Akida™ Neuromorphic System-on-Chip (NSoC) Wafer Fabrication Completed Wafer fabrication completed on schedule BrainChip moving to assembly and test of the Akida NSoC Evaluation boards for Early Access Program are in fabrication Software tools are based on the Akida Development Environment Aliso Viejo, California – 2 July 2020 – BrainChip Holdings Ltd (ASX: BRN), a leading […]
BrainChip Provides Market Update Read More +
Built for mainstream gaming smartphones, Helio G25 & G35 include MediaTek HyperEngine game technology, premium imaging, and camera support NEW DELHI – June 30, 2020 – MediaTek, the world’s 4th largest global fabless semiconductor company, today launched its newest chips in the smartphone gaming-focused G series – the MediaTek Helio G25 and G35. The latest chips
MediaTek Introduces Helio G35 & G25 Gaming Series Chipsets Read More +
SYCL 2020 features are available now in Intel’s DPC++ and Codeplay’s ComputeCpp; Developers encouraged to provide feedback on the publicly available specification for C++ based heterogeneous parallel programming Beaverton, OR – June 30, 2020 – Today, The Khronos® Group, an open consortium of industry-leading companies creating graphics and compute interoperability standards, announces the ratification and public
What’s New: Intel is partnering with Maricopa County Community College District (MCCCD) to launch the first Intel-designed artificial intelligence (AI) associate degree program in the United States. The Arizona Commerce Authority will also provide a workforce grant of $100,000 to support the program. It will enable tens of thousands of students to land careers in high-tech,
Intel Launches First Artificial Intelligence Associate Degree Program Read More +
What’s New: Today, Intel and the National Science Foundation (NSF) announced award recipients of joint funding for research into the development of future wireless systems. The Machine Learning for Wireless Networking Systems (MLWiNS) program is the latest in a series of joint efforts between the two partners to support research that accelerates innovation with the focus of enabling
Auto and Computer Industry Leaders Intend to Join Forces and Enable Next-Generation Fleet with Software Upgradeability, AI and Autonomous Capabilities Tuesday, June 23, 2020 – Mercedes-Benz, one of the largest manufacturers of premium passenger cars, and NVIDIA, the global leader in accelerated computing, plan to enter into a cooperation to create a revolutionary in-vehicle computing
Cisco, Dell Technologies, HPE, Inspur, Lenovo, Supermicro Announce Systems Coming This Summer Monday, June 22, 2020—ISC Digital—NVIDIA and the world’s leading server manufacturers today announced NVIDIA A100-powered systems in a variety of designs and configurations to tackle the most complex challenges in AI, data science and scientific computing. More than 50 A100-powered servers from leading
Atlas automatically optimizes camera hardware systems and computer vision models jointly, improving object detection or instance segmentation results by up to 30 mean average precision (mAP) points and reducing effort and time by more than 10x vs. today’s expert manual tuning approaches, addressing a critical need for Tier 1 manufacturers and other vision system providers
VeriSilicon VIP9000 NPU AI processor and ZSPNano DSP IP bring AI-Vision and AI-Voice to low power automotive image processing SoC Shanghai, China, May 12, 2020 – VeriSilicon today announced that iCatch Technology, Inc. (TPEX: 6695), a global leader in low-power and intelligent image processing SoC solutions, has selected VeriSilicon VIP9000 NPU and ZSPNano DSP IP.
Latest investment round secured despite COVID-19 lockdowns around the world Budapest, Hungary – June 22, 2020 – AImotive, the automated driving technology company, today announced a new investment round of USD 20 million led by Lead Ventures, a Budapest based scale-up investor. With the fresh capital AImotive has become the largest VC-backed company developing automated
AImotive Becomes the Most-funded Automated Driving Software Supplier in Europe Read More +
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