Brian Dipert

Synthetic Data is Revolutionizing Sensor Tech: Real Results from Virtual Worlds

This blog post was originally published at Geisel Software’s website. It is reprinted here with the permission of Geisel Software. Imagine you’re a developer on your first day at a new job. You’re handed a state-of-the-art sensor designed to capture data for an autonomous vehicle. The excitement quickly turns to anxiety as you realize the […]

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Microchip to Accelerate Real-time Edge AI with NVIDIA Holoscan

PolarFire® FPGA Ethernet Sensor Bridge provides low-power multi-sensor bridging to NVIDIA edge AI platforms CHANDLER, Ariz., November 14, 2024 — To enable developers building artificial intelligence (AI)-driven sensor processing systems, Microchip Technology (Nasdaq: MCHP) has released its PolarFire® FPGA Ethernet Sensor Bridge that works with the NVIDIA Holoscan sensor processing platform. PolarFire FPGAs enable multi-protocol

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In-cabin Sensing: Gaze Tracking and Steering Wheel Sensors

Driver monitoring systems and occupant monitoring systems operating within a vehicle are designed to enhance passenger welfare and increase the safety of vehicles. IDTechEx outlines technologies from infrared cameras and time-of-flight cameras, to potential ECG monitoring within the steering wheel in their report, “In-Cabin Sensing 2024-2034: Technologies, Opportunities and Markets“. Infrared uses and adoption RGB-infrared

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Snapdragon Summit’s AI Highlights: A Look at the Future of On-device AI

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Qualcomm Technologies sets new standards in AI performance for its latest mobile, automotive and Qualcomm AI Hub advancements Our annual Snapdragon Summit wrapped up with exciting new announcements centered on the future of on-device artificial intelligence (AI).

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How Do LWIR Cameras Fit Into Vehicles of Today and In the Future?

The Society of Automotive Engineers defines 6 levels (0 to 5) of autonomy available to vehicles, ranging from level 0 (no automation) to level 5 (full automation). The jump from level 2 to 3 is a large one that has seen limited deployment, as automotive OEMs assume greater liability, and eyes can be taken off

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What are the Key Camera Features of Retail Kiosks?

This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. Retail kiosks, from self-checkout to interactive displays, rely on cameras to deliver seamless and efficient customer experiences. Discover how high-performance cameras can enhance security, streamline operations, and drive sales. Explore the latest advancements in camera

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Robotic Independence in Logistics

Mobile robots in logistics can be seen to work throughout an entire supply chain from manufacturing processes, to reaching consumers and shops. IDTechEx‘s report, “Mobile Robotics in Logistics, Warehousing and Delivery 2024-2044“, provides an in-depth overview of the role of new robot technologies at each stage of the chain, highlighting mobility, flexibility, and scalability as

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The Building of the New FRAMOS Campus is Completed

Campus combines research & development, production, and supportive functions under one climate-positive umbrella. Čakovec, Croatia / Munich, Germany – November 12th, 2024 – FRAMOS, the leading global expert in embedded vision, has completed its new campus building in Čakovec, Croatia. The campus will increase FRAMOS’ production capacity and bring research & development, and administration closer

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Electrification and Autonomy: A Semiconductor Content Boost to $1,000 per Car by 2029

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Automotive OEMs are moving upstream in the semiconductor supply chain with diverse strategies. OUTLINE The automotive semiconductor market is expecting a significant CAGR of 11% between 2023 and 2029 to almost $100

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Advanced Semiconductor Packaging: Key Materials and Processing Trends

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing these technologies to meet high performance and yield standards while fulfilling client requirements is complex. Challenges include developing the right materials and innovating packaging manufacturing techniques. IDTechEx‘s “Materials and Processing

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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