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STMicroelectronics and Leopard Imaging Accelerate Robotics Vision with NVIDIA Jetson-ready Multi-sensor Module
Key Takeaways Multimodal module combining 2D imaging, 3D depth sensing, and human-like motion perception NVIDIA Holoscan Sensor Bridge ensuring multi-gigabit
HSP: The new hardware accelerator that transforms an ultra-low-power STM32U3 into an AI machine
This blog post was originally published at STMicroelectronics’s website. It is reprinted here with the permission of STMicroelectronics. ST is launching
NVIDIA, T-Mobile and Partners Integrate Physical AI Applications on AI-RAN-Ready Infrastructure
News Summary: T-Mobile pilots NVIDIA RTX PRO 6000 Blackwell Server Edition AI infrastructure to demonstrate physical AI applications at the
Lattice Joins NVIDIA Halos Ecosystem to Advance Safety for Physical AI with Holoscan Sensor Bridge
HILLSBORO, Ore. – Mar. 16, 2026 – Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced it has joined the NVIDIA Halos
NVIDIA and Global Robotics Leaders Take Physical AI to the Real World
News Summary: Physical AI leaders across robot brain developers, industrial, and surgical robot giants and humanoid pioneers including ABB Robotics,
NXP Delivers New Innovations for Advanced Physical AI with NVIDIA
Key Takeaways: Secure, reliable real-time data processing and transport solutions for next-generation physical AI applications, developed in collaboration with NVIDIA
AI at the Edge: Designing for Constraints from Day One
This blog post was originally published at ModelCat’s website. It is reprinted here with the permission of ModelCat. Artificial intelligence
Introducing the Electronics Industry’s First AI Agent with Visual Reasoning
This blog post was originally published at Rapidflare’s website. It is reprinted here with the permission of Rapidflare. AI has made
Renesas Announces General Availability of Renesas 365
NUREMBERG, Germany and TOKYO, Japan — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the
News
Cadence and NVIDIA Unveil Accelerated Engineering Solutions Purpose-Built for Agentic AI Chip and System Design
New agentic integrated circuit (IC) and physical AI accelerated solutions enable engineers to solve previously impossible chip, system and AI factory challenges SAN JOSE, Calif.— Today, Cadence announced an expansion of its broad collaboration with NVIDIA to accelerate Cadence’s Design for AI and AI for Design strategy. The next generation of agentic AI design solutions includes autonomous,
STMicroelectronics and Leopard Imaging Accelerate Robotics Vision with NVIDIA Jetson-ready Multi-sensor Module
Key Takeaways Multimodal module combining 2D imaging, 3D depth sensing, and human-like motion perception NVIDIA Holoscan Sensor Bridge ensuring multi-gigabit plug and play connectivity with Jetson platforms Fully supported by NVIDIA Isaac open robot development platform STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining
NVIDIA, T-Mobile and Partners Integrate Physical AI Applications on AI-RAN-Ready Infrastructure
News Summary: T-Mobile pilots NVIDIA RTX PRO 6000 Blackwell Server Edition AI infrastructure to demonstrate physical AI applications at the edge, complementing the AI-RAN Innovation Center’s distributed network Physical AI developers including Fogsphere, LinkerVision, Levatas, Vaidio and Siemens Energy are building reasoning and vision AI agents to the edge using the NVIDIA Metropolis Blueprint for
Market Analysis
Drones Market 2026-2036: Technologies, Markets, and Opportunities
This article was originally published at IDTechEx’s website. It is reprinted here with the permission of IDTechEx. Global Drone Market Set to Reach US$147.8 Billion by 2036, Driven by Commercial Expansion, Regulatory Maturity, and Sensor Proliferation Over the past decade, drones have moved from experimental tools into critical infrastructure across agriculture, logistics, energy, security, and public-sector
Microcontrollers Enter a New Growth Cycle as the Market Targets US$34 Billion in 2030
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Yole Group releases its annual Status of the Microcontroller Industry report and expands its quarterly Microcontroller Market Monitor, delivering long-range strategic insights and detailed market tracking Key Takeaways: The global MCU market
New IDTechEx Report: Sensor Market 2026-2036
This article was originally published at IDTechEx’s website. It is reprinted here with the permission of IDTechEx. IDTechEx forecasts that the global sensor market will reach US$250B by 2036 as global mega-trends in mobility, AI, robotics, 6G connectivity and IoT drive sensor demand. IDTechEx’s newly updated “Sensor Market 2026-2036: Technologies, Trends, Players, Forecasts” report provides extensive
Blog
AI-Assisted Coding: The Next Step in Abstraction
I’ve been using AI-assisted coding for my work a lot recently, and I’ll admit, I wasn’t sure how I felt about it. Was I cheating? How do I know it’s right? Do I admit to using it? Looking at how software development has evolved over time helped answer those questions and led to a few
UCIe & Chiplets: A Practical Guide to Modular SoC Design
This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. The semiconductor industry is undergoing a paradigm shift. Traditional monolithic System-on-Chip (SoC) designs are giving way to modular architectures that leverage interoperable chiplets. At the heart of this evolution is Universal Chiplet Interconnect Express (UCIe). This open standard
HSP: The new hardware accelerator that transforms an ultra-low-power STM32U3 into an AI machine
This blog post was originally published at STMicroelectronics’s website. It is reprinted here with the permission of STMicroelectronics. ST is launching today its hardware signal processor (HSP), a new hardware unit that the industry will experience in more and more of our upcoming STM32 microcontrollers, starting today with our new STM32U3B5/C5 devices featuring 2 MB of flash. In a
