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Upcoming Webinar on AI Vision for Occupational Safety and Health

On November 25, 2025, at 9:30 am PST (12:30 pm EST), and on November 26, 2025 at 11:00 am CET (5:00am EST) Alliance Member company e-con Systems will deliver a webinar “Empowering Proactive Occupational Safety and Health (OSH) with AI-Powered Vision Solutions” From the event page: Join Our Exclusive Webinar on AI Vision for Occupational […]

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Upcoming Webinar Explores Real-time AI Sensor Fusion

On December 17, 2025, at 9:00 am PST (12:00 pm EST), Alliance Member companies e-con Systems, Lattice Semiconductor, and NVIDIA will deliver a joint webinar “Real-Time AI Sensor Fusion with e-con Systems’ Holoscan Camera Solutions using Lattice FPGA for NVIDIA Jetson Thor Platform.” From the event page: Join an exclusive webinar hosted by e-con Systems®,

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Cadence Welcomes ChipStack

This article was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. ChipStack, a leading startup providing agentic AI solutions for chip verification, and Cadence have announced an agreement for ChipStack to join the agentic AI team at Cadence. Founded by technologists with deep expertise in both AI and semiconductor

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Microchip Technology Unveils Model Context Protocol (MCP) Server to Power AI-Driven Product Data Access

Server enables access to trusted product information across AI platforms to simplify workflows, accelerate design and boost productivity CHANDLER, Ariz., November 6, 2025 — Further demonstrating its commitment to developing AI-enabled solutions for embedded engineers, Microchip Technology (Nasdaq: MCHP) has announced the launch of its Model Context Protocol (MCP) Server. An AI interface, the MCP Server connects directly with

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STMicroelectronics Empowers Data-Hungry Industrial Transformation with Unique Dual-Range Motion Sensor

Nov 6, 2025  Geneva, Switzerland Unique MEMS innovation means deeper contextual awareness for monitoring and safety equipment also in harsh environments Richly detailed motion and event tracking with simultaneous, independent sensing in high-g and low-g ranges Integrates ST’s advanced in-sensor edge AI for autonomy, performance, and power saving STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers

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BrainChip Unveils Breakthrough AKD1500 Edge AI Co-Processor at Embedded World North America

Laguna Hills, Calif. — November 4th, 2025 — BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), a global leader in ultra-low power, fully digital, event-based neuromorphic AI, today announced the launch of its AKD1500, a neuromorphic Edge AI accelerator co-processor chip, at Embedded World North America. Designed to deliver exceptional performance with minimal power consumption, the AKD1500 achieves 800 giga operations

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NXP Completes Acquisitions of Aviva Links and Kinara to Advance Automotive Connectivity and AI at the Intelligent Edge

EINDHOVEN, The Netherlands, Oct. 28, 2025 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ: NXPI) has announced the completion of its acquisitions of Aviva Links, and Kinara. On October 24, 2025, NXP closed the previously announced acquisition of Aviva Links for $243 million in cash before closing adjustments. Aviva Links is a provider of Automotive SerDes Alliance (ASA)

NXP Completes Acquisitions of Aviva Links and Kinara to Advance Automotive Connectivity and AI at the Intelligent Edge Read More +

Axelera Announces Europa AIPU, Setting New Industry Benchmark for AI Accelerator Performance, Power Efficiency and Affordability

Delivers 629 TOPs processing power for multi-modal AI applications from the edge to the data center. Eindhoven, NL – October 21, 2025 – Axelera AI, the leading provider of purpose-built AI hardware acceleration technology, today announced Europa™, an AI processor unit (AIPU) that sets a new performance/price standard for multi-user generative AI and computer vision applications.

Axelera Announces Europa AIPU, Setting New Industry Benchmark for AI Accelerator Performance, Power Efficiency and Affordability Read More +

Qualcomm Unveils AI200 and AI250: Redefining Rack-scale Data Center Inference Performance for the AI Era

Highlights: Qualcomm AI200 and AI250 solutions deliver rack-scale performance and superior memory capacity for fast data center generative AI inference at industry-leading total cost of ownership (TCO). Qualcomm AI250 introduces an innovative memory architecture, offering a generational leap in effective memory bandwidth and efficiency for AI workloads. Both solutions feature a rich software stack and

Qualcomm Unveils AI200 and AI250: Redefining Rack-scale Data Center Inference Performance for the AI Era Read More +

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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