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Physical AI: 8 Questions Every Engineering Leader Is Asking

Automotive, Blog Posts, Geisel Software, Robotics, Software /

This blog post was originally published at Geisel Software’s website. It is reprinted here with the permission of Geisel Software. Jensen Huang called it at CES 2025: “The next frontier of AI is physical.” Since then, the phrase has been everywhere — in investor decks, conference keynotes, and vendor pitches. But for the software engineering managers, directors, VPs, and […]

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Chips&Media Completes Development of Next-Gen ‘AV2’ HW Decoder IP

Chips&Media, Consumer, Entertainment, News, Tools /

Key Takeaways: Implementing AOMedia’s latest AV2 standard as world-class HW IP, leading the next-gen video ecosystem Targeting the North American Big Tech-led OTT market (YouTube, Netflix) and solidifying the justification for global standard adoption HW RTL release in May with active commercial licensing talks underway with major North American clients May 12, 2026 – Chips&Media

Chips&Media Completes Development of Next-Gen ‘AV2’ HW Decoder IP Read More +

Everything Is Going to Be Driven by Algorithms

Algorithms & Models, Ambarella, Automotive, Blog Posts, Consumer, Industrial Vision (Computer Vision), Robotics /

This blog post was originally published at Ambarella’s website. It is reprinted here with the permission of Ambarella. A security camera on a warehouse loading dock captures 86,400 seconds of video every day. A fleet telematics recorder on a long-haul truck accumulates gigabytes of road footage between fuel stops. A surgical robot’s stereo cameras generate

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Airy3D Announces Support for MediaTek Genio SoCs for Edge 3D Vision Applications

Airy3D, Algorithms & Models, News, Software /

Montreal, Canada – May 11, 2026 – Airy3D today announced that its DepthIQ™ SDK is supported on the MediaTek Genio Series of System-on-Chips, enabling compact and cost-efficient passive 3D vision solutions for embedded AI vision applications across robotics, industrial, retail, and smart devices. Airy3D’s DepthIQ technology enables simultaneous capture of high-quality 2D images and depth

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FotoNation and SEMIFIVE Announce Strategic Collaboration for Turnkey Development of TriSilica Perceptual AI Chip Family Using Samsung Foundry

FotoNation, News, Processors /

Collaboration to accelerate the commercialization of FotoNation’s ultra-low-power sensor-fusion SoCs for edge AI applications GALWAY, Ireland, and SEOUL, South Korea – May 11 th , 2026 – FotoNation Ltd., a European-based Perception Recognition company and SEMIFIVE Inc., a leading global provider of custom AI semiconductor solutions, today announced a strategic collaboration agreement under which SEMIFIVE

FotoNation and SEMIFIVE Announce Strategic Collaboration for Turnkey Development of TriSilica Perceptual AI Chip Family Using Samsung Foundry Read More +

Face Super Resolution for Better Video Experiences

Algorithms & Models, Blog Posts, Software, Visidon /

This blog post was originally published at Visidon’s website. It is reprinted here with the permission of Visidon. Video has become the primary medium for communication — from hybrid meetings to live events and social media. At the same time, expectations have risen. Faces need to look sharp, expressive, and natural — even when captured from

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Scalable FPGA Prototyping for AI SoCs: Handling Massive Parallelism and Bandwidth

Blog Posts, Memory, Processors, Tessolve /

This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. Creating an AI System-on-Chip (SoC) today resembles conducting a thousand musicians playing different melodies at once; each note, or data stream, must align perfectly. As AI workloads become increasingly complex, prototyping these SoCs on FPGA (Field Programmable

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NPX6 NPU IP Accelerates Physical AI SoC Performance

News, Processors, Synopsys /

To meet the evolving performance and power-efficiency needs of generative AI (GenAI) and Physical AI models targeting for AI-driven SoCs, Synopsys has announced an enhanced version of its silicon-proven ARC® NPX6 NPU IP family of AI accelerators. These enhanced NPU IPs, which are software-compatible with existing NPX6 IP families, include: AI Data Compression: An enhanced

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FotoNation Completes a Pre-A Round to Fund the Development of its TriSilica Chip Lead by Enterprise Ireland and Silicon Gardens

FotoNation, News, Processors /

GALWAY, Ireland, May 7, 2026 /PRNewswire/ — FotoNation® LTD., a Galway-based company, announced it has closed its Pre-A round led by Enterprise-Ireland and Silicon Gardens, with participation from other notable Angels. This capital will accelerate FotoNation’s mission to develop its TriSilica® product: an ultra-low-power, perception-AI chip. Specifically, the funds will be used to progress the completion of the MPW prototype,

FotoNation Completes a Pre-A Round to Fund the Development of its TriSilica Chip Lead by Enterprise Ireland and Silicon Gardens Read More +

On-Demand Webinar on Deploying Computer Vision and LLMs at the Edge

Algorithms & Models, Boston.AI, Videos /

Check out this recent webinar from Boston.AI “Reality Check: Deploying Computer Vision and LLMs at the Edge” From the event page: AI workloads are moving closer to where data is generated — but how close can we really get? This webinar from ICS and Boston AI explores the evolving landscape of deploying advanced AI models,

On-Demand Webinar on Deploying Computer Vision and LLMs at the Edge Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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