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DEEPX

DEEPX Unveils ‘All-in-4 AI Total Solution’ at CES 2024: Four AI Chips Transforming the On-device AI Market

All-in-4 AI Total Solution comprises four chips spanning various performance levels, each with different features and interfaces optimized for diverse edge applications. After demonstrating the originality of its technology with engineering products last year, DEEPX conducted pre-production verification for over 40 global companies through its EECP program this year. Slated to significantly impact the on-device […]

DEEPX Unveils ‘All-in-4 AI Total Solution’ at CES 2024: Four AI Chips Transforming the On-device AI Market Read More +

DEEPX CEO Lokwon Kim to Speak at CES 2024 Panel on the Future of AI Hardware and Chips

Lokwon Kim represents global AI chip companies at a panel on innovations enabling the on-device AI era DEEPX CEO Lokwon Kim will discuss timing and plans for on-device AI at CES 2024 panel DEEPX to exhibit ultra-low power AI chip solutions in North Hall, Booth #8953 LAS VEGAS and SEOUL, South Korea, Jan. 8, 2024

DEEPX CEO Lokwon Kim to Speak at CES 2024 Panel on the Future of AI Hardware and Chips Read More +

DEEPX’s DX-M1 Chip Recognized at CES 2024 as Leading AI of Things Solution

World’s only AI accelerator that combines low power, high performance, high efficiency, and cost-effectiveness hits new milestone of deployment to over 40 global companies DX-M1 AI chip has surpassed 40 global customers who are trialing it as part of DEEPX’s Early Engagement Customer Program, which has garnered significant interest from companies across robotics, autonomous vehicles,

DEEPX’s DX-M1 Chip Recognized at CES 2024 as Leading AI of Things Solution Read More +

DEEPX Making High-performance, Low-power AI Servers a Reality with DX-H1 Launch at CES 2024

The award-winning AI booster achieves over 10 times power-to-performance efficiency compared to GPUs LAS VEGAS, Dec. 20, 2023 /PRNewswire/ — DEEPX (CEO, Lokwon Kim), an original AI semiconductor technology company, is set to make waves at CES 2024 by introducing the DX-H1 — a cutting-edge PCIe card designed to accelerate AI server performance while reducing

DEEPX Making High-performance, Low-power AI Servers a Reality with DX-H1 Launch at CES 2024 Read More +

DEEPX Honored with Three CES Innovation Awards 2024 for Leading-edge AI Chip Tech

Korean fabless startup unleashes world’s most innovative AI chip technology — ultra-gap source technology DEEPX is honored with three CES Innovation Awards 2024 in its core focus areas: Computer Hardware, Embedded Technology, and Robotics. The brand is a fabless AI chipmaker with world-leading innovation in cutting-edge source technologies — specifically ultra-gap source technology. SEOUL, South Korea

DEEPX Honored with Three CES Innovation Awards 2024 for Leading-edge AI Chip Tech Read More +

DEEPX Demonstration of Empowering Smart Camera and Robotics Applications with Edge AI Chip Technology

Tim Park, director of strategic marketing for DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Park demonstrates how DEEPX’s edge AI chips enhance AI capabilities in existing product designs. In one of the demos, Park shows the simultaneous operation of multiple AI models. Explore

DEEPX Demonstration of Empowering Smart Camera and Robotics Applications with Edge AI Chip Technology Read More +

DEEPX Demonstration of Revolutionizing Automotive and Smart City Applications with Edge AI Technology

Tim Park, director of strategic marketing for DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Park demonstrates real-time applications of DEEPX’s edge AI chip technology in the automotive and smart city sectors. Park shows how DEEPX’s low power, high performance AI technology enhances driving

DEEPX Demonstration of Revolutionizing Automotive and Smart City Applications with Edge AI Technology Read More +

DEEPX Demonstration of Its Product Portfolio for Empowering Edge AI Solutions

Tim Park, director of strategic marketing for DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Park demonstrates DEEPX’s comprehensive product portfolio. With a range of edge AI chips targeting various applications, from low power to high performance, DEEPX offers compelling solutions with a strong

DEEPX Demonstration of Its Product Portfolio for Empowering Edge AI Solutions Read More +

DEEPX Demonstration of Empowering Edge AI Technology with Flexibility, Accuracy and Power Efficiency

Jay Kim, EVP of Technology for DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Kim demonstrates the key features embedded in DEEPX’s edge AI chip technology. Kim outlines its improved flexibility, accuracy, and power/performance efficiency, attributes that enable businesses to access vital data for

DEEPX Demonstration of Empowering Edge AI Technology with Flexibility, Accuracy and Power Efficiency Read More +

DEEPX Demonstration of Simplifying Software Development with DEEPX’s Two-step SDK

Jay Kim, EVP of Technology for DEEPX, demonstrates the company’s latest edge AI and vision technologies and products at the 2023 Embedded Vision Summit. Specifically, Kim demonstrates the simplicity of using DEEPX’s software development kit (SDK). Kim shows how to choose a target application and select an AI software framework in just two easy steps.

DEEPX Demonstration of Simplifying Software Development with DEEPX’s Two-step SDK Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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