electronics Show – January 4, 2023 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions today announced that LG Electronics (LG) has licensed and […]

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CEVA NeuPro-M Edge AI Processor Architecture Recognized at EE Awards Asia 2022

Aimed at AI/ML applications in automotive, industrial, 5G networks and handsets, surveillance cameras, and Edge Compute NeuPro-M awarded as ‘Most Promising Product’ 3rd generation NeuPro AI/ML architecture offers scalable performance of 20 to 1,200 TOPS at SoC and Chiplet levels, lowers memory bandwidth by 6X ROCKVILLE, MD – December 13, 2022 – CEVA, Inc. (NASDAQ: CEVA),

CEVA NeuPro-M Edge AI Processor Architecture Recognized at EE Awards Asia 2022 Read More +

Novatek Adopts CEVA’s Latest Sensor Hub DSP for New Multi-sensor IP Camera SoC

NT98530 Smart Camera SoC integrates CEVA SensPro2 DSP to support advanced computer vision and edge AI workloads, on-device Companies to showcase the SoC at CES 2023 in CEVA’s meeting suite ROCKVILLE, MD – December 5, 2022 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions today

Novatek Adopts CEVA’s Latest Sensor Hub DSP for New Multi-sensor IP Camera SoC Read More +

CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs

CEVA’s WhisPro speech recognition and control software is now available for TI’s CC3235x family, bringing ultra-low power, robust voice user interface to IoT endpoints ROCKVILLE, MD – November 15, 2022 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, announced today the availability of its WhisPro™ speech

CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs Read More +

Sensors, Sensors Everywhere. Now What Do I Do?

This blog post was originally published at CEVA’s website. It is reprinted here with the permission of CEVA. Mobile computing has driven an explosion in product opportunities – smartphones, wearables, hearables, sports cameras, and more. Sensing will further extend opportunities in applications which must be environment-aware. Now it’s commonplace to think about object recognition and

Sensors, Sensors Everywhere. Now What Do I Do? Read More +

CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped

Milestone underscores CEVA’s central role in the IoT era, enabling wireless connectivity and intelligence in billions of smartphones, consumer electronics, wearables, IoT endpoints and edge AI devices ROCKVILLE, MD, August 9, 2022 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, announced today that cumulative royalty-bearing

CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped Read More +

“NeuPro-M: A Highly Scalable, Heterogeneous and Secure Processor for High-performance AI/ML in Smart Edge Devices,” a Presentation from CEVA

Yair Siegel, Senior Director of Business Development at CEVA, presents the “NeuPro-M: A Highly Scalable, Heterogeneous and Secure Processor for High-performance AI/ML in Smart Edge Devices” tutorial at the May 2022 Embedded Vision Summit. AI capabilities have become an integral part of many products across a wide range of markets and applications. Increasingly, system developers

“NeuPro-M: A Highly Scalable, Heterogeneous and Secure Processor for High-performance AI/ML in Smart Edge Devices,” a Presentation from CEVA Read More +

Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA

Flex Logix® EFLX embedded FPGA brings reconfigurable computing to CEVA-X2 DSP instruction extension to support demanding and changing workloads MOUNTAIN VIEW, Calif. – June 27, 2022 – Flex Logix Technologies, Inc., the leading supplier of reconfigurable computing solutions, architecture and software, and CEVA, Inc. (NASDAQ:CEVA), the leading licensor of wireless connectivity and smart sensing technologies

Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA Read More +

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

FSP201 delivers superior orientation and heading accuracy, providing high quality, low cost, sensor-agnostic solution for robotics, 3D audio, metaverse hardware & general 6-axis motion applications ROCKVILLE, MD, June 09, 2022 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity, smart sensing technologies, and integrated IP solutions, today announced that it has expanded its

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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PO Box #4446
Walnut Creek, CA 94596

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