Cadence

“Introduction to Radar and Its Use for Machine Perception,” a Presentation from Cadence

Algorithms, Cadence, Object Identification, Object Tracking, Processors, Sensors and Cameras, Software, Summit 2025, Tools, Videos /

Amol Borkar, Product Marketing Director, and Vencatesh Subramanian, Design Engineering Architect, both of Cadence, co-present the “Introduction to Radar and Its Use for Machine Perception” tutorial at the May 2025 Embedded Vision Summit. Radar is a proven technology with a long history in various market segments and continues to plays an increasingly important role in […]

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Upcoming Tech Talk Explores How to Solve Tomorrow’s AI Problems Today with Edge Co-processors

Cadence, News, Processors, Tools /

Next Tuesday, July 15, 2025 at 8:00 am PT (11:00 am ET), Alliance Member company Cadence will deliver the free tech talk “Solving Tomorrow’s AI Problems Today with Cadence’s Newest Processor.” From the event page: The AI industry is undergoing a profound transformation, with evolving workloads demanding processors that deliver unparalleled efficiency, flexibility, and performance.

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Cadence Demonstration of Waveguide 4D Radar Central Computing on a Tensilica Vision DSP-based Platform

Automotive, Cadence, Object Identification, Object Tracking, Processors, Sensors and Cameras, Summit 2025, Videos /

Sriram Kalluri, Product Marketing Manager for Cadence Tensilica DSPs, demonstrates the company’s latest edge AI and vision technologies and products at the 2025 Embedded Vision Summit. Specifically, Kalluri demonstrates the use of the Tensilica Vision 130 (P6) DSP for advanced 4D radar computing for perception sensing used in ADAS applications. The Vision 130 DSP is

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Cadence Demonstration of a SWIN Shifted Window Vision Transform on a Tensilica Vision DSP-based Platform

Algorithms, Cadence, Processors, Software, Summit 2025, Tools, Videos /

Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs, presents the company’s latest edge AI and vision technologies at the 2025 Embedded Vision Summit. Specifically, Borkar demonstrates the use of the Tensilica Vision 230 (Q7) DSP for advanced AI and transformer applications. The Vision 230 DSP is a highly efficient, configurable, and extensible processor

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Aizip Demonstration of Its Personal Offline AI Assistant for Biking on a Cadence Tensilica HiFi DSP Platform

Cadence, Processors, Summit 2025, Videos /

Nathan Francis, Head of Business Development at Aizip, demonstrates the company’s latest edge AI and vision technologies and products in Cadence’s booth at the 2025 Embedded Vision Summit. Specifically, Francis demonstrates the capabilities of his company’s small language model capable of running on a bike computer. You can’t assume internet connectivity when biking in the

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“Solving Tomorrow’s AI Problems Today with Cadence’s Newest Processor,” a Presentation from Cadence

Cadence, Processors, Summit 2025, Tools, Videos /

Amol Borkar, Product Marketing Director at Cadence, presents the “Solving Tomorrow’s AI Problems Today with Cadence’s Newest Processor” tutorial at the May 2025 Embedded Vision Summit. Artificial intelligence is rapidly integrating into every aspect of technology. While the neural processing unit (NPU) often receives the majority of the spotlight as… “Solving Tomorrow’s AI Problems Today

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Cadence Accelerates Physical AI Applications with Tensilica NeuroEdge 130 AI Co-processor

Cadence, News, Processors, Tools /

New class of processor raises the bar for performance efficiency, delivering 30% area savings and 20% lower power 08 May 2025 — SAN JOSE, Calif.— Cadence (Nasdaq: CDNS) today announced the Cadence® Tensilica® NeuroEdge 130 AI Co-Processor (AICP), a new class of processor designed to complement any neural processing unit (NPU) and enable end-to-end execution

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Alliance Members at 2025 CES

AiM Future, Airy3D, Au-Zone Technologies, Axelera AI, BrainChip, Cadence, Ceva, CLIKA, Commonlands, D3 Embedded, DEEPX, Digica, e-con Systems, Edge AI and Vision Alliance, Embedl, ENERZAi, eYs3D Microelectronics, Geisel Software, Gimlet Labs, Hailo, Inuitive, Microchip Technology, News, Nextchip, Nota AI, NXP Semiconductors, OpenMV, Piera Systems, Quadric, Texas Instruments, VeriSilicon, videantis, Visionary.ai /

The Edge AI and Vision Alliance 2025 CES Directory for game-changing computer vision and AI technologies Many Alliance Member companies will be showing off the latest building-block technologies that enable new capabilities for machines that see! CES is huge so we’ve created a handy checklist of these companies and where to find them including how

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“Introduction to Visual Simultaneous Localization and Mapping (VSLAM),” a Presentation from Cadence

Algorithms, Cadence, Object Identification, Object Tracking, Processors, Sensors and Cameras, Software, Summit 2024, Tools, Videos /

Amol Borkar, Product Marketing Director, and Shrinivas Gadkari, Design Engineering Director, both of Cadence, co-present the “Introduction to Visual Simultaneous Localization and Mapping (VSLAM)” tutorial at the May 2024 Embedded Vision Summit. Simultaneous localization and mapping (SLAM) is widely used in industry and has numerous applications where camera or ego-motion needs to be accurately determined.

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Cadence Demonstration of a Large Vision Model for Generative AI on the Tensilica Vision P6 DSP

Algorithms, Cadence, Object Identification, Object Tracking, Processors, Software, Summit 2024, Tools, Videos /

Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs and Automotive Segment Director, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Borkar demonstrates the use of a Tensilica Vision P6 DSP for the latest generative AI (GenAI) applications. The Vision P6 DSP is a

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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