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Chips&Media Accelerates WAVE-N Ecosystem: Redefining the Future of Next-Generation Customized NPUs

February 24, 2026, Seoul, — As a premier multimedia IP provider, Chips&Media is proud to announce the strategic expansion of the WAVE-N ecosystem – our next-generation customized NPU architecture. Key Objectives: Strategic Partnerships: Cultivating alliances with leading AI-based imaging network providers IP Integration: Merging our silicon-proven WAVE-N IP with pre-evaluated, high-performance AI networks Customer-Centric Innovation: Providing clients with access to […]

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HCLTech unveils VisionX 2.0, a next-gen multi-modal AI Edge Platform with NVIDIA

Noida, India, February 20, 2026 — HCLTech, a leading global technology company, today unveiled VisionX 2.0, an upgraded version of its multi-modal AI edge platform. This platform delivers real-time intelligence, enhanced safety and operational efficiency at scale for mission-critical industrial environments. VisionX 2.0 builds on HCLTech’s award-winning Intelligent Secure Edge capabilities, integrating advanced computer vision, vision language

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Ambarella to Showcase “The Ambarella Edge: From Agentic to Physical AI” at Embedded World 2026

Enabling developers to build, integrate, and deploy edge AI solutions at scale SANTA CLARA, Calif., — Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced that it will exhibit at Embedded World 2026, taking place March 10-12 in Nuremberg, Germany. At the show, Ambarella’s theme, “The Ambarella Edge: From Agentic to Physical AI,”

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Vision Components unveils all-in-one VC EvoCam with MediaTek processor

Ettlingen, February 18, 2026 — Vision Components is presenting the VCSBC EvoCam for the first time at embedded world, a new generation of all-in-one intelligent board-level cameras featuring the MediaTek Genio 510 processor. Measuring tiny 65 x 40 mm, the camera is equipped with all necessary components for image acquisition and image processing, making the

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e-con Systems Launches DepthVista Helix 3D CW iToF Camera for Robotics and Industrial Automation

California & Chennai (February 17, 2026): e-con Systems, a global leader in embedded vision solutions, launches DepthVista Helix 3D CW iToF Camera, a high-performance depth camera engineered to deliver reliable and accurate 3D perception for wide range of industrial robotics applications, including Autonomous Mobile Robots (AMRs), pick-and-place, bin-picking, palletization and depalletization robots, industrial safety and automation, and

e-con Systems Launches DepthVista Helix 3D CW iToF Camera for Robotics and Industrial Automation Read More +

Upcoming Webinar on CSI-2 over D-PHY & C-PHY

On February 24, 2026, at 9:00 am PST (12:00 pm EST) MIPI Alliance will deliver a webinar “MIPI CSI-2 over D-PHY & C-PHY: Advancing Imaging Conduit Solutions” From the event page: MIPI CSI-2®, together with MIPI D-PHY™ and C-PHY™ physical layers, form the foundation of image sensor solutions across a wide range of markets, including

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Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making

Chandler, Ariz., February 10, 2026 — A major next step for artificial intelligence (AI) and machine learning (ML) innovation is moving ML models from the cloud to the edge for real-time inferencing and decision-making applications in today’s industrial, automotive, data center and consumer Internet of Things (IoT) networks. Microchip Technology (Nasdaq: MCHP) has extended its edge AI offering

Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making Read More +

Upcoming Webinar on Industrial 3D Vision with iToF Technology

On February 18, 2026, at 9:00 am PST (12:00 pm EST), and on February 19, 2026 at 11:00 am CET, Alliance Member company e-con Systems in partnership with onsemi will deliver a webinar “Enabling Reliable Industrial 3D Vision with iToF Technology” From the event page: Join e-con Systems and onsemi for an exclusive joint webinar

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Google Adds “Agentic Vision” to Gemini 3 Flash

Jan. 30, 2026 — Google has announced Agentic Vision, a new capability in Gemini 3 Flash that turns image understanding into an active, tool-using workflow rather than a single “static glance.” Agentic Vision pairs visual reasoning with code execution (Python) so the model can iteratively zoom in, crop, annotate, and otherwise manipulate an image to

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Robotics Builders Forum offers Hardware, Know-How and Networking to Developers

On February 25, 2026 from 8:30 am to 5:30 pm ET, Advantech, Qualcomm, Arrow, in partnership with D3 Embedded, Edge Impulse, and the Pittsburgh Robotics Network will present Robotics Builders Forum, an in-person conference for engineers and product teams. Qualcomm and D3 Embedded are members of the Edge AI and Vision Alliance, while Edge Impulse

Robotics Builders Forum offers Hardware, Know-How and Networking to Developers Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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