Processors

Using Generative AI to Enable Robots to Reason and Act with ReMEmbR

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. Vision-language models (VLMs) combine the powerful language understanding of foundational LLMs with the vision capabilities of vision transformers (ViTs) by projecting text and images into the same embedding space. They can take unstructured multimodal data, reason over […]

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“Ten Commandments for Building a Vision AI Product,” a Presentation from Hayden AI

Vaibhav Ghadiok, Chief Technology Officer of Hayden AI, presents the “Ten Commandments for Building a Vision AI Product” tutorial at the May 2024 Embedded Vision Summit. Over the past three decades, the convergence of machine learning, big data and enhanced computing power has transformed the field of computer vision from basic image and signal processing

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Renesas Leads ADAS Innovation with Power-efficient 4th-generation R-Car Automotive SoCs

New R-Car V4M & V4H SoC Devices Target High-Volume L2 and L2+ ADAS Market While Maintaining Scalability and Software Reusability with Existing R-Car Devices TOKYO, Japan, September 24, 2024 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its popular R-Car Family of system-on-chips (SoCs) for entry-level Advanced Driver Assistance

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Intel Unveils Next-generation AI Solutions with the Launch of Xeon 6 and Gaudi 3

NEWS HIGHLIGHTS Intel launches Xeon 6 with Performance-cores (P-cores), doubling the performance for AI and HPC workloads. New Gaudi 3 AI accelerators offer up to 20 percent more throughput and 2x price/performance vs H100 for inference of LLaMa 2 70B1. SANTA CLARA, Calif., September 24, 2024 – As AI continues to revolutionize industries, enterprises are

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Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications

Partnership enables AI developers to train, optimize and deploy embedded ML models on the Ceva-NeuPro-Nano NPU IP, pre-silicon, via Edge Impulse Platform ROCKVILLE, Md., Sept. 24, 2024 /PRNewswire/ — Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and

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“Why Amazon Failed and the Future of Computer Vision in Retail,” an Interview with Grabango

Will Glaser, Founder and CEO of Grabango, talks with Junko Yoshida, Editor-in-Chief of the Ojo-Yoshida Report, for the “Why Amazon Failed and the Future of Computer Vision in Retail” interview at the May 2024 Embedded Vision Summit. Grabango’s checkout-free shopping system allows you to shop in grocery and convenience stores without having to scan your

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AI Smartphones to Make 54% of Total Smartphone Shipments by 2028, 3x More Than This Year

The global demand for AI smartphones, especially among the younger tech-savvy consumers, continues rising despite these devices being in the premium or flagship segment of the market and costing more than the average device. With the industry heavyweights Apple and Samsung releasing their latest AI models and almost every upcoming smartphone having plans to incorporate

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Altera Accelerating FPGA-based Innovations from Edge to Cloud with Scalable Portfolio

New programmable hardware, software, and development tools are optimized to drive developer productivity and intelligent compute across a broad range of use cases. What’s New: Altera, an Intel® Company, today unveiled an array of FPGA hardware, software and development tools that make its programmable solutions more accessible across a broader range of use cases and

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Demand Trends to Drive High-end Performance Semiconductor Packaging Revenues

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Market to grow in significance as data centers, in particular artificial intelligence (AI), HPC and autonomous vehicles increase high-performance demand. The high-end performance packaging market is exhibiting strong revenue growth, driven by

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“Latest Trends in AI Semiconductors,” an Interview with D2D Advisory

Jay Goldberg, CEO and Founder of D2D Advisory, talks with Phil Lapsley, Co-Founder and Vice President of BDTI and Vice President of Business Development at the Edge AI and Vision Alliance, for the “Latest Trends in AI Semiconductors” interview at the May 2024 Embedded Vision Summit. In this wide-ranging, insightful and lively discussion, you’ll hear

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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