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VVDN to Set Up CoE through Global Strategic Partnership with Google Cloud

News, VVDN Technologies /

Gurugram, 18th October, 2022:  VVDN Technologies, a global provider of engineering, and digital services and solutions, today announced it has entered into a multi-year global strategic partnership with Google Cloud. The partnership will help customers accelerate app modernization and cloud transformation. VVDN will also develop the next generation of innovative solutions, namely IoT and Video […]

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Blaize Partners with Korea Telecom to Bring AI Transformation to Industrial and Enterprise Customers

Blaize, News, Processors /

Delivers AIoT (Artificial Intelligence of Things) edge technology for autonomous driving, robotics, and mobility AI vision surveillance management EL DORADO HILLS, CA — December 13, 2022 —Blaize® today announced a multi-year Memorandum of Understanding with Korea Telecom (KT) — Korea’s leading AI, big data, and cloud service provider. The strategic collaboration brings AIoT (Artificial Intelligence

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CEVA NeuPro-M Edge AI Processor Architecture Recognized at EE Awards Asia 2022

Ceva, News, Processors /

Aimed at AI/ML applications in automotive, industrial, 5G networks and handsets, surveillance cameras, and Edge Compute NeuPro-M awarded as ‘Most Promising Product’ 3rd generation NeuPro AI/ML architecture offers scalable performance of 20 to 1,200 TOPS at SoC and Chiplet levels, lowers memory bandwidth by 6X ROCKVILLE, MD – December 13, 2022 – CEVA, Inc. (NASDAQ: CEVA),

CEVA NeuPro-M Edge AI Processor Architecture Recognized at EE Awards Asia 2022 Read More +

KI-FLEX AI Chip Tapes Out With Flexible videantis Processor Platform

News, Processors, videantis /

Hannover, Germany, December 13, 2022 – videantis GmbH, provider of a unified platform for combined processing of algorithms as diverse as AI (Artificial Intelligence), multi-modal sensor data processing and fusion, or video coding on a single architecture, today announced the tape-out of the FlexAISIC AI chip based on its flexible v-MP6000UDX unified processing platform. The

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Syntiant Named 2022’s ‘Start-Up to Watch’ by the Global Semiconductor Alliance

News, Processors, Syntiant /

Ultra-Low-Power Chip Provider Recognized for Breakthroughs in Edge AI Solutions Irvine, Calif., December 12, 2022 — Syntiant Corp., a provider of deep learning solutions for always-on edge AI voice, sensor and vision applications, today announced that the company was named 2022’s “Start-Up to Watch” during this year’s Global Semiconductor Alliance (GSA) Awards. Syntiant was selected

Syntiant Named 2022’s ‘Start-Up to Watch’ by the Global Semiconductor Alliance Read More +

BrainChip Joins Intel Foundry Services to Advance Neuromorphic AI at the Edge

BrainChip, News, Processors /

Laguna Hills, Calif. – December 11, 2022 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power neuromorphic AI IP, today announced that it has become a member of the Intel Foundry Services (IFS) ecosystem alliance to help advance innovation on Intel’s foundry manufacturing platform. BrainChip is

BrainChip Joins Intel Foundry Services to Advance Neuromorphic AI at the Edge Read More +

Teledyne Cameras Enable VR Play at TOCA Social

Entertainment, News, Sensors and Cameras, Teledyne Digital Imaging /

Popular restaurant chain selects Teledyne’s Genie Nano cameras for its sports themed VR restaurants Waterloo, CANADA ─December 8, 2022 ─ Teledyne DALSA is pleased to announce that TOCA Social, the world’s first soccer and dining experience, has chosen Teledyne DALSA Genie Nano cameras to enable the capture of play in its interactive soccer based competitive socializing

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MediaTek’s New Dimensity 8200 Upgrades Experiences on Premium 5G Smartphones

MediaTek, News, Processors /

HSINCHU, Taiwan – December 1, 2022 – MediaTek today announced the Dimensity 8200, the company’s newest chipset for premium 5G smartphones. Smartphones powered by the Dimensity 8200 will offer flagship level experiences – including connectivity, gaming, multimedia, displays and imaging – at a more accessible price point. Built on the 4nm-class process, the new chipset

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Blaize to Power New ASIC-based Edge AI System from Aetina

Blaize, News, Processors /

Small-sized embedded AI inference system to facilitate computer vision applications El Dorado Hills, CA, December 8, 2022 —Aetina, an edge AI solution provider that offers embedded computing hardware and software for AI and IoT, has launched a new ASIC-based edge AI system powered by the programmable Blaize® Pathfinder P1600 Embedded System on Module (SoM). The

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Edge AI and Vision Insights: December 7, 2022 Edition

Edge AI and Vision Alliance, Newsletters /

LETTER FROM THE EDITOR Dear Colleague, Registration is now open for the 2023 Embedded Vision Summit, coming up May 22-25, 2023 in Santa Clara, California! The Summit is the premier conference and tradeshow for innovators incorporating computer vision and visual or perceptual AI in products. The program is designed to cover the most important technical

Edge AI and Vision Insights: December 7, 2022 Edition Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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