7/28/21 – FRAMOS offers camera data transfer over a single coax cable using the GMSL2 protocol on the Jetson AGX Xavier platform. Camera developers utilizing the FRAMOS Sensor Module Ecosystem can integrate the highly flexible GMSL2 technology with image sensors producing up to 8MP resolution at 30fps over cable length of 15m. Developers benefit from […]
July 28, 2021 – For proof of concept, rapid prototyping and small series production, AU-Zone and Toradex, working in close cooperation with Vision Components, have developed the modular Maivin i.MX 8M Plus AI Vision Kit. The developer kit is based on a Toradex Verdin i.MX 8M Plus System-on-Module and a carrier board, which AU-Zone designed
New Offering Enables Low-Power Voice-Controlled Operation of Embedded Vision AI Systems in IoT and Edge Applications TOKYO, Japan, and Irvine, Calif., July 28, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Syntiant Corp., a deep learning chip technology company advancing low-power intelligent voice and sensor processing in edge devices,
Renesas and Syntiant Develop Voice-Controlled Multimodal AI Solution Read More +
On September 28, 2021 at 9 am PT (noon ET), Mike Hendrick, Vice President of Engineering, Larry O’Connell, Vice President of Marketing, and Phil Attfield, CEO, all of Sequitur Labs, will present the free hour webinar “Securing Smart Devices: Protecting AI Models at the Edge,” organized by the Edge AI and Vision Alliance. Here’s the
Free Webinar Explores How to Protect AI Models at the Edge Read More +
MAX78000 AI microcontroller and Xailient’s Detectum neural network detects and localizes faces in video and images at just 12ms per inference SAN JOSE, Calif., July 27, 2021 /PRNewswire/ — Maxim Integrated Products, Inc. (NASDAQ: MXIM) and Xailient Inc., a company focused on artificial intelligence (AI) for the edge, today announced that Maxim Integrated’s MAX78000 ultra-low
SoC provides personal computing devices with powerful performance and advanced 5G connectivity, multimedia and gaming technologies HSINCHU, Taiwan – July 27, 2021 – MediaTek today announced the launch of its Kompanio 1300T, a SoC designed to power incredible experiences across computing devices. Built on the leading 6nm process technology, the chip is bringing premium performance to
Franklin Templeton and Temasek lead Blaize $71m Series D funding aimed at acceleration of AI Edge Computing and Automotive/EV product roadmap El DORADO HILLS, CA — July 27, 2021 — Blaize, the AI computing innovator revolutionizing edge and automotive computing solutions, today announced the close of a $71m Series D round of funding. Franklin Templeton,
Geneva, July 26, 2021 – STMicroelectronics has expanded the variety of machine-learning techniques available to users of the STM32Cube.AI development environment, giving extra flexibility to solve classification, clustering, and novelty-detection challenges as efficiently as possible. In addition to enabling development of neural networks for edge inference on STM32* microcontrollers (MCUs), the latest STM32Cube.AI release (version
Sheffield, UK 23rd July 2021 Mindtech Global, developer of the world’s leading end-to-end synthetic data creation platform for training AI vision systems – today announced closing a $3.25 million funding round. The round was led by NPIF – Mercia Equity Finance, which is managed by Mercia and is part of the Northern Powerhouse Investment Fund
Teledyne expands its camera portfolio with new high-resolution Lt Series USB3 cameras for use in diverse machine vision applications Ottawa, CANADA, July 22, 2021 – Teledyne is pleased to announce the release of its new Lt Series USB3 high resolution cameras. With robust enclosures and fully locking USB3 connectors, these new cameras are built for
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Berkeley Design Technology, Inc.
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