This market research report was originally published at Yole Group’s website. It is reprinted here with the permission of Yole Group. EEL: A $7.4 billion market opportunity in 2027 to create integrated photonics. OUTLINE The EEL market will be worth about US$7.4 billion in 2027. Understanding application requirements and evaluating laser parameters are necessary to […]
Edge-emitting Laser: Blinded By the Lights Read More +
Quadrant Knowledge Solutions’ SPARK Matrix™ provides competitive analysis & ranking of the leading Product Engineering Services (PES) vendors. VVDN Technologies, with its comprehensive technology in PES and customer experience management, has received strong ratings across the parameters of service excellence and customer impact. 14th December 2022: Quadrant Knowledge Solutions announced today that it has named
Gurugram, 18th October, 2022: VVDN Technologies, a global provider of engineering, and digital services and solutions, today announced it has entered into a multi-year global strategic partnership with Google Cloud. The partnership will help customers accelerate app modernization and cloud transformation. VVDN will also develop the next generation of innovative solutions, namely IoT and Video
VVDN to Set Up CoE through Global Strategic Partnership with Google Cloud Read More +
Delivers AIoT (Artificial Intelligence of Things) edge technology for autonomous driving, robotics, and mobility AI vision surveillance management EL DORADO HILLS, CA — December 13, 2022 —Blaize® today announced a multi-year Memorandum of Understanding with Korea Telecom (KT) — Korea’s leading AI, big data, and cloud service provider. The strategic collaboration brings AIoT (Artificial Intelligence
Aimed at AI/ML applications in automotive, industrial, 5G networks and handsets, surveillance cameras, and Edge Compute NeuPro-M awarded as ‘Most Promising Product’ 3rd generation NeuPro AI/ML architecture offers scalable performance of 20 to 1,200 TOPS at SoC and Chiplet levels, lowers memory bandwidth by 6X ROCKVILLE, MD – December 13, 2022 – CEVA, Inc. (NASDAQ: CEVA),
CEVA NeuPro-M Edge AI Processor Architecture Recognized at EE Awards Asia 2022 Read More +
Hannover, Germany, December 13, 2022 – videantis GmbH, provider of a unified platform for combined processing of algorithms as diverse as AI (Artificial Intelligence), multi-modal sensor data processing and fusion, or video coding on a single architecture, today announced the tape-out of the FlexAISIC AI chip based on its flexible v-MP6000UDX unified processing platform. The
KI-FLEX AI Chip Tapes Out With Flexible videantis Processor Platform Read More +
Ultra-Low-Power Chip Provider Recognized for Breakthroughs in Edge AI Solutions Irvine, Calif., December 12, 2022 — Syntiant Corp., a provider of deep learning solutions for always-on edge AI voice, sensor and vision applications, today announced that the company was named 2022’s “Start-Up to Watch” during this year’s Global Semiconductor Alliance (GSA) Awards. Syntiant was selected
Syntiant Named 2022’s ‘Start-Up to Watch’ by the Global Semiconductor Alliance Read More +
Laguna Hills, Calif. – December 11, 2022 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power neuromorphic AI IP, today announced that it has become a member of the Intel Foundry Services (IFS) ecosystem alliance to help advance innovation on Intel’s foundry manufacturing platform. BrainChip is
BrainChip Joins Intel Foundry Services to Advance Neuromorphic AI at the Edge Read More +
Popular restaurant chain selects Teledyne’s Genie Nano cameras for its sports themed VR restaurants Waterloo, CANADA ─December 8, 2022 ─ Teledyne DALSA is pleased to announce that TOCA Social, the world’s first soccer and dining experience, has chosen Teledyne DALSA Genie Nano cameras to enable the capture of play in its interactive soccer based competitive socializing
Teledyne Cameras Enable VR Play at TOCA Social Read More +
HSINCHU, Taiwan – December 1, 2022 – MediaTek today announced the Dimensity 8200, the company’s newest chipset for premium 5G smartphones. Smartphones powered by the Dimensity 8200 will offer flagship level experiences – including connectivity, gaming, multimedia, displays and imaging – at a more accessible price point. Built on the 4nm-class process, the new chipset
MediaTek’s New Dimensity 8200 Upgrades Experiences on Premium 5G Smartphones Read More +
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