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eYs3D Microelectronics

CES 2024: eYs3D’s New Edge AI Chips Transforming Computer Vision for Robotics

eYs3D Microelectronics, News, Robotics /

New AI-dedicated eCV series SoCs with ARM-based CPUs elevate AI capabilities for advanced autonomous robots, smart home, and industrial IoT solutions; launch is key milestones for brand as it embraces “AI+” concept and expands offering LAS VEGAS, Nev. and TAIPEI, Jan. 5, 2024 /PRNewswire/ — Known as a leader in 3D sensing and computer vision semiconductors under […]

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eYs3D Launches One-stop XINK Development Platform for Vision-equipped Robots

eYs3D Microelectronics, News, Robotics, Sensors /

The Platform-as-a-Service Uses SoM (System on Module) with the New 4 Multi-Core ARM CPU and 4.6 TOPS AI Data Processor to Speed Design LAS VEGAS and TAIPEI, Taiwan, Jan. 3, 2023 /PRNewswire/ — eYs3D Microelectronics, a subsidiary of Etron Technology (TPEx: 5351. TW), a subsidiary of Etron Technology (TPEx: 5351. TW), launched at CES a state-of-the-art computer vision development

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STMicroelectronics and eYs3D Microelectronics to Showcase Collaboration on High-quality 3D Stereo-vision Camera for Machine Vision and Robotics at CES 2023

eYs3D Microelectronics, Industrial Vision (Computer Vision), News, Sensors, STMicroelectronics /

Companies will demonstrate 3D depth vision through stereo cameras fusion for fast-motion object tracking in AIoT and autonomous guided robots and industrial devices Reference designs leverage ST’s high-performance, near-infrared, global-shutter image sensors to ensure best quality depth sensing and point-cloud creation 02 Jan 2023 | Geneva, Switzerland, and Taipei, Taiwan | STMicroelectronics (NYSE: STM), a

STMicroelectronics and eYs3D Microelectronics to Showcase Collaboration on High-quality 3D Stereo-vision Camera for Machine Vision and Robotics at CES 2023 Read More +

eYs3D Microelectronics Demonstration of Stereo Vision for Robotic Automation and Depth Sensor Fusion

Algorithms, eYs3D Microelectronics, Processors, Robotics, Sensors, Software, Summit 2021, Tools, Videos /

James Wang, Technical General Manager at eYs3D Microelectronics, demonstrates the company’s latest edge AI and vision technologies and products at the 2021 Embedded Vision Summit. Specifically, Wang demonstrates stereo vision for robotic automation and depth sensor fusion. Depth-sensing technology is now being widely adopted commercially in various consumer and industrial products. It’s commonly recognized that

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eCapture from eYs3D Microelectronics Launches Smallest Form Factor 3D Stereo Depth Sensing Camera for Robotics and Object Tracking

eYs3D Microelectronics, Industrial Vision (Computer Vision), News, Robotics, Sensors /

eCapture™️ Cameras leverage eYs3D stereo vision technology and high-performance vision processor in this new line of devices SANTA CLARA, CA / ACCESSWIRE / August 23, 2021 / eCapture, a brand focused on developing technology for the growing computer vision market, today is introducing the smallest form factor stereoscopic 3D depth sensing camera. The new LifeSense™

eCapture from eYs3D Microelectronics Launches Smallest Form Factor 3D Stereo Depth Sensing Camera for Robotics and Object Tracking Read More +

Blaize and eYs3D Microelectronics Unveil New Reference Design for Enhanced 3D Computer Vision for Edge AI

Blaize, eYs3D Microelectronics, News, Processors, Sensors /

El Dorado Hills, CA — June 28, 2021 — Blaize, the AI computing innovator revolutionizing edge and automotive computing solutions, and eYs3D Microelectronics, the image processor solution provider enabling enhanced 3D computer vision for edge AI, today announced a reference design for the Blaize Pathfinder P1600 SoM (system on a module). The Blaize Pathfinder P1600

Blaize and eYs3D Microelectronics Unveil New Reference Design for Enhanced 3D Computer Vision for Edge AI Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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