Brian Dipert

CEVA’s High-Performance DSP Solution to Power Renesas’ Next-Generation Automotive SoC

Automotive, Ceva, News, Processors, Renesas /

Rockville, MD., – November 11, 2020 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC). “We are honored that Renesas, a world leading automotive semiconductor supplier, has selected our leading-edge DSP […]

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“Acceleration of Deep Learning Using OpenVINO: 3D Seismic Case Study,” a Presentation from Intel

Intel, Processors, Summit 2020, Tools, Videos /

Manas Pathak, Global AI Lead for Oil and Gas at Intel, presents the “Acceleration of Deep Learning Using OpenVINO: 3D Seismic Case Study” tutorial at the September 2020 Embedded Vision Summit. The use of deep learning for automatic seismic data interpretation is gaining the attention of many researchers across the oil and gas industry. The

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CIS Represents 5.1% of Global Semiconductor Sales in 2021. What is Next?

Market Analysis, Sensors and Cameras, Yole Group /

OUTLINE: Market figures & trends: Yole Développement (Yole) envisions a growing future for the CIS industry at 5.7% CAGR. This growth is showing tighter links to the growth of semiconductor in general. Mobile keeps the most important role for CIS. In parallel, security and automotive have emerged. The impact of the Huawei ban has been

CIS Represents 5.1% of Global Semiconductor Sales in 2021. What is Next? Read More +

MediaTek Unveils Its Newest 5G Chipset, Dimensity 700, For Mass Market 5G Smartphones

MediaTek, News, Processors /

Dimensity 700 caters to growing consumer demand for 5G devices HSINCHU, Taiwan – November 10, 2020 – MediaTek today unveiled its new Dimensity 700 5G smartphone chipset, a 7nm SoC designed to bring advanced 5G capabilities and experiences to the mass market. The addition of the Dimensity 700 to MediaTek’s Dimensity family of 5G chips gives

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MediaTek Announces New MT8192 and MT8195 Chipsets Designed for Next Generation of Chromebooks

MediaTek, News, Processors /

New chipsets to power premium and mainstream Chromebooks and enhance computing experiences HSINCHU, Taiwan – November 10, 2020 – MediaTek today unveiled its MT8192 and MT8195 chipsets for the next generation of Chromebooks. With the 7nm MT8192 for mainstream devices and the 6nm MT8195 for premium devices, brands can design powerful, sleek and lightweight Chromebooks that

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AMD Unveils AMD Ryzen Embedded V2000 Processors with Enhanced Performance and Power Efficiency

AMD, News, Processors /

AMD Ryzen Embedded V2000 Series processors deliver double the cores1, up to 2x the performance-per-watt2 and an estimated 15 percent IPC uplift3 over the previous generation SANTA CLARA, Calif. – 11/10/2020 AMD (NASDAQ: AMD) today launched a new product in its high-performance Embedded processor family, the AMD Ryzen™ Embedded V2000 Series processor. Built on the innovative 7nm

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MediaTek Introduces i350 Edge AI Platform Designed for Voice and Vision Processing Applications

MediaTek, News, Processors /

The low-power i350 brings reliable connectivity and advanced multimedia features to edge AI devices HSINCHU, Taiwan – October 13, 2020 – MediaTek today announced the i350, a highly integrated Edge AI platform with a dedicated APU (AI processor) and digital signal processor (DSP) for AIoT products that require vision and voice edge processing. The i350

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OmniVision, Ambarella and Smart Eye Partner on Automotive Industry’s First Combined Driver Monitoring and Videoconferencing Camera Solution

Ambarella, Automotive, OmniVision, Processors, Sensors and Cameras /

Reference Design Combines OmniVision’s Dual-Mode Global Shutter Image Sensor for Both RGB and IR Imaging With Ambarella’s AI Vision Processor and Smart Eye’s AI DMS Software Algorithm SANTA CLARA, Calif. – Nov. 10, 2020 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, Ambarella, Inc. (Nasdaq: AMBA), an AI vision silicon company,

OmniVision, Ambarella and Smart Eye Partner on Automotive Industry’s First Combined Driver Monitoring and Videoconferencing Camera Solution Read More +

“Federated Edge Computing System Architectures,” a Presentation from Intel

Intel, Processors, Summit 2020, Videos /

Vaidyanathan Krishnamoorthy, Edge Inference Solutions Architect at Intel, presents the “Federated Edge Computing System Architectures” tutorial at the September 2020 Embedded Vision Summit. With ever-increasing amounts of video and other sensor data, and growing requirements for privacy and low latency, inferencing at the edge is increasingly attractive. But there are many ways to allocate and

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Simplifying Designs with FRAMOS IP Core for SLVS-EC v2.0

FRAMOS, News, Sensors and Cameras /

November 9, 2020 – FRAMOS‘s SLVS-EC RX IP Core Development Kit comes with comprehensive support for those looking to connect with sensors using the SLVS-EC interface. This new, scalable, 2.0 version SLVS-EC high-speed interface supports a higher data rate for all 8 lanes at 5 Gbps throughput per lane, up from the previous 2.5Gbps speeds.

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Walnut Creek, CA 94596

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