Processors

VeriSilicon Demonstration of Its Versatile IP on NXP Semiconductors’ i.MX8M Family Processors

David Jarmon, Senior Vice President, Special Project at VeriSilicon, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Jarmon demonstrates VeriSilicon’s IP adopted by NXP Semiconductors’ i.MX8M top-of-the-line processor family. Designed in collaboration with VeriSilicon, the i.MX8M family integrates some of VeriSilicon’s key processor IP, including […]

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STMicroelectronics Demonstration of Using the STM32Cube.AI Developer Cloud to Test and Deploy ML Solutions

Louis Gobin, AI Product Marketing Engineer at STMicroelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Gobin demonstrates the STM32Cube.AI Developer Cloud. Speeding Edge-AI development for STM32 MCUs, the STM32Cube.AI Developer Cloud opens access to an extensive suite of tools built to import machine learning

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Chips as Currency: America, China, and the AI Race

Running in the background to the more visible, very real wars occurring around the world at present, there is another, economic and industrial in nature. This is a trade war between two principals: the USA and China. The potential consequences of this trade war are incredibly significant to global geopolitics, as how the interaction between

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STMicroelectronics Demonstration of the Cube.ai Developer Cloud, from TAO to STM32

Louis Gobin, AI Product Marketing Engineer at STMicroelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Gobin demonstrates the work of Seeed, using STMicroelectronics and NVIDIA solutions. Gobin shows the Seeed Wio Lite AI board based on a STM32H7 microcontroller. The STM32H7 runs a real-time

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STMicroelectronics Demonstration of a Smart 0.6 Mpixel Global Shutter Image Sensor for MCU Offload

Ruchi Upadhyay, Technical Marketing Manager at STMicroelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Upadhyay demonstrates STMicroelectronics’ new 0.6M pixel global shutter smart image sensor, capable of offloading some MCU workloads. The sensor features intelligence on-chip to deliver 3 key features: autonomous wake up

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AI Chips for Edge Applications 2024-2034: Artificial Intelligence at the Edge

For more information, visit https://www.idtechex.com/en/research-report/ai-chips-for-edge-applications-2024-2034-artificial-intelligence-at-the-edge/956. The global AI chips market for edge devices will grow to US$22.0 billion by 2034, with the three largest industry verticals at that time being Consumer Electronics, Industrial, and Automotive. Artificial Intelligence (AI) is already displaying significant transformative potential across a number of different applications, from fraud detection in high-frequency

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Innowave Demonstration of Complete Vision Camera Solutions Using NXP’s i.MX 8M Plus SoC with Integrated ISP

Miki Peer, founder and CEO of Innowave, demonstrates the company’s latest edge AI and vision technologies and products in NXP Semiconductors’ booth at the 2023 Embedded Vision Summit. Specifically, Peer demonstrates camera module integration using NXP’s i.MX 8M Plus SoC along with a Sony IMX258 13 Mpixel image sensor. Innowave calibrated and tuned the integrated

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NXP Demonstration of AI Functions Implemented on Low-power MCX and RT Microcontrollers

Anthony Huereca, Systems Engineer at NXP Semiconductors, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Huereca demonstrates AI functions running on NXP’s low-power microcontrollers (MCUs). NXP’s new MCX N MCU, which includes the NXP-developed eIQ Neutron NPU, delivers an approximately 40x inference performance improvement when

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The M2 Pro SoC, Apple’s Path of Innovative Advancements

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole SystemPlus analyzes the M2 Pro System-on-Chip, with insights into the technology advances, manufacturing, packaging and consumer price of Apple’s upgraded, second-generation silicon. OUTLINE The M2 series uses the next-generation Avalanche and

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NXP Demonstration of a Driver Monitoring System Enabled By the i.MX 93 SoC and Its Integrated NPU

Michael Pontikes, Systems Engineer at NXP Semiconductors, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Pontikes demonstrates unique features of the new i.MX 93 applications processor. This latest processor from NXP Semiconductors, continuing the company’s long legacy of i.MX applications processors, features the Arm Ethos

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