New class of processor raises the bar for performance efficiency, delivering 30% area savings and 20% lower power 08 May 2025 — SAN JOSE, Calif.— Cadence (Nasdaq: CDNS) today announced the Cadence® Tensilica® NeuroEdge 130 AI Co-Processor (AICP), a new class of processor designed to complement any neural processing unit (NPU) and enable end-to-end execution […]
The Edge AI and Vision Alliance 2025 CES Directory for game-changing computer vision and AI technologies Many Alliance Member companies will be showing off the latest building-block technologies that enable new capabilities for machines that see! CES is huge so we’ve created a handy checklist of these companies and where to find them including how
Alliance Members at 2025 CES Read More +
Amol Borkar, Product Marketing Director, and Shrinivas Gadkari, Design Engineering Director, both of Cadence, co-present the “Introduction to Visual Simultaneous Localization and Mapping (VSLAM)” tutorial at the May 2024 Embedded Vision Summit. Simultaneous localization and mapping (SLAM) is widely used in industry and has numerous applications where camera or ego-motion needs to be accurately determined.
Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica Vision P6 DSP for the latest generative AI (GenAI) applications. The Vision P6 DSP is a
Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica Vision Q7 DSP for Time-of-Flight (ToF) decoding. In this demonstration, the Tensilica Vision Q7 DSP integrated
Cadence Demonstration of Time-of-Flight Decoding on the Tensilica Vision Q7 DSP Read More +
Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica ConnX B10 DSP for automotive imaging radar applications. The ConnX B10 DSP is a highly efficient,
Cadence Demonstration of an Imaging Radar Applications on the Tensilica ConnX B10 DSP Read More +
Cadence verification and RTL-to-GDS digital full-flow tuned for automotive safety, quality and reliability requirements 18 Jun 2024 – At embedded world 2024, Cadence and Dream Chip demonstrated Dream Chip’s latest automotive SoC, which features the Cadence® Tensilica® Vision P6 DSP IP and Cadence design IP controllers and was taped out using the complete Cadence® Verification
Amol Borkar, Product Marketing Director at Cadence, presents the “Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors” tutorial at the May 2024 Embedded Vision Summit. From ADAS to autonomous vehicles to smartphones, the number and variety of sensors used in edge devices is increasing: radar, LiDAR, time-of-flight sensors and multiple cameras are
Highlights: Single DSPs for embedded vision, radar, lidar and AI processing boost performance while providing significant area, power and cost savings New radar accelerator provides a highly programmable hardware solution for offloading 4D imaging radar workloads, increasing performance Designed for sensor fusion processing in multi-sensor automotive, drone, robotics and autonomous vehicle system designs SAN JOSE,
This blog post was originally published at Arm’s website. It is reprinted here with the permission of Arm. AMBA is being extended to the chiplets market with the new CHI C2C specification. As Arm’s EVP and Chief Architect Richard Grisenthwaite said in this blog, Arm is collaborating across the ecosystem on standards to enable a
Ecosystem Collaboration Drives New AMBA Specification for Chiplets Read More +
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