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Brian Dipert

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Baidu Deploys Xilinx FPGAs in New Public Cloud Acceleration Services

Target applications to include machine learning and data security SAN JOSE, Calif., July 5, 2017 /PRNewswire/ — Xilinx, Inc. (XLNX) today announced that Baidu has deployed Xilinx FPGA-based application acceleration services in their public cloud. The Baidu FPGA Cloud Server, a new service in Baidu Cloud, features highly efficient Xilinx® Kintex® FPGAs, tools, and the […]

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“Fast Inference in Low Power Systems via CEVA’s Deep Neural Network Solution,” a Presentation from CEVA

Yair Siegel, Director of Strategic Marketing at CEVA, presents the "Fast Inference in Low Power Systems via CEVA’s Deep Neural Network Solution" tutorial at the May 2017 Embedded Vision Summit. The emergence of state-of-the-art, real-time object detection solely based on convolutional neural networks has created new and complex challenges for embedded systems. Algorithms such as

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May 2017 Embedded Vision Summit Introductory Presentation (Day 1)

Jeff Bier, Founder of the Embedded Vision Alliance, welcomes attendees to the May 2017 Embedded Vision Summit on May 1, 2017 (Day 1). Bier provides an overview of the embedded vision market opportunity, challenges, solutions and trends. He also introduces the Embedded Vision Alliance and the resources it offers for both product creators and potential

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“Scalable Neural Network Processors for Embedded Applications,” a Presentation from Cadence

Pulin Desai, Director of Product Marketing at Cadence, presents the "Scalable Neural Network Processors for Embedded Applications" tutorial at the May 2017 Embedded Vision Summit. This presentation describes the architecture of the latest Tensilica-based neural network processor IP and illustrates how easily different neural networks can be run using it. See how this low-power architecture

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“Developing Real-time Video Applications with CoaXPress,” A Presentation from Euresys

Jean-Michel Wintgens, Vice President of Engineering at Euresys, presents the "Developing Real-time Video Applications with CoaXPress" tutorial at the May 2017 Embedded Vision Summit. CoaXPress is a modern, high-performance video transport interface. Using a standard coaxial cable, it provides a point-to-point connection that is reliable, scalable and versatile. Wintgens shows, using real application cases and

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“How Intel’s Latest RealSense Technology Can Help Your Embedded Systems See, Navigate, and Understand the Real World,” a Presentation from Intel

Anders Grunnet-Jepsen, CTO and Director of Advanced Technology in the Perceptual Computing Group at Intel, presents the "How Intel’s Latest RealSense Technology Can Help Your Embedded Systems See, Navigate, and Understand the Real World" tutorial at the May 2017 Embedded Vision Summit. Intel’s latest RealSense technology is specifically designed to enable highly sophisticated, low-cost, small

“How Intel’s Latest RealSense Technology Can Help Your Embedded Systems See, Navigate, and Understand the Real World,” a Presentation from Intel Read More +

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AImotive Releases aiWare: The First of Its Kind, AI-Optimized Hardware Accelerator For Autonomous Driving

VeriSilicon Signs on as First Strategic Partner to utilize aiWare’s Hardware IP, which is 20x More Efficient than Leading AI Acceleration Hardware Solutions MOUNTAIN VIEW and SANTA CLARA, Calif., June 29, 2017 – AImotive (www.aimotive.com) today announced its much anticipated, AI-optimized hardware IP is available to global chip manufacturers for license. aiWare, built from the

AImotive Releases aiWare: The First of Its Kind, AI-Optimized Hardware Accelerator For Autonomous Driving Read More +

Rockchip

PiSoft Partners with Rockchip and CEVA to Develop 360 Degree Panoramic Camera Solution

SHANGHAI, June 27, 2017 /PRNewswire/ — Mobile World Congress – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, together with Pisoftware Technology Co., Ltd. ("PiSoft"), today announced that PiSoft has developed a complete 360 degree panoramic camera solution for ODMs and OEMs. The solution utilizes the Rockchip RV1108

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ArcSoft and CEVA Partner to Raise the Performance Level of Smartphone Cameras

SHANGHAI, June 27, 2017 /PRNewswire/ — Mobile World Congress — CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, and ArcSoft, the global leader of image-intelligent technologies, announced today that the companies have collaborated to develop an optimized implementation of ArcSoft's suite of image enhancement technologies for the CEVA

ArcSoft and CEVA Partner to Raise the Performance Level of Smartphone Cameras Read More +

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