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Neural Network Inference Engine IP Core Delivers >10 TeraOPS per Watt

VeriSilicon Expands Leadership in Deep Neural Network Processing with Breakthrough NN Compression Technology VIP8000 NN Processor Scaling from 0.5 to 72 TeraOPS Highlights: Scalable from IoT edge always-on to server ASICs with performance from 0.5 to 72 TeraOPS Delivers more than 10 TeraOPS per Watt in 14nm Process Technology Fully programmable processor supports OpenCL, OpenVX, and a wide […]

Neural Network Inference Engine IP Core Delivers >10 TeraOPS per Watt Read More +

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CEVA and mPerpetuo Partner to Deliver Halide Support for CEVA Vision Processors

Companies collaborate to enable CEVA-XM family with Halide functionality, dramatically improving productivity and performance of vision software MOUNTAIN VIEW, Calif., Feb. 23, 2018 /PRNewswire/ — CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, today announced that it has partnered with mPerpetuo Inc., a Bay

CEVA and mPerpetuo Partner to Deliver Halide Support for CEVA Vision Processors Read More +

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ON Semiconductor to Demonstrate Latest Integrated Semiconductor Solutions for the Internet of Things and Automotive at Embedded World

State-of-the-art development tools and semiconductor technologies, including a new wireless SoC, enable new applications and speed design and implementation Nuremberg, Germany. – 22nd February, 2018 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, will be exhibiting its integrated semiconductor-based systems solutions for the industrial, automotive and consumer sectors at this year’s Embedded World in Nuremberg. Particular focus

ON Semiconductor to Demonstrate Latest Integrated Semiconductor Solutions for the Internet of Things and Automotive at Embedded World Read More +

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PathPartner to Showcase Its Automotive Vision Expertise and Technology Services at Embedded World 2018

Demonstrations include advanced solutions and jump-start components for driver monitoring, traffic sign recognition, object detection and performance optimizations. These are targeted to provide automotive ODMs/OEMs the advantage of top-of-the-line technologies, superior performance and faster time-to-market. FREMONT, Calif. (PRWEB) February 21, 2018 – PathPartner Technology, a product R&D and engineering specialist, today announced that it will

PathPartner to Showcase Its Automotive Vision Expertise and Technology Services at Embedded World 2018 Read More +

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Vision Components Offers Embedded Vision Toolkit for OEMs

February 21, 2018 – At the embedded world exhibition in Nuremberg, Germany, Vision Components (hall 2, stand 2-454) will showcase new embedded vision systems. In addition to an extended range of models with CMOS sensors from the Sony Pregius series, trade show visitors are invited to witness the launch of the ARM-based 3D triangulation sensor

Vision Components Offers Embedded Vision Toolkit for OEMs Read More +

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Qualcomm Announces New Snapdragon 845 Mobile VR Reference Design To Fuel Next-Generation VR Experiences

Feb. 21, 2018 – Barcelona – Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ:QCOM), ahead of Mobile World Congress, today unveiled a new virtual reality (VR) reference platform based on the powerful Qualcomm® Snapdragon™ 845 Mobile Platform. “We continue to deliver new advancements in technologies for our customers to utilize as they aim to

Qualcomm Announces New Snapdragon 845 Mobile VR Reference Design To Fuel Next-Generation VR Experiences Read More +

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Qualcomm Artificial Intelligence Engine Powers AI Capabilities of Snapdragon Mobile Platform

Feb. 21, 2018 – San Diego – Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), today introduced its Qualcomm Artificial Intelligence (AI) Engine, which is comprised of several hardware and software components to accelerate on-device AI-enabled user experiences on select Qualcomm® Snapdragon™ mobile platforms. The AI Engine will be supported on Snapdragon 845,

Qualcomm Artificial Intelligence Engine Powers AI Capabilities of Snapdragon Mobile Platform Read More +

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AMD Launches EPYC Embedded and Ryzen Embedded Processors for End-to-End “Zen” Experiences from the Core to the Edge

EPYC Embedded processors deliver up to 2.7X more performance-per-dollar1 and Ryzen Embedded processors deliver up to 3X more GPU performance2 SANTA CLARA, Calif. 2/21/2018 – AMD (NASDAQ: AMD) today introduced two new product families – the AMD EPYC™ Embedded 3000 processor and AMD Ryzen™ Embedded V1000 processor – to enter a new age for high-performance

AMD Launches EPYC Embedded and Ryzen Embedded Processors for End-to-End “Zen” Experiences from the Core to the Edge Read More +

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Qualcomm Extends its Embedded Computing Portfolio and Brings its Premium Tier Processors for Cutting-Edge IoT Applications

Powerful, Energy-Efficient Qualcomm® Snapdragon™ 820E Embedded Platform Now Available Through Third-Party Distribution with Long-Term Support and Availability Feb. 21, 2018 – San Diego – Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., introduced the Qualcomm® Snapdragon™ 820E embedded platform and extended its embedded computing portfolio to support premium tier, cutting edge

Qualcomm Extends its Embedded Computing Portfolio and Brings its Premium Tier Processors for Cutting-Edge IoT Applications Read More +

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Mentor Embedded Linux Platform Supports New AMD EPYC Embedded and AMD Ryzen Embedded Processors

Mentor® Embedded Linux (MEL) platform supports AMD’s new EPYC™ Embedded 3000 and Ryzen™ Embedded V1000 processors based on high-performance x86 “Zen” architecture Targets industrial, medical, machine vision and learning, networking, and edge computing device applications, with superior performance and a suite of on-chip security features Mentor provides “out-of- the-box” embedded Linux support for hardware-accelerated applications

Mentor Embedded Linux Platform Supports New AMD EPYC Embedded and AMD Ryzen Embedded Processors Read More +

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