Infineon

Introducing PSOC™ Edge City: A New Developer Education Program

Blog Posts, Infineon, Processors, Tools /

This blog post was originally published at Infineon’s website. It is reprinted here with the permission of Infineon. Infineon and Hackster.io have launched PSOC™ Edge City, a guided educational developer program designed to build practical expertise with PSOC™ Edge technologies — at your own pace, through structured learning and hands-on challenges. What Is PSOC™ Edge City? […]

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From Connected to Aware: How PSOC™ Edge Enables the Next Wave of Smart Devices

Blog Posts, Consumer, Infineon, Processors /

This blog post was originally published at Infineon’s website. It is reprinted here with the permission of Infineon. Across home, retail, and industry, devices that once followed simple rules are now expected to understand people and context. A thermostat shouldn’t just follow a schedule; it should know if anyone is in the room and choose the preferred

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AMD Spartan UltraScale+ FPGA Kit Adds Proven Infineon HyperRAM Support for Edge AI Designs

AMD, Infineon, Memory, News, Processors /

Somewhat eclipsed by last week’s announcement that the AMD Spartan™ UltraScale+™ FPGA SCU35 Evaluation Kit is now available, AMD and Infineon have disclosed successful validation of Infineon’s 64-Mb HYPERRAM™ memory and HYPERRAM controller IP on the platform. This collaboration expands the kit’s value for engineers building edge AI and computer vision systems. The SCU35 kit,

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Infineon Technologies, NXP, and STMicroelectronics Face Rising Competition in $132 Billion Automotive Semiconductor Race

Automotive, Infineon, Market Analysis, Memory, NXP Semiconductors, Processors, Sensors and Cameras, STMicroelectronics, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group’s Automotive Semiconductor Trends 2025 report maps the competitive shifts in semiconductors reshaping the future of automotive electronics. KEY TAKEAWAYS Top five players hold roughly 50% of the automotive semiconductor market,

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OktobertechVisual_600

Upcoming Infineon Conference Explores Advanced Technologies That Link the Real and the Digital Worlds

Infineon, News /

On October 17, 2019, Alliance member company Infineon will deliver its OktoberTech2019 conference in Mountain View, California, with free advance registration online. Here's the overview description from the event page: Join an exclusive group of visionary product developers, business leaders, expert hardware and system design engineers at OktoberTech 2019. Together we'll explore advanced technologies –

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Aurix

Infineon and Synopsys Collaborate to Accelerate Artificial Intelligence in Automotive Applications

Infineon, News, Synopsys /

MOUNTAIN VIEW, Calif. and MUNICH, Sept. 17, 2019 /PRNewswire/ — Artificial intelligence (AI) and neural networks are becoming a key factor in developing safer, smart, and eco-friendly cars. In order to support AI-driven solutions with its future automotive microcontrollers, Infineon Technologies AG (FSE: IFX/OTCQX: IFNNY) has started a collaboration with Synopsys, Inc. (Nasdaq: SNPS). Next-generation AURIX microcontrollers

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“REAL3 Time of Flight: A New Differentiator for Mobile Phones,” a Presentation from Infineon Technologies

Algorithms & Models, Infineon, Sensors and Cameras, Software, Summit 2019, Tools, Videos /

Walter Bell, 3D Imaging Application Engineer at Infineon Technologies, presents the “REAL3 Time of Flight: A New Differentiator for Mobile Phones” tutorial at the May 2019 Embedded Vision Summit. In 2019, 3D imaging has become mainstream in mobile phone cameras. What started in 2016 with the first two smartphones using an Infineon 3D time-of-flight (ToF)

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2019 Vision Product of the Year Award Winner Showcase: Infineon Technologies (Cameras and Sensors)

Infineon, Vision Product of the Year Awards /

Infineon Technologies' IRS2381C 3D image sensor is the 2019 Vision Product of the Year Award Winner in the Cameras and Sensors category. The IRS2381C is a novel member of the REAL3 product family, Infineon’s portfolio of highly integrated 3D Time-of-flight (ToF) imager sensors. Building upon the combined expertise of Infineon and pmdtechnologies in algorithms for

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Embedded Vision Alliance Awards REAL3 Image Sensor as “Product of the Year”

Infineon, News /

Munich, Germany – 23 May 2019 – Smartphone cameras increasingly require 3D vision capabilities as differentiating factor. Hence, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) developed the REAL3™ IRS2381C, a premier 3D imager sensor solution especially designed for the mobile device market. The Embedded Vision Alliance now awarded the 3D Time-of-Flight (ToF) single chip

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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PO Box #4446
Walnut Creek, CA 94596

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