Ceva

Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications

Partnership enables AI developers to train, optimize and deploy embedded ML models on the Ceva-NeuPro-Nano NPU IP, pre-silicon, via Edge Impulse Platform ROCKVILLE, Md., Sept. 24, 2024 /PRNewswire/ — Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and […]

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Ceva Wins Prestigious OFweek China Automotive Industry Award 2024

Ceva-Waves UWB low power ultra-wideband IP named a winner of the Cabin-Driving Integrated Technology Breakthrough Award in China ROCKVILLE, MD., August 28, 2024 – Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, announced today that its

Ceva Wins Prestigious OFweek China Automotive Industry Award 2024 Read More +

Upcoming Webinar Explores How AI Can Make Cameras See In the Dark

On September 10, 2024 at 9:00 am PT (noon ET), Alliance Member companies Ceva and Visionary.ai will deliver the free webinar “Can AI Make Cameras See In the Dark? Real-Time Video Enhancement.” From the event page: As cameras become ubiquitous in applications such as surveillance, mobile, drones, and automotive systems, achieving clear vision 24/7 under

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Ceva Extends its Smart Edge IP Leadership, Adding New TinyML Optimized NPUs for AIoT Devices to Enable Edge AI Everywhere

Ceva-NeuPro-Nano NPUs deliver optimal balance of ultra-low power and best performance in small area to efficiently execute TinyML workloads in consumer, industrial and general-purpose AIoT products Ceva-NeuPro Studio complete AI SDK for the Ceva-NeuPro NPU family supports open AI frameworks including TensorFlow Lite for Microcontrollers and microTVM to simplify the rapid development of TinyML enabled

Ceva Extends its Smart Edge IP Leadership, Adding New TinyML Optimized NPUs for AIoT Devices to Enable Edge AI Everywhere Read More +

Oriented FAST and Rotated BRIEF (ORB) Feature Detection Speeds Up Visual SLAM

This blog post was originally published at Ceva’s website. It is reprinted here with the permission of Ceva. In the realm of smart edge devices, signal processing and AI inferencing are intertwined. Sensing can require intense computation to filter out the most significant data for inferencing. Algorithms for simultaneous localization and mapping (SLAM), a type

Oriented FAST and Rotated BRIEF (ORB) Feature Detection Speeds Up Visual SLAM Read More +

Partitioning Strategies to Optimize AI Inference for Multi-core Platforms

This blog post was originally published at Ceva’s website. It is reprinted here with the permission of Ceva. Not so long ago, AI inference at the edge was a novelty easily supported by a single NPU IP accelerator embedded in the edge device. Expectations have accelerated rapidly since then. Now we want embedded AI inference

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Efficiently Packing Neural Network AI Model for the Edge

This blog post was originally published at Ceva’s website. It is reprinted here with the permission of Ceva. Packing applications into constrained on-chip memory is a familiar problem in embedded design, and is now equally important in compacting neural network AI models into a constrained storage. In some ways this problem is even more challenging

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Ceva Expands AI Ecosystem for its Class-leading NPU IP with New Partnerships for Automotive and Edge AI

Visionary.ai neural network software ISP for enhanced camera applications and ENOT.ai neural network optimization tools and AI assistance now available for Ceva’s NeuPro-M NPU LAS VEGAS, NV. – CES 2024 – January 8, 2024 – Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and

Ceva Expands AI Ecosystem for its Class-leading NPU IP with New Partnerships for Automotive and Edge AI Read More +

Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation

Company sharpens its strategy of delivering silicon and software IP that makes it possible for low power Edge AI devices to connect, sense and infer data, reliably and efficiently, across multiple high-growth end markets ROCKVILLE, MD., December 6, 2023 – Ceva, Inc. (NASDAQ: CEVA), today introduced a fresh new brand visual identity, logo design and web

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CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-edge SoCs

IFS Accelerator IP Alliance ensures support for mutual customers leveraging CEVA’s industry leading wireless communications and sensing AI IP and IFS’ advanced manufacturing capabilities to deliver leading-edge silicon performance for the most demanding applications ROCKVILLE, MD., October 17, 2023 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies which have

CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-edge SoCs Read More +

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PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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