Brian Dipert

“2D and 3D Sensing: Markets, Applications, and Technologies,” a Presentation from Yole Développement

Guillaume Girardin, Photonics, Sensing and Display Division Director at Yole Développement, delivers the presentation “2D and 3D Sensing: Markets, Applications, and Technologies” at the Embedded Vision Alliance’s September 2019 Vision Industry and Technology Forum. Girardin details the optical depth sensor market and application trends.

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Gyrfalcon’s New Chip Raises Bar (12.6 TOPS/W) on High Performance Edge AI with Lower Power Use

Device Makers Gain More Design Choices for Leading Edge AI Enabled Capabilities Using GTI’s Discrete AI Accelerator Chip MILPITAS, Calif., Nov. 14, 2019 /PRNewswire/ — Gyrfalcon Technology Inc.’s introduces its AI Accelerator Chip, the Lightspeeur® 5801, which raises the bar for high performance Edge AI with low energy use. It is the fourth chip in the company’s

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AImotive Demonstration of Scaling to Solve Self-Driving Challenges

Gabor Pongracz, Product Manager at AImotive, demonstrates the company’s latest embedded vision technologies and products at the 2019 Embedded Vision Summit. Specifically, Pongracz demonstrates how the company’s aiSim and aiDrive software, along with the hardware-accelerated aiWare processor core, enable it to scale to solve self-driving challenges at various autonomy levels.

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At Annual Snapdragon Tech Summit, Qualcomm Unveils Roadmap for Bringing 5G Mainstream in 2020

Day 1 Keynote Introduces Two New 5G Snapdragon Mobile Platforms, Modular 5G Platforms and New 3D Sonic Fingerprint Technology Dec 3, 2019 – Hawaii – During the first day of the annual Snapdragon Tech Summit, Qualcomm Incorporated President, Cristiano Amon took to the stage with ecosystem leaders from across the globe to declare 2020 as

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Embedded Vision Insights: December 3, 2019 Edition

LETTER FROM THE EDITOR Dear Colleague, In two weeks, on Tuesday, December 17 at 9 am PT, Hailo will deliver the free webinar "A Computer Architecture Renaissance: Energy-efficient Deep Learning Processors for Machine Vision" in partnership with the Embedded Vision Alliance. Hailo has developed a specialized deep learning processor that delivers the performance of a

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UNISOC and Imagination Carry Out Strategic Cooperation on AI Based on IMG Series3NX Neural Network Accelerator

LONDON, UK and Beijing, China; 3rd  December 2019 – Imagination Technologies announces that UNISOC, a leading fabless semiconductor company, has licenced its latest generation of neural network accelerator (NNA), IMG Series3NX for use in future system-on-chips (SoCs) targeting mid-high range mobile devices, TV and other markets. UNISOC previously integrated Imagination’s Series2NX AI core into its

UNISOC and Imagination Carry Out Strategic Cooperation on AI Based on IMG Series3NX Neural Network Accelerator Read More +

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Imagination Launches IMG A-Series: “The GPU of Everything”

The fastest GPU IP ever Shanghai, China; 3rd December 2019 – Imagination Technologies announces the tenth generation of its PowerVR graphics architecture, the IMG A-Series. The fastest GPU IP ever released, IMG A-Series evolves the PowerVR GPU architecture to fulfil the graphics and compute needs of the full spectrum of next-generation devices. Designed to be

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Synopsys Demonstration of Performance Scaling On the ARC EV6x Embedded Vision Processor IP with CNN Engine

Gordon Cooper, Product Marketing Manager at Synopsys, demonstrates the company’s latest embedded vision technologies and products at the 2019 Embedded Vision Summit. Specifically, Cooper discusses deep leaning computer vision scaling challenges while demonstrating the DesignWare ARC EV6x with CNN Engine IP running on a HAPS FPGA-based prototyping system. The demo shows the performance changes between

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Walnut Creek, CA 94596

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