Cadence

Cadence Adds 10 New VIP to Strengthen Verification IP Portfolio for AI Designs

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This article was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. Cadence has unveiled 10 Verification IP (VIP) for key emerging interfaces tuned for AI-based designs, including Ultra Accelerator Link (UALink), Ultra Ethernet (UEC), LPDDR6, UCIe 3.0, AMBA CHI-H, Embedded USB v2 (eUSB2), and UniPro 3.0. These new VIP will […]

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Cadence Welcomes ChipStack

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This article was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. ChipStack, a leading startup providing agentic AI solutions for chip verification, and Cadence have announced an agreement for ChipStack to join the agentic AI team at Cadence. Founded by technologists with deep expertise in both AI and semiconductor

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Ambarella Redefines Edge AI Performance with Cadence

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This blog post was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. Ambarella stands at the forefront of edge AI processing, pioneering low-power, high-performance systems on chip (SoCs) that power a new generation of smart devices. Ambarella’s mission is to enable intelligence at the edge, from automotive systems that

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“Introduction to Radar and Its Use for Machine Perception,” a Presentation from Cadence

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Amol Borkar, Product Marketing Director, and Vencatesh Subramanian, Design Engineering Architect, both of Cadence, co-present the “Introduction to Radar and Its Use for Machine Perception” tutorial at the May 2025 Embedded Vision Summit. Radar is a proven technology with a long history in various market segments and continues to play an increasingly important role in

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Upcoming Tech Talk Explores How to Solve Tomorrow’s AI Problems Today with Edge Co-processors

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Next Tuesday, July 15, 2025 at 8:00 am PT (11:00 am ET), Alliance Member company Cadence will deliver the free tech talk “Solving Tomorrow’s AI Problems Today with Cadence’s Newest Processor.” From the event page: The AI industry is undergoing a profound transformation, with evolving workloads demanding processors that deliver unparalleled efficiency, flexibility, and performance.

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Cadence Demonstration of Waveguide 4D Radar Central Computing on a Tensilica Vision DSP-based Platform

Automotive, Cadence, Object Identification, Object Tracking, Processors, Sensors and Cameras, Summit 2025, Videos /

Sriram Kalluri, Product Marketing Manager for Cadence Tensilica DSPs, demonstrates the company’s latest edge AI and vision technologies and products at the 2025 Embedded Vision Summit. Specifically, Kalluri demonstrates the use of the Tensilica Vision 130 (P6) DSP for advanced 4D radar computing for perception sensing used in ADAS applications. The Vision 130 DSP is

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Cadence Demonstration of a SWIN Shifted Window Vision Transform on a Tensilica Vision DSP-based Platform

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Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs, presents the company’s latest edge AI and vision technologies at the 2025 Embedded Vision Summit. Specifically, Borkar demonstrates the use of the Tensilica Vision 230 (Q7) DSP for advanced AI and transformer applications. The Vision 230 DSP is a highly efficient, configurable, and extensible processor

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Aizip Demonstration of Its Personal Offline AI Assistant for Biking on a Cadence Tensilica HiFi DSP Platform

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Nathan Francis, Head of Business Development at Aizip, demonstrates the company’s latest edge AI and vision technologies and products in Cadence’s booth at the 2025 Embedded Vision Summit. Specifically, Francis demonstrates the capabilities of his company’s small language model capable of running on a bike computer. You can’t assume internet connectivity when biking in the

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“Solving Tomorrow’s AI Problems Today with Cadence’s Newest Processor,” a Presentation from Cadence

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Amol Borkar, Product Marketing Director at Cadence, presents the “Solving Tomorrow’s AI Problems Today with Cadence’s Newest Processor” tutorial at the May 2025 Embedded Vision Summit. Artificial intelligence is rapidly integrating into every aspect of technology. While the neural processing unit (NPU) often receives the majority of the spotlight as… “Solving Tomorrow’s AI Problems Today

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Cadence Accelerates Physical AI Applications with Tensilica NeuroEdge 130 AI Co-processor

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New class of processor raises the bar for performance efficiency, delivering 30% area savings and 20% lower power 08 May 2025 — SAN JOSE, Calif.— Cadence (Nasdaq: CDNS) today announced the Cadence® Tensilica® NeuroEdge 130 AI Co-Processor (AICP), a new class of processor designed to complement any neural processing unit (NPU) and enable end-to-end execution

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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