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Arduino Announces Arduino VENTUNO Q, Powered by Qualcomm Dragonwing IQ8 Series

Industrial Vision (Computer Vision), News, Processors, Qualcomm, Robotics /

The new platform by the leading open-source hardware provider is purpose-built for generative AI, robotics, and actuation — making advanced capabilities accessible to all.   Ahead of Embedded World, Arduino announced the upcoming launch of its newest platform to democratize edge AI, Arduino® VENTUNO™ Q. Named after the Italian word for twenty-one​, VENTUNO Q builds on the iconic […]

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Intel Launches Core Series 2 Processor with Real-Time Performance and Expands Edge AI Portfolio

Intel, News, Processors /

New industrial-ready platform delivers breakthrough deterministic performance; sixth Edge AI suite targets healthcare applications   NUREMBERG, Germany — March 9, 2026 — At Embedded World 2026, Intel launched the Intel® Core™ processor Series 2 with P-cores, an industrial-ready platform engineered for mission-critical edge applications. Intel also announced its latest Edge AI suite for Health & Life Sciences, providing validated reference pipelines and benchmarking tools

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Synaptics Introduces SYN765x, an Industry-Leading AI-Native Wi-Fi® 7 Solution for Integrated IoT Edge Applications

Consumer, Industrial Vision (Computer Vision), News, Processors, Synaptics /

AN JOSE, Calif., Mar 10, 2026 — Synaptics Incorporated (Nasdaq: SYNA), today announced the SYN765x, an AI-native wireless solution that redefines Edge intelligence. As an industry-leading single-chip device combining AI-optimized compute with integrated Wi-Fi® 7, the SYN765x is designed to bring scalable, real-time intelligence directly to smart appliances, home automation systems, and Industrial IoT (IIoT) applications. SYN765x

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NXP’s New i.MX 93W Fuses Edge Compute and Secure Wireless Connectivity to Accelerate Physical AI

News, NXP Semiconductors, Processors /

Key Takeaways: First applications processor to combine an AI NPU with secure, tri-radio connectivity, replacing up to 60 discrete components with a single package Accelerates coordinated AI agent deployment with integrated edge compute and secure connectivity, supported by NXP software and eIQ® AI enablement Pre-certified designs simplify wireless certification, eliminating RF complexity and speeding time-to-market

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TI Accelerates the Next Generation of Physical AI with NVIDIA

D3 Embedded, News, NVIDIA, Processors, Robotics, Sensors and Cameras, Texas Instruments /

News highlights: TI and NVIDIA are collaborating to accelerate the path from simulation to the safe deployment of humanoid robots in the real world. As part of this collaboration, TI integrated its mmWave radar technology with NVIDIA Jetson Thor and NVIDIA Holoscan to enable low-latency 3D perception and safety awareness for physical AI applications. TI

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ModelCat AI Announces AI Model Portability Across Silicon Devices

Algorithms & Models, ModelCat, News /

An industry first, ModelCat’s Agentic AI generates models for new chips using a user’s current production models, dramatically accelerating inferencing to the edge. SUNNYVALE, Calif., March 5, 2026 /PRNewswire/ — ModelCat, the creator of the world’s first fully autonomous AI model builder, today announced its latest innovative platform capability: Model Retargeting (Patent Pending). Using Model Retargeting, ModelCat customers gain model

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STM32U3B5/U3C5: Bringing High-Performance DSP & Edge AI to Ultralow Power Designs

News, Processors, STMicroelectronics /

Built on the Arm® Cortex®‑M33 core, the STM32U3B5/U3C5 MCUs combine up to 2 Mbytes of dual‑bank flash memory with 640 Kbytes of RAM and are available in packages from 48 to 144 pins (UFQFPN, WLCSP, LQFP, and UFBGA). The lines introduce a hardware signal processor (HSP) to the STM32U3 portfolio, offloading complex DSP and edge‑AI workloads and

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Airy3D and Lattice to Showcase Compact, Integrated Humanoid and Robotic 3D Vision Demo at Embedded World 2026

Airy3D, Lattice Semiconductor, News, Processors, Sensors and Cameras /

Montreal, Canada — March 4, 2026 — Airy3D today announced a joint demonstration with Lattice Semiconductor highlighting a compact and compute-efficient 3D vision solution for humanoids and advanced robotics, which will be on display at Embedded World 2026. The demo combines Airy3D’s DepthIQ™ technology with a compact, low-power Lattice CrossLink™-NX FPGA to enable high-quality depth

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Upcoming Webinar on LLM-driven Driver Development

Algorithms & Models, Boston.AI, News, Software /

On March 19, 2026, at 1:00 pm EDT (10:00 am PDT) Boston.AI will deliver a webinar “Intelligent Driver Development with LLM Context Engineering ” From the event page: Developing even simple sensor drivers can consume valuable engineering time, requiring manual transcription of registers from datasheets into code—an error-prone and repetitive process. In this webinar, you’ll

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10xEngineers and Andes Enable High-Performance AI Compilation for RISC-V AX46MPV Cores

Algorithms & Models, Andes Technology, News, Processors /

Hsinchu, Taiwan – February 26, 2026 – The collaboration between 10xEngineers, a services company specializing in AI compilers, and Andes Technology Corporation, a leading provider of high-performance, low-power 32- and 64-bit RISC-V processor IP and a Founding Premier Member of RISC-V International, delivers first-class AI workload compilation for Andes AX46MPV cores using 10xEngineers’ AI graph compiler, Baltoro. This collaboration enables

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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