Brian Dipert

January 26, 2023 Edge AI and Vision Alliance Member Briefing Presentations

The PDF files linked to below are the presentations from the January 26, 2023 Edge AI and Vision Alliance Member Briefing sessions. Please be aware that these materials are for Alliance Member company internal use only. January 26, 2023 Edge AI and Vision Alliance Member Briefing (Alliance) January 26, 2023… January 26, 2023 Edge AI […]

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Developments in Semiconductor Photonics: More Data, More Quickly

As high-performance computing, artificial intelligence and machine learning algorithms, and even consumers become increasingly data-hungry, hardware struggles to keep pace. In addition, the need for real-time assessments of moving data points – such as for the accurate velocity-mapping of other objects in autonomous systems and facial recognition for security systems – is crucial to an

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SECO Joins Axelera AI’s Ecosystem as Sole European Developer of Innovative AI Accelerators Based on Metis AI Platform

Eindhoven/Arezzo, January 17, 2023 – Axelera AI B.V. (“Axelera AI”) has chosen SECO as the sole European developer of edge AI solutions based on its recently announced MetisTM AI Platform, a high-performance, cost effective and user-friendly platform combining hardware and software to accelerate computer vision at the edge. SECO will gain early access to Axelera

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Photonics West: MIPI Cameras and Components for Fast, Easy and Cost-efficient Embedded Vision Integration

January 17, 2023 – At Photonics West (San Francisco, January 28 – February 2), Vision Components will be showcasing new MIPI camera modules and components that make the integration of embedded vision even faster, easier and more cost-efficient. The highlight will be the FPGA-based hardware accelerator VC Power SoM, which completes complex image processing calculations

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Teledyne to Present Its Newest Scientific Imaging and Machine Vision Solutions at SPIE’s Photonics West Exhibition

Trenton, New Jersey, USA, January 17, 2023 – Teledyne will showcase their newest products and solutions at SPIE’s Photonics West exhibition taking place January 31 – February 2nd, 2023, in San Francisco, California. Visitors to the Teledyne booth #1527 can expect representation from the businesses within its Imaging group, including Teledyne DALSA, e2v, FLIR, Imaging

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How Qualcomm Technologies is Unlocking the Power of Machine Learning

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Meet the researchers bringing AI to the connected intelligent edge. Since its founding in 2018, Qualcomm AI Research has developed into a vital resource for the industry, impacting virtually every technology vertical, from wireless to automotive, XR,

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Ultinous AI Video Analytics Works with Nx

This video was originally published at Network Optix’ website. It is reprinted here with the permission of Network Optix. Ultinous provides forensic and real-time video analytics on edge and in the cloud for real-world health and safety and security applications. Ultinous AI Video Analytics is integrated with Powered by Nx products via the HTTP REST

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BrainChip Showcases Compelling Benchmarks and Recommends Better Metrics for AI Devices at the Edge

Laguna Hills, Calif. – January 15, 2023 – A new white paper by BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, evaluates the current state of edge AI benchmarks and the need to continually improve metrics that measure performance and

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Urban Pothole Detection – Use Case

This blog post was originally published at Au-Zone Technologies’ website. It is reprinted here with the permission of Au-Zone Technologies. Cost of Potholes in the Urban Environment A country such as Canada, where the temperature fluctuates on a regular basic, increases the odds of potholes on highway/motorways. Increased number of potholes not only lead to

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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