Taisik Won, the President of DEEPX USA, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Won demonstrates the company’s AIoT Booster, the DX-M1. The DX-M1 is DEEPX’s flagship AI chip, meticulously engineered for seamless integration into any AIoT application. This cutting-edge chip can simultaneously process […]
DEEPX Demonstration of Its DX-M1 AIoT Booster Read More +
Aiden Song, PR Manager at DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Song demonstrates the company’s DX-V1 and DX-V3 AI vision processors. The DX-V1 and DX-V3 are AI enabler chips for vision systems. The DX-V1 is a standalone edge AI chip that can
DEEPX Demonstration of Its DX-V1 and DX-V3 AI Vision Processors Read More +
Aiden Song, PR Manager at DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2024 Embedded Vision Summit. Specifically, Song demonstrates the company’s latest innovation, the DX-H1 Green AI Computing Card. The DX-H1 is designed for eco-friendly data centers, delivering 10 times better power and cost efficiency than GPGPU solutions.
DEEPX Demonstration of Its DX-H1 Green AI Computing Card Read More +
SEOUL, South Korea, May 10, 2024 /PRNewswire/ — DEEPX, a prominent AI semiconductor technology startup under the leadership of CEO Lokwon Kim, is delighted to announce the successful conclusion of its Series C funding round, amassing $80.5M (KRW 110B). Led by esteemed private equity firms, this significant financial investment will accelerate the mass production of
Korean Semiconductor Industry Titans Back DEEPX in Series C Funding Round Read More +
Award-winning on-device AI chipmaker will pursue key industry partnerships to bolster this expansion; following a strong showing at ISC West, it will continue this momentum at Secutech Taipei, Embedded Vision Summit, and COMPUTEX 2024. TAIPEI and SEOUL, South Korea, April 23, 2024 /PRNewswire/ — DEEPX, an on-device AI semiconductor company, is announcing plans to expand
All-in-4 AI Total Solution comprises four chips spanning various performance levels, each with different features and interfaces optimized for diverse edge applications. After demonstrating the originality of its technology with engineering products last year, DEEPX conducted pre-production verification for over 40 global companies through its EECP program this year. Slated to significantly impact the on-device
Lokwon Kim represents global AI chip companies at a panel on innovations enabling the on-device AI era DEEPX CEO Lokwon Kim will discuss timing and plans for on-device AI at CES 2024 panel DEEPX to exhibit ultra-low power AI chip solutions in North Hall, Booth #8953 LAS VEGAS and SEOUL, South Korea, Jan. 8, 2024
DEEPX CEO Lokwon Kim to Speak at CES 2024 Panel on the Future of AI Hardware and Chips Read More +
World’s only AI accelerator that combines low power, high performance, high efficiency, and cost-effectiveness hits new milestone of deployment to over 40 global companies DX-M1 AI chip has surpassed 40 global customers who are trialing it as part of DEEPX’s Early Engagement Customer Program, which has garnered significant interest from companies across robotics, autonomous vehicles,
DEEPX’s DX-M1 Chip Recognized at CES 2024 as Leading AI of Things Solution Read More +
The award-winning AI booster achieves over 10 times power-to-performance efficiency compared to GPUs LAS VEGAS, Dec. 20, 2023 /PRNewswire/ — DEEPX (CEO, Lokwon Kim), an original AI semiconductor technology company, is set to make waves at CES 2024 by introducing the DX-H1 — a cutting-edge PCIe card designed to accelerate AI server performance while reducing
Korean fabless startup unleashes world’s most innovative AI chip technology — ultra-gap source technology DEEPX is honored with three CES Innovation Awards 2024 in its core focus areas: Computer Hardware, Embedded Technology, and Robotics. The brand is a fabless AI chipmaker with world-leading innovation in cutting-edge source technologies — specifically ultra-gap source technology. SEOUL, South Korea
DEEPX Honored with Three CES Innovation Awards 2024 for Leading-edge AI Chip Tech Read More +
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596
