Cadence

See How ams OSRAM Revolutionize Optical Solutions with the Help of Cadence Tools

Cadence, Medical, Processors, Videos /

OSRAM utilizes the Quantus SNA workflow for high-precision silicon. In modern semiconductor design, Heterogeneous Integration is the new frontier. When light detectors for Medical Imaging or depth sensors for Autonomous Systems are packed onto a single die alongside radio systems, the risk of interference skyrockets. For ‪ams OSRAM‬, “sensing the power of light” means more […]

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Cadence and NVIDIA Unveil Accelerated Engineering Solutions Purpose-Built for Agentic AI Chip and System Design​

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New agentic integrated circuit (IC) and physical AI accelerated solutions enable engineers to solve previously impossible chip, system and AI factory challenges   SAN JOSE, Calif.— Today, Cadence announced an expansion of its broad collaboration with NVIDIA to accelerate Cadence’s Design for AI and AI for Design strategy. The next generation of agentic AI design solutions includes autonomous,

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Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market

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Strategic collaborations with Samsung Foundry, Arm and others enable Cadence to deliver pre-validated chiplet solutions based on the Cadence Physical AI chiplet platform   SAN JOSE, Calif., January 6, 2026, — Cadence (Nasdaq: CDNS) today announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical

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Cadence Adds 10 New VIP to Strengthen Verification IP Portfolio for AI Designs

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This article was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. Cadence has unveiled 10 Verification IP (VIP) for key emerging interfaces tuned for AI-based designs, including Ultra Accelerator Link (UALink), Ultra Ethernet (UEC), LPDDR6, UCIe 3.0, AMBA CHI-H, Embedded USB v2 (eUSB2), and UniPro 3.0. These new VIP will

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Cadence Welcomes ChipStack

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This article was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. ChipStack, a leading startup providing agentic AI solutions for chip verification, and Cadence have announced an agreement for ChipStack to join the agentic AI team at Cadence. Founded by technologists with deep expertise in both AI and semiconductor

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Ambarella Redefines Edge AI Performance with Cadence

Ambarella, Blog Posts, Cadence, Processors /

This blog post was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. Ambarella stands at the forefront of edge AI processing, pioneering low-power, high-performance systems on chip (SoCs) that power a new generation of smart devices. Ambarella’s mission is to enable intelligence at the edge, from automotive systems that

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“Introduction to Radar and Its Use for Machine Perception,” a Presentation from Cadence

Algorithms & Models, Cadence, Object Identification, Object Tracking, Processors, Sensors and Cameras, Software, Summit 2025, Tools, Videos /

Amol Borkar, Product Marketing Director, and Vencatesh Subramanian, Design Engineering Architect, both of Cadence, co-present the “Introduction to Radar and Its Use for Machine Perception” tutorial at the May 2025 Embedded Vision Summit. Radar is a proven technology with a long history in various market segments and continues to play an increasingly important role in

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Upcoming Tech Talk Explores How to Solve Tomorrow’s AI Problems Today with Edge Co-processors

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Next Tuesday, July 15, 2025 at 8:00 am PT (11:00 am ET), Alliance Member company Cadence will deliver the free tech talk “Solving Tomorrow’s AI Problems Today with Cadence’s Newest Processor.” From the event page: The AI industry is undergoing a profound transformation, with evolving workloads demanding processors that deliver unparalleled efficiency, flexibility, and performance.

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Cadence Demonstration of Waveguide 4D Radar Central Computing on a Tensilica Vision DSP-based Platform

Automotive, Cadence, Object Identification, Object Tracking, Processors, Sensors and Cameras, Summit 2025, Videos /

Sriram Kalluri, Product Marketing Manager for Cadence Tensilica DSPs, demonstrates the company’s latest edge AI and vision technologies and products at the 2025 Embedded Vision Summit. Specifically, Kalluri demonstrates the use of the Tensilica Vision 130 (P6) DSP for advanced 4D radar computing for perception sensing used in ADAS applications. The Vision 130 DSP is

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Cadence Demonstration of a SWIN Shifted Window Vision Transform on a Tensilica Vision DSP-based Platform

Algorithms & Models, Cadence, Processors, Software, Summit 2025, Tools, Videos /

Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs, presents the company’s latest edge AI and vision technologies at the 2025 Embedded Vision Summit. Specifically, Borkar demonstrates the use of the Tensilica Vision 230 (Q7) DSP for advanced AI and transformer applications. The Vision 230 DSP is a highly efficient, configurable, and extensible processor

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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