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Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA

CEVA, Flex Logix, News, Processors / June 27, 2022

Flex Logix® EFLX embedded FPGA brings reconfigurable computing to CEVA-X2 DSP instruction extension to support demanding and changing workloads MOUNTAIN VIEW, Calif. – June 27, 2022 – Flex Logix Technologies, Inc., the leading supplier of reconfigurable computing solutions, architecture and software, and CEVA, Inc. (NASDAQ:CEVA), the leading licensor of wireless connectivity and smart sensing technologies …

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CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

CEVA, News, Processors, Sensors / June 9, 2022

FSP201 delivers superior orientation and heading accuracy, providing high quality, low cost, sensor-agnostic solution for robotics, 3D audio, metaverse hardware & general 6-axis motion applications ROCKVILLE, MD, June 09, 2022 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity, smart sensing technologies, and integrated IP solutions, today announced that it has expanded its …

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection Read More +

Edge AI and Vision Alliance Announces 2022 Edge AI and Vision Product of the Year Award Winners

Blaize, CEVA, Edge AI and Vision Alliance, Edge Impulse, Luxonis, News, Sequitur Labs, Synopsys / May 17, 2022

Awards Celebrating Innovation and Achievement in Computer Vision and Edge AI SANTA CLARA, Calif., May 17, 2022 /PRNewswire/ — The Edge AI and Vision Alliance today announced the 2022 winners of the Edge AI and Vision Product of the Year Awards. The Awards celebrate the innovation and achievement of the industry’s leading companies that are …

Edge AI and Vision Alliance Announces 2022 Edge AI and Vision Product of the Year Award Winners Read More +

CEVA Announces Milestone of 100 Million CEVA-powered Cellular IoT Chips Shipped

CEVA, News / March 1, 2022

CEVA-powered cellular IoT chips serve largest IoT markets including wearables, smart meters, asset trackers and industrial IoT ROCKVILLE, MD, March 01, 2022 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced that more than 100 million CEVA-powered cellular IoT chips have been shipped by …

CEVA Announces Milestone of 100 Million CEVA-powered Cellular IoT Chips Shipped Read More +

CEVA Streamlines 5G New Radio Modem Design with PentaG2, the Industry’s Most Comprehensive 5G Baseband Platform IP for Mobile Broadband and IoT

CEVA, News, Processors / February 25, 2022

2nd generation PentaG 5G modem architecture facilitates rapid development of 5G SoCs, dramatically reducing the time-to-market, risk, effort and cost Platform integrates low power DSPs with specialized programmable accelerators for optimal modem processing chains, delivering up to a 4X improvement in power efficiency versus predecessor Scalable platform addresses full gamut of use cases, from RedCap, …

CEVA Streamlines 5G New Radio Modem Design with PentaG2, the Industry’s Most Comprehensive 5G Baseband Platform IP for Mobile Broadband and IoT Read More +

CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture

CEVA, News, Processors / January 6, 2022

3rd generation NeuPro AI/ML architecture offers scalable performance of 20 to 1,200 TOPS at SoC and Chiplet levels, lowers memory bandwidth by 6X Targets broad use of AI/ML in automotive, industrial, 5G networks and handsets, surveillance cameras, and Edge Compute LAS VEGAS, Jan. 6, 2022 /PRNewswire/ — Consumer Electronics Show  – CEVA, Inc. (NASDAQ: CEVA), …

CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture Read More +

ASPEED and CEVA Collaborate to Enable Superior Voice Experience on 2nd Generation Cupola360 SoC for Smart Cameras and Video Conferencing Systems

CEVA, News, Processors / January 4, 2022

CEVA-BX1 DSP powers audio/voice workloads in ASPEED’s AST1230 smart camera SoC; CEVA ClearVox voice front-end software is available to ASPEED’s customers to address most challenging multi-microphone conferencing use cases LAS VEGAS, Jan. 3, 2022 /PRNewswire/ — Consumer Electronics Show – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated …

ASPEED and CEVA Collaborate to Enable Superior Voice Experience on 2nd Generation Cupola360 SoC for Smart Cameras and Video Conferencing Systems Read More +

CEVA SensPro™ Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic)

Automotive, CEVA, News, Processors, Sensors / November 23, 2021

Functional safety-certified DSP and comprehensive software development kit is ideal for the development of low power automotive sensor fusion SoCs to process and fuse data from cameras, radar, lidar and more for autonomous driving and advanced driver assistance systems (ADAS) applications Rockville, MD, November 23, 2021 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless …

CEVA SensPro™ Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic) Read More +

Nextchip Demonstration of Efficient Driver Monitoring for Automotive Cameras

Algorithms, Automotive, CEVA, Face Detection, Nextchip, Object Tracking, PathPartner Technology, Processors, Sensors, Software, Summit 2021, Tools, Videos / November 18, 2021

Jessie Lee, General Manager of Technical Marketing at Nextchip, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Lee demonstrates efficient driver monitoring for automotive cameras. In this demonstration, Nextchip, in collaboration with PathPartner Technology, presents a driver monitoring system (DMS) solution based on its ADAS …

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“SensPro2 Highly Scalable Sensor Hub DSP for Computer Vision, AI and Multi-sensor Fusion for Contextually Aware Devices,” a Presentation from CEVA

CEVA, Processors, Sensors, Summit 2021, Videos / March 1, 2022

Gil Abraham, Director of Business Development in the Vision and AI Business Unit at CEVA, presents the “SensPro2 Highly Scalable Sensor Hub DSP for Computer Vision, AI and Multi-sensor Fusion for Contextually Aware Devices” tutorial at the May 2021 Embedded Vision Summit. Contextual awareness is the ability of a system to gather information about its …

“SensPro2 Highly Scalable Sensor Hub DSP for Computer Vision, AI and Multi-sensor Fusion for Contextually Aware Devices,” a Presentation from CEVA Read More +

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