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Andes Technology Advances High-performance RISC-V Strategy with U.S.-based Design Center: Condor Computing

San Jose, CA – July 7, 2025 – Andes Technology (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099), the leading supplier of high-efficiency, low-power 32/64-bit RISC-V processor cores and founding premier member of RISC-V International, today announced a major milestone in its U.S. expansion through Condor Computing, a wholly owned subsidiary based in Austin, Texas. Condor Computing was established […]

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Nota AI Collaborates with Renesas on High-efficiency Driver Monitoring AI for RA8P1 Microcontroller

AI model optimization powers high-efficiency DMS on ultra-compact MCUs 50FPS real-time performance with ultra-low power and minimal system footprint SEOUL, South Korea, July 2, 2025 /PRNewswire/ — Nota AI, a global leader in AI optimization, today announced a collaboration with Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, to deliver an optimized Driver Monitoring

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Chips&Media’s New APV CODEC Delivers Extreme Visual Quality to the Android Industry

Advanced Professional Video CODEC from Chips&Media is now on its way to the Android industry to enable extreme image quality as well as professional video experience in capture, playback, and edit use-cases in APV ecosystem. Key notes: New CODEC for professional video experience, in healthy competition with ProRes in iOS Ideal for edge devices even

Chips&Media’s New APV CODEC Delivers Extreme Visual Quality to the Android Industry Read More +

Renesas Sets New MCU Performance Bar with 1-GHz RA8P1 Devices with AI Acceleration

Single- and Dual-Core MCUs Combine Arm Cortex-M85 and M33 Cores with Arm Ethos-U55 NPU to Deliver Superior AI Performance up to 256 GOPs Unprecedented 7300+ CoreMarks[1] with Dual Arm CPU cores TSMC 22ULL Process Delivers High Performance and Low Power Consumption Embedded MRAM with Faster Write Speeds and Higher Endurance and Retention Dedicated Peripherals Optimized

Renesas Sets New MCU Performance Bar with 1-GHz RA8P1 Devices with AI Acceleration Read More +

FRAMOS and Toradex Strengthen Partnership to Simplify Embedded Vision Development

Enhanced integration between Toradex’s System-on-modules (SoMs) and FRAMOS Camera Modules simplifies the prototyping and development of embedded vision systems based on NXP processors. Munich – June 30th 2025 – Embedded system engineers and architects, as well as technical team leads in robotics, IoT, medical, and industrial applications, can now benefit from a simplified approach to

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Free Webinar Explores Infrared Image Sensor Trends and Applications

On September 23, 2025 at 9 am PT (noon ET), the Yole Group’s Axel Clouet, Ph.D., senior market and technology analyst for imaging, will present the free hour webinar “Infrared Imaging: Technologies, Trends, Opportunities and Forecasts,” organized by the Edge AI and Vision Alliance. Here’s the description, from the event registration page: Infrared (IR) cameras

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VeriSilicon Expands DSP Portfolio with Silicon-proven ZSP5000 Vision Core Series for Edge Intelligence

Highly scalable architecture optimized for computer vision and image workloads with extendable instruction set Shanghai, China, June 26, 2025–VeriSilicon (688521.SH) today released the ZSP5000 Digital Signal Processing (DSP) series IPs, which are based on its fifth-generation silicon-proven DSP architecture. This product line adopts a highly scalable and energy-efficient design, and has been deeply optimized for

VeriSilicon Expands DSP Portfolio with Silicon-proven ZSP5000 Vision Core Series for Edge Intelligence Read More +

Vision Components at Sensors Converge: VC MIPI Cameras with Cables Up to 10 Meters

Ettlingen, June 18, 2025.  At Sensors Converge, June 24-26 in Santa Clara, CA, Vision Components presents its modular VC MIPI Bricks system with new micro-coax and GMSL2 cable options. They enable to build MIPI-based embedded vision systems with cable lengths of up to 10 meters between the camera module and processor board. The new micro-coax

Vision Components at Sensors Converge: VC MIPI Cameras with Cables Up to 10 Meters Read More +

ImagingNext: New Leading Event for Embedded Vision Starts in September

This year’s focus: AI-Driven Vision: Shaping the Future of Smart Imaging. Munich – June 17th 2025 – The imaging community has a new flagship event that offers vision experts exclusive insights into the latest developments: On September 18, FRAMOS will host ImagingNext, a two-day conference in Munich’s Bogenhausen district at Smartvillage. This year’s conference will

ImagingNext: New Leading Event for Embedded Vision Starts in September Read More +

STMicroelectronics Introduces Advanced Human Presence Detection Solution to Enhance Laptop and PC User Experience

New technology delivers more than 20% power consumption reduction per day in addition to improved security and privacy ST solution combines market leading Time-of-Flight (ToF) sensors and unique AI algorithms for a seamless user experience Geneva, Switzerland, June 17, 2025 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics

STMicroelectronics Introduces Advanced Human Presence Detection Solution to Enhance Laptop and PC User Experience Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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