This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. As semiconductor devices continue to scale down in size and ramp up in performance, one challenge stands out above many others: thermal behavior. Heat isn’t just a byproduct of activity in modern chips; it’s one of the pivotal […]
Thermal-Aware Testing Strategies for Next-Gen Semiconductor Devices Read More +
Athish Rahul Rao, Staff Software Engineer at Expedera presents “From Compute-Bound to Memory-Bound: Edge AI Architectures for VLMs” at the May 2026 Embedded Vision Summit. Today’s edge AI hardware was built for CNNs, but vision language models (VLMs) have completely different bottlenecks—especially in safety-critical, latency-sensitive applications like in-cabin automotive intelligence.… “From Compute-Bound to Memory-Bound: Edge
Barrie Mullins, Assistant Vice President at eInfochips (an Arrow company) presents “Navigating Physical AI Deployment Across Multiple Platforms for Automated Optical Inspection” at the May 2026 Embedded Vision Summit. As automated optical inspection moves from the server room to the factory floor, the promise of “seamless” AI deployment often hits… “Navigating Physical AI Deployment Across
On June 30, 2026 at 8:00 am PT (11:00 ET), Peridio, NXP and ipXchange will present the webinar “The Engineer’s Guide to Simplifying Embedded Linux Development: Building with Avocado OS on i.MX Applications Processor.” Here’s the description, from the event registration page: The demand for AI-enabled edge devices – including robotics, smart vision systems, and
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Shang-Hung Lin, Vice President of NPU Technology at VeriSilicon presents “One Silicon, Two Worlds: NPU Optimization for Autoregressive and Diffusion Transformers” at the May 2026 Embedded Vision Summit. Physical AI is caught between two computational titans: autoregressive (AR) transformers, which predict discrete action tokens, and diffusion transformers (DiTs), which refine… “One Silicon, Two Worlds: NPU
Palette Neat, alongside the production-ready, pin-compatible Modalix™ SoM, dismantles the legacy GPU moat to scale Physical AI SAN JOSE, Calif. — June 16, 2026 — SiMa.ai, a leader in Physical AI, today launched Palette Neat™, the industry’s first agentic development environment for Physical AI that collapses complex application timelines from months to days. The
New family delivers breakthrough power reduction, System-in-Package integration, high-speed MIPI I/O, advanced SEU scrubbing, and post-quantum security for constrained edge AI deployments Cupertino, Calif.—June 9, 2026—Efinix® Inc., the FPGA pioneer accelerating edge AI innovation, today announced the Titanium Edge™ family of FPGAs, purpose-built for the most demanding edge AI applications. Built on the company’s proven Titanium
Efinix Launches Titanium Edge FPGA Family, Solving the Demanding Requirements of Edge AI Read More +
On June 23, 2026, at 8:00 am PDT (11:00 am EDT / 17:00 CEST) STMicroelectronics, eInfochips and Arrow will deliver a webinar “A Prevalidated AMR Reference Platform for Faster Industrial Robotics Development” From the event page: STMicroelectronics and Arrow Electronics are introducing a new industrial autonomous mobile robot (AMR) reference platform built to help teams
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On July 25, 2026, at 1:00 pm PDT (4:00 pm EDT) Lattice Semiconductor will deliver a webinar “The Future of Robotics: Real-Time Perception, Edge AI, & the Role of FPGAs” From the event page: As robotics systems evolve from traditional automation to intelligent, perception-driven platforms, new architectural considerations are emerging around real-time sensing, data processing,
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Olivier Bloch, Director of Developer Relations at Qualcomm Technologies, Inc. presents “Democratizing Physical AI: Arduino’s Open Door to Qualcomm’s Platform” at the May 2026 Embedded Vision Summit. Scaling physical AI breaks at production: prototypes work, then teams rewrite everything for incompatible SDKs, models and control stacks. The core issue is… “Democratizing Physical AI: Arduino’s Open
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