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In Series Production: Basler MED ace Camera Compliant with DIN EN ISO 13485:2016

Basler, News /

The specially developed Basler MED Feature Sets combine hardware, firmware and software features Ahrensburg, March 5, 2019 – The first models of the Basler MED ace camera series, produced in accordance with DIN EN ISO 13485:2016, have now entered series production (2 MP and 5 MP resolution). The camera series includes Basler’s first cameras specifically […]

In Series Production: Basler MED ace Camera Compliant with DIN EN ISO 13485:2016 Read More +

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Next-generation Armv8.1-M Architecture: Delivering Enhanced Machine Learning and Signal Processing for the Smallest Embedded Devices

Arm, News /

February 14, 2019 – News highlights: Arm Helium technology is a new M-Profile Vector Extension bringing enhanced compute capabilities to the Armv8.1-M architecture Delivering up to 15x performance uplift for machine learning and up to 5x uplift to signal processing tasks on the smallest of edge devices For next-generation Cortex-M processors, aimed at small, embedded

Next-generation Armv8.1-M Architecture: Delivering Enhanced Machine Learning and Signal Processing for the Smallest Embedded Devices Read More +

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Qualcomm Launches New Platform Aimed to Transform the Robotics Industry

News, Qualcomm /

Qualcomm® Robotics RB3 Platform is Designed to Help Manufacturers and Developers Create a New Wave of Innovative, Smart, Power-Efficient Consumer, Enterprise, and Industrial Robots Feb 25, 2019 – Barcelona – Qualcomm Technologies, Inc. a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), today announced its Qualcomm Robotics RB3 Platform – the Company’s first integrated, comprehensive offering designed

Qualcomm Launches New Platform Aimed to Transform the Robotics Industry Read More +

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Artificial Intelligence Engine in Qualcomm Snapdragon 855 Mobile Platform Powers On-Device AI User Experiences in Flagship Premium-Tier Smartphones

News, Qualcomm /

Qualcomm AI Software and Cloud Ecosystem Expands to Satisfy Increasing Demand for Intelligent and Immersive Real-time Mobile AI Features Feb 25, 2019 – Barcelona – At Mobile World Congress, Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), announced that the 4th Generation Qualcomm® Artificial Intelligence (AI) Engine is supporting the surge of on-device

Artificial Intelligence Engine in Qualcomm Snapdragon 855 Mobile Platform Powers On-Device AI User Experiences in Flagship Premium-Tier Smartphones Read More +

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Qualcomm Enables The Next Generation of Immersive Compute with Ecosystem Collaboration for XR Viewers for 5G Smartphones

News, Qualcomm /

Company and Top Mobile Ecosystem Players Come Together to Deliver XR Viewers Tethered to Compatible Qualcomm Snapdragon 855 Smartphones Feb 25, 2019 – Barcelona – Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM) announced today at Mobile World Congress, broad ecosystem support from world-leading OEMs, operators, and platform providers to deliver the next

Qualcomm Enables The Next Generation of Immersive Compute with Ecosystem Collaboration for XR Viewers for 5G Smartphones Read More +

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Featuring Infineon’s Time-of-Flight Technology, LG’s Smartphone G8ThinQ Securely Recognizes Your Face

Infineon, News /

Munich, Germany – 24 February 2019 – In a market where it is difficult for manufacturers to differentiate their products, the new 2019 LG G8 ThinQ is about to turn the tide. For the first time, a smartphone with a dedicated user-facing time-of-flight (ToF) camera is entering the mass market. Highly secure authentication for both

Featuring Infineon’s Time-of-Flight Technology, LG’s Smartphone G8ThinQ Securely Recognizes Your Face Read More +

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LG and Infineon to Introduce LG G8ThinQ with Front-facing Time-of-Flight Camera

Infineon, News /

With Infineon’s REAL3™ Image Sensor Chip, LG Offers Enhanced Security and Depth Measuring Selfie Camera Munich, Germany, and Seoul, Korea, 7 February 2019 – LG Electronics and Infineon Technologies AG have teamed up to introduce leading edge Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over. Infineon’s REAL3™ image sensor chip will play a

LG and Infineon to Introduce LG G8ThinQ with Front-facing Time-of-Flight Camera Read More +

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Xnor Appoints Mobile Computing Expert to Principal Engineer

News, Xnor.ai /

Matt Welsh will help guide development of Xnor’s AI-on-the-edge platform SEATTLE, Feb. 21, 2019 (GLOBE NEWSWIRE) — Xnor, the company that is making AI available on every device, has appointed Matt Welsh to the position of principal engineer. Welsh joins Xnor from Google, where he was an engineering lead on the Chrome Mobile team for

Xnor Appoints Mobile Computing Expert to Principal Engineer Read More +

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Embedded Vision Alliance Announces Two Hands-On Training Classes for Computer Vision and Visual AI

Edge AI and Vision Alliance, News /

SANTA CLARA, Calif., Feb. 21, 2019 /PRNewswire/ — The Embedded Vision Alliance today announced an updated Deep Learning for Computer Vision with TensorFlow 2.0 training class and an all-new class on Computer Vision Applications in OpenCV. These full-day, hands-on training courses will be held May 20, 2019 in conjunction with the eighth annual Embedded Vision

Embedded Vision Alliance Announces Two Hands-On Training Classes for Computer Vision and Visual AI Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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