Major update includes dozens of new features and closer alignment with ISO C++. Significant SYCL adoption in embedded, desktop, and HPC markets. Beaverton, OR – February 9, 2021 – Today, The Khronos® Group, an open consortium of industry-leading companies creating advanced interoperability standards, announces the ratification and public release of the SYCL™ 2020 final specification—the […]
Khronos Releases SYCL 2020 Specification Read More +
On March 30, 2021 at 9 am PT (noon ET), Marc Courtemanche, Product Architect at Algolux, will present the free half-hour webinar “Optimizing a Camera ISP to Automatically Improve Computer Vision Accuracy,” organized by the Edge AI and Vision Alliance. Here’s the description, from the event registration page: Cameras are the most ubiquitous sensor used
Free Webinar Explores Camera ISP Optimization For Improved Computer Vision Accuracy Read More +
On March 25, 2021 at 9 am PT (noon ET), Diptesh Nandi, Product Marketing Manager in the FPGA Business Unit at Microchip Technology, will present the free half-hour webinar “Enabling Small Form Factor, Anti-tamper, High-reliability, Fanless Artificial Intelligence and Machine Learning,” organized by the Edge AI and Vision Alliance. Here’s the description, from the event
February 3, 2021 – The National Energy Research Scientific Computing Center (NERSC) at Lawrence Berkeley National Laboratory (Berkeley Lab), in collaboration with the Argonne Leadership Computing Facility (ALCF) at Argonne National Laboratory, has signed a contract with Codeplay Software to enhance the LLVM SYCL™ GPU compiler capabilities for NVIDIA® A100 GPUs. This collaboration will help
Codeplay, NERSC, ALCF Partner on SYCL Read More +
February 01, 2021–PARIS & TOKYO–(BUSINESS WIRE)–GrAI Matter Labs (GML), a pioneer of brain-inspired ultra-low latency computing, and Digital Media Professionals (DMP), a leading developer of Edge AI solutions, today announced the companies’ partnership to showcase a novel virtual AI Sports Coaching Application at the docomo Open House 2021 to be held online from February 4
GML and DMP Partner to Showcase Virtual AI Sports Coach at docomo Open House Read More +
On March 11, 2021 at 9 am PT (noon ET), Christian Graber, Director of Platform Architecture at GrAI Matter Labs, will present the free half-hour webinar “Brain-inspired Processing Architecture Delivers High Performance, Energy-efficient, Cost-effective AI,” organized by the Edge AI and Vision Alliance. Here’s the description, from the event registration page: If a picture is
Free Webinar Explores High Performance, Energy-efficient, Cost-effective AI Processing Read More +
Today is an important step for Opteran Technologies as we announce the Opteran Development Kit version 2 (ODK-2) and begin on the road to commercialising what we believe will be a radically different approach to artificial intelligence. As you may have seen from a previous post by our Chief Scientific Officer, James Marshall, we are
Launch of Opteran Development Kit – Bringing Natural Intelligence to AI Read More +
On March 23, 2021 at 9 am PT (noon ET), Bibek Chaudhary, research engineer at Nota, will present the free half-hour webinar “Selecting and Combining Deep Learning Model Optimization Techniques for Enhanced On-device AI,” organized by the Edge AI and Vision Alliance. Here’s the description, from the event registration page: Model optimization techniques such as
Knowledge platform for topics related to image processing with 2D, 3D and AI January 21, 2020 – “Knowledge increases when it is shared” – following this maxim, IDS is making its expertise as one of the leading manufacturers of digital industrial cameras free of charge and directly accessible on a new platform. In addition to
IDS Vision Channel – Platform for Digital Live Sessions and Networking Read More +
MediaTek also announces Dimensity 1100 5G chipset to give device makers even more design flexibility HSINCHU, Taiwan – January 20, 2021 – MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6nm Dimensity 1200 and 1100 chipsets
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596
